US4013612A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Epoxy composition for encasing semiconductor devices
Assignee: Panasonic Holdings Corp
•
Filing: 1975-10-15
•
Granted: 1977-03-22
•
Expires: 1995-10-15
Abstract
Abstract An epoxy resin composition for encasing semiconductive devices comprising a homogeneous mixture of a cresol novolak type epoxy resin and phthalic anhydride as a curing agent, the amount of phthalic anhydride being in excess of the equivalents of epoxide groups, a derivative of imidazole as a curing accelerating agent, and remainder being mineral filler.
Inventors
- 👤 Tooru Tamura
- 👤 Nobuyuki Ojima
- 👤 Sigeru Kondo
- 👤 Jizodo Yozo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 20:11
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W74/47
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
54 words
An epoxy resin composition for encasing semiconductive devices comprising a homogeneous mixture of a cresol novolak epoxy resin, phthalic anhydride as a curing agent, the amount of phthalic anhydride being 1.5 to 3 times the equivalents of epoxide groups, a derivative of imidazole as a curing accelerating agent, and the remainder being mineral filler.
Claim 2
Dependent Claim
54 words
An epoxy resin composition for encasing semiconductive devices comprising a homogeneous mixture of a cresol novolak epoxy resin, phthalic anhydride as a curing agent, the amount of phthalic anhydride being 1.5 to 3 times the equivalents of epoxide groups, a derivative of imidazole as a curing accelerating agent, and the remainder being mineral filler.
Claim 3
Dependent Claim
28 words
An epoxy resin composition for encasing semiconductive devices according to claim 1, wherein said cresol novolak epoxy resin has an average epoxide equivalent weight from 200 to 235.
Claim 4
Dependent Claim
31 words
An epoxy resin composition for encasing semiconductive devices according to claim 1, wherein the amount of said curing accelerating agent is 0.03 to 0.3 weight percent of said epoxy resin composition.
Claim 5
Dependent Claim
30 words
An epoxy resin composition for encasing semiconductive devices according to claim 1, wherein the amount of said mineral filler is 40 to 100 weight percent of said epoxy resin composition.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1980-03-21 | 1980-09-20 | 1981-03-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1984-03-21 | 1984-09-20 | 1985-03-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1988-03-21 | 1988-09-20 | 1989-03-22 | $7700.00 | Window Closed / Lapsed |