US4004960A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Copolyester-amide resin and adhesive processes
Assignee: USM Corp
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Filing: 1975-04-07
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Granted: 1977-01-25
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Expires: 1995-04-07
Abstract
Abstract Thermoplastic esteramide heterophase copolymer resin including saturated copolyester soft segments chemically joined to copolyamide hard segments, in proportions and copolymerized to an extent to give a melt viscosity, extended tack after melt application and room temperature hardness for use as a hot melt adhesive in the manufacture of shoes.
Inventors
- 👤 Ernest M. Crowell
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 07:39
CPC Classifications
C; C09; C09J; C09J177/00; C09J177/12; C08; C08G; C08G69/00; C08G69/44; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31551; Y10T428/31554; Y10T428/31558; Y10T428/31573; Y10T428/3158; Y10T428/31786
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
116 words
A heat fusible heterophase copolyester-amide resin formed of copolyester soft segments chemically joined to hydrogen bonding copolyamide hard segments having limited compatibility with the copolyester soft segments in which said copolyester segments comprise from about 30 to about 60% of aliphatic ester components and from about 70 to about 40% of aromatic ester components, said copolyester segments have a molecular weight of from about 5,000 to about 15,000, and in which the total amide structure in said copolyesteramide constitutes by weight from about 5 to about 40% based on the weight of said copolyester-amide and amide structure from aminolysis of said copolyester constitutes from about 40 to about 70% by weight of said total amide structure.
Claim 2
Dependent Claim
116 words
A heat fusible heterophase copolyester-amide resin formed of copolyester soft segments chemically joined to hydrogen bonding copolyamide hard segments having limited compatibility with the copolyester soft segments in which said copolyester segments comprise from about 30 to about 60% of aliphatic ester components and from about 70 to about 40% of aromatic ester components, said copolyester segments have a molecular weight of from about 5,000 to about 15,000, and in which the total amide structure in said copolyesteramide constitutes by weight from about 5 to about 40% based on the weight of said copolyester-amide and amide structure from aminolysis of said copolyester constitutes from about 40 to about 70% by weight of said total amide structure.
Claim 3
Dependent Claim
61 words
A linear copolyester-amide resin as defined in claim 1 in which the aromatic components of said copolyester segments are condensation products of a glycol with terephthalic and isophthalic acids in relative proportions by weight of from about 3.5 parts of terephthalic acid to 6 parts of isophthalic acid to about 6 parts of terephthalic acid to 4 parts of isophthalic acid.
Claim 4
Dependent Claim
106 words
A linear copolyester-amide resin as defined in claim 2 in which said aliphatic component for condensation with said aromatic component of said copolyester is the product of condensing and polymerizing at least one saturated aliphatic dibasic acid having from 6 to 36 carbon atoms with a glycol having from 2 to 6 carbon atoms or the polyester from condensation and polymerization of a polylactone polyol having a molecular weight of from about 500 to about 1,500 or mixtures of said aliphatic polyester components, substantial portions of said copolyester structure being unsubstituted by amide structure to provide soft domains effective to provide retained tackiness in the copolyester-amide.
Claim 5
Dependent Claim
44 words
A linear copolyester-amide resin as defined in claim 3 in which said copolyamide segments comprises amide condensates of at least one aliphatic or aromatic dibasic acid and at least one aliphatic diamine, and amide structure from aminolysis of said copolyester by an aliphatic diamine.
Claim 6
Dependent Claim
90 words
A linear copolyester-amide resin as defined in claim 4 in which said dibasic acid condensed to form amide is at least one saturated aliphatic dibasic acid having a carbon chain of from 2 to 12 carbon atoms or at least one aromatic dibasic acid or mixtures of these, in which said diamine for condensation to form amide has from 2 to 12 carbon atoms and in which the aliphatic diamine for forming amide structure by aminolysis of said copolyester has a carbon chain of from 2 to 12 carbon atoms.
Claim 7
Dependent Claim
115 words
A linear copolyester-amide resin as defined in claim 5 in which said terephthalic and isophthalic acids of said copolyester are present in relative proportions by weight of from about 3 to about 4, in which the amide structure from aminolysis of said copolyester constitutes from about 40 to about 50% by weight of the total amide in said copolyester-amide and in which the total amide structure constitutes from about 7.5 to about 30% by weight based on the weight of said copolyester-amide, said copolyester-amide having a melt viscosity of from about 500 to about 2,000 poises at 480° F. and having a Shore A hardness at room temperature of from about 60 to about 95.
Claim 8
Dependent Claim
87 words
An adhesive process in which a copolyester-amide resin as defined in claim 1 is melted and deposited in molten condition on a surface to be bonded, the deposited adhesive is cooled below the crystallization temperature of the polyamide segments, a further surface is pressed against the deposited copolyester-amide during the period within which the polyester segments remain mobile so that the deposited copolyester-amide retains tack to establish a bond to said further surface, and the copolyester-amide is hardened to tack-free strong condition bonding said surfaces firmly together.
Claim 9
Dependent Claim
87 words
An adhesive process in which a copolyester-amide resin as defined in claim 7 is melted and deposited in molten condition on a surface to be bonded, the deposited adhesive is cooled below the crystallization temperature of the polyamide segments, a further surface is pressed against the deposited copolyester-amide during the period within which the polyester segments remain mobile so that the deposited copolyester-amide retains tack to establish a bond to said further surface, and the copolyester-amide is hardened to tack-free strong condition bonding said surfaces firmly together.
Claim 10
Dependent Claim
103 words
The process for adhesive bonding shoe parts comprising the steps of melting a copolyester-amide resin as defined in claim 6 depositing the molten resin on the attaching surfaces of a shoe part to be bonded, cooling the deposited adhesive below the crystallization temperature of the polyamide segments, pressing the attaching surface of a second shoe part to be bonded against the deposited copolyester-amide during the period within which the polyester segments remain mobile so that the deposited copolyester-amide retains tack to establish a bond between said attaching surfaces and allowing the copolyester-amide to harden to tack-free strong condition bonding said shoe parts together.
References Cited (Backward Citations)
US2281415A
Cited
US3247536A
Cited
US3436301A
Cited
US3852246A
Cited
US3475385A
Cited
US3468975A
Cited
US3849514A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1980-01-25 | 1980-07-26 | 1981-01-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1984-01-25 | 1984-07-26 | 1985-01-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1988-01-25 | 1988-07-26 | 1989-01-25 | $7700.00 | Window Closed / Lapsed |