US4009033A
Expired / Lapsed
US
⏱️ 0.0 years remaining
High speed positive photoresist composition
Assignee: International Business Machines Corp
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Filing: 1975-09-22
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Granted: 1977-02-22
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Expires: 1995-09-22
Abstract
Abstract A positive photoresist having increased sensitivity to light and formed by the addition of an acidic compound to a 1,2-quinone-diazide sulphonic acid ester sensitizer.
Inventors
- 👤 Peter Bakos
- 👤 John Rasile
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 19:54
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/022; G03F7/0226; Y; Y10; Y10S; Y10S430/00; Y10S430/1053; Y10S430/1055; Y10S430/127
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
80 words
A positive photoresist composition developable in an alkaline solution comprising an admixture of a resin, a light-sensitive or electron beam-sensitive 1, 2-quinone-diazide sulfonic acid ester sensitizer and an acid compound selected from the group consisting of picric acid, nicotinic acid and nitrocinnamic acid in admixture characterized by increased sensitivity to light or electron beams as a result of the presence of said acid compound wherein said acid compound is present in an amount such that satisfactory image resulution is obtained.
Claim 2
Dependent Claim
80 words
A positive photoresist composition developable in an alkaline solution comprising an admixture of a resin, a light-sensitive or electron beam-sensitive 1, 2-quinone-diazide sulfonic acid ester sensitizer and an acid compound selected from the group consisting of picric acid, nicotinic acid and nitrocinnamic acid in admixture characterized by increased sensitivity to light or electron beams as a result of the presence of said acid compound wherein said acid compound is present in an amount such that satisfactory image resulution is obtained.
Claim 3
Dependent Claim
15 words
The composition as claimed in claim 1, wherein said resin is a m-cresol formaldehyde resin.
Claim 4
Dependent Claim
87 words
In a process for generating a pattern on a substrate coated with a positive photoresist comprising an admixture of a resin, a light-sensitive or electron beam-sensitive 1, 2-quinone-diazide sulfonic acid ester by exposure to an electron beam or light and development in an alkaline solution, the improvement comprising adding an acid compound to said admixture of the photoresist, said compound is selected from the group consisting of picric acid, nicotinic acid and nitrocinnamic acid in an amount such that increased sensitivity and satisfactory image resolution are obtained.
Claim 5
Dependent Claim
87 words
In a process for generating a pattern on a substrate coated with a positive photoresist comprising an admixture of a resin, a light-sensitive or electron beam-sensitive 1, 2-quinone-diazide sulfonic acid ester by exposure to an electron beam or light and development in an alkaline solution, the improvement comprising adding an acid compound to said admixture of the photoresist, said compound is selected from the group consisting of picric acid, nicotinic acid and nitrocinnamic acid in an amount such that increased sensitivity and satisfactory image resolution are obtained.
Claim 6
Dependent Claim
13 words
The process of claim 3, wherein said resin is a m-cresol formaldehyde resin.
Claim 7
Dependent Claim
67 words
A positive photoresist composition developable in an alkaline solution comprising an admixture of a resin, a light-sensitive or electron beam-sensitive 1, 2-quinone-diazide sulfonic acid ester sensitizer and picric acid, said composition is characterized by increased sensitivity to light or electron beams as a result of the presence of said picric acid wherein said picric acid is present in an amount such that satisfactory image resolution is obtained.
Claim 8
Dependent Claim
67 words
A positive photoresist composition developable in an alkaline solution comprising an admixture of a resin, a light-sensitive or electron beam-sensitive 1, 2-quinone-diazide sulfonic acid ester sensitizer and picric acid, said composition is characterized by increased sensitivity to light or electron beams as a result of the presence of said picric acid wherein said picric acid is present in an amount such that satisfactory image resolution is obtained.
Claim 9
Dependent Claim
15 words
The composition as claimed in claim 5, wherein said resin is a m-cresol formaldehyde resin.
Claim 10
Dependent Claim
12 words
The composition as claimed in claim 5, further comprising an adhesion promoter.
Claim 11
Dependent Claim
11 words
The composition as claimed in claim 5, further comprising a dye.
Claim 12
Dependent Claim
74 words
In a process for generating a pattern on a substrate coated with a positive photoresist comprising an admixture of a resin, a light-sensitive or electron beam-sensitive 1, 2-quinone-diazide sulfonic acid ester by exposure to an electron beam or light and development in an alkaline solution, the improvement comprising adding picric acid to said admixture of the photoresist which increases the sensitivity of said photoresist in an amount such that satisfactory image resolution is obtained.
Claim 13
Dependent Claim
74 words
In a process for generating a pattern on a substrate coated with a positive photoresist comprising an admixture of a resin, a light-sensitive or electron beam-sensitive 1, 2-quinone-diazide sulfonic acid ester by exposure to an electron beam or light and development in an alkaline solution, the improvement comprising adding picric acid to said admixture of the photoresist which increases the sensitivity of said photoresist in an amount such that satisfactory image resolution is obtained.
Claim 14
Dependent Claim
15 words
The process as claimed in claim 9, wherein said resin is a m-cresol formaldehyde resin.
Claim 15
Dependent Claim
14 words
The process as claimed in claim 9, wherein an adhesion promotor is additionally added.
Claim 16
Dependent Claim
13 words
The process as claimed in claim 9, wherein a dye is additionally added.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1980-02-22 | 1980-08-23 | 1981-02-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1984-02-22 | 1984-08-23 | 1985-02-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1988-02-22 | 1988-08-23 | 1989-02-22 | $7700.00 | Window Closed / Lapsed |