US4011060A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of controlling the softening point of solder glass
Assignee: International Business Machines Corp
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Filing: 1975-10-02
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Granted: 1977-03-08
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Expires: 1995-10-02
Abstract
Abstract A process for controlling the softening point and for providing a preselected softening point of solder glass which comprises bubbling oxygen-containing gas through a homogeneous melt of a solder glass containing copper oxide at a temperature and oxygen partial pressure predetermined to provide the desired preselected softening point of the solder glass and for a time sufficient to achieve equilibrium of the reaction Cu 2 O+1/2O 2 ⃡2CuO.
Inventors
- 👤 Melvin Berkenblit
- 👤 See Ark Chan
- 👤 Joan B. Landermann
- 👤 Arnold Reisman
- 👤 Takeshi Takamori
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 09:03
CPC Classifications
C; C03; C03C; C03C8/00; C03C8/24; C03C8/245
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
136 words
A process for controlling the softening point, for minimizing lot by lot scattering of the softening point, and for providing preselected softening point of a solder glass containing copper oxide by controlling the Cu + concentration, comprising A. heating solder glass batch composition containing at least about 0.5% by weight of copper oxide calculated as cupric oxide to a temperature above the softening point of the composition to provide a homogeneous melt; B. bubbling oxygen-containing gas through said homogeneous melt for a time at least sufficient to achieve equilibrium of the reaction Cu.sub.2 O+1/20.sub. 2 ⃡2CuO and at a temperature and oxygen partial pressure predetermined to provide the desired Cu + concentration and preselected softening point of the solder glass; and thereby C. obtaining said solder glass containing copper oxide and having said preselected softening point.
Claim 2
Dependent Claim
136 words
A process for controlling the softening point, for minimizing lot by lot scattering of the softening point, and for providing preselected softening point of a solder glass containing copper oxide by controlling the Cu + concentration, comprising A. heating solder glass batch composition containing at least about 0.5% by weight of copper oxide calculated as cupric oxide to a temperature above the softening point of the composition to provide a homogeneous melt; B. bubbling oxygen-containing gas through said homogeneous melt for a time at least sufficient to achieve equilibrium of the reaction Cu.sub.2 O+1/20.sub. 2 ⃡2CuO and at a temperature and oxygen partial pressure predetermined to provide the desired Cu + concentration and preselected softening point of the solder glass; and thereby C. obtaining said solder glass containing copper oxide and having said preselected softening point.
Claim 3
Dependent Claim
13 words
The process of claim 1 wherein said solder glass is a vitreous glass.
Claim 4
Dependent Claim
25 words
The process of claim 1 wherein said solder glass contains from about 0.5% to about 20% by weight of copper oxide calculated as cupric oxide.
Claim 5
Dependent Claim
25 words
The process of claim 1 wherein said solder glass contains from about 1 to about 13% by weight of copper oxide calculated as cupric oxide.
Claim 6
Dependent Claim
20 words
The process of claim 1 wherein said solder glass has a softening point between about 300° and about 800° C.
Claim 7
Dependent Claim
29 words
The process of claim 1 wherein said solder glass has a coefficient of thermal expansion of about 30×10 - 7 /° C to about 120×10 - 7 /° C.
Claim 8
Dependent Claim
26 words
The process of claim 1 wherein said solder glass is heated to a temperature of about 800° to about 1500° C to provide said homogeneous melt.
Claim 9
Dependent Claim
26 words
The process of claim 1 wherein said solder glass is heated to a temperature of about 1000° to about 1500° C to provide said homogeneous melt.
Claim 10
Dependent Claim
11 words
The process of claim 1 wherein said oxygen-containing gas is oxygen.
Claim 11
Dependent Claim
11 words
The process of claim 1 wherein said oxygen-containing gas is air.
Claim 12
Dependent Claim
19 words
The process of claim 1 wherein said oxygen-containing gas is a mixture of oxygen with nitrogen and/or inert gas.
Claim 13
Dependent Claim
20 words
The process of claim 1 wherein the oxygen-containing gas is bubbled through said melt for at least about 1/2 hour.
Claim 14
Dependent Claim
20 words
The process of claim 1 wherein the oxygen-containing gas is bubbled through said melt for at least about 1 hour.
Claim 15
Dependent Claim
22 words
The process of claim 1 wherein the melt is at a temperature of about 350° to about 1250° C during the bubbling.
Claim 16
Dependent Claim
22 words
The process of claim 1 wherein the melt is at a temperature of about 500° to about 1100° C during the bubbling.
Claim 17
Dependent Claim
18 words
The process of claim 1 wherein the maximum oxygen partial pressure during the bubbling is about 1 atmosphere.
Claim 18
Dependent Claim
39 words
The process of claim 1 wherein the maximum oxygen partial pressure during the bubbling is about 1 atmosphere and the melt is at a temperature wherein substantially all of the copper in the melt is Cu 2 + .
Claim 19
Dependent Claim
28 words
The process of claim 1 which further includes cooling the melt after bubbling to a point wherein the minimum viscosity of the glass is about 10 3 poises.
Claim 20
Dependent Claim
17 words
The process of claim 18 wherein the rate of said cooling is at least about 100° C/hour.
Claim 21
Dependent Claim
53 words
The process of claim 1 which further includes bringing the solder glass after bubbling to a temperature of about 100° to about 170° C above the softening point of the solder glass whereat it exhibits a viscosity of about 10 3 to about 10 4 poises and then forming said glass into cane.
Claim 22
Dependent Claim
13 words
The process of claim 18 which further includes forming said glass into frit.
Claim 23
Dependent Claim
31 words
The process of claim 1 wherein the softening point is changed by about 11° to about 16° C for every 1% change in the percent of Cu + in the glass.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1980-03-07 | 1980-09-06 | 1981-03-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1984-03-07 | 1984-09-06 | 1985-03-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1988-03-07 | 1988-09-06 | 1989-03-08 | $7700.00 | Window Closed / Lapsed |