Polyphenylene ether resin compositions containing an N-alkanoyl-p-aminophenol stabilizer

Claim 2

A thermoplastic molding composition having improved resistance to thermal aging in the presence of air which comprises: a. a polyphenylene ether resin; b. a vinyl aromatic resin; and c. an amount of an N-alkanoyl-p-aminophenol sufficient to improve the resistance of said composition to thermal aging.

Claim 3

The stabilized composition of claim 1 wherein said polyphenylene ether resin is of the formula: ##STR4## wherein the oxygen ether atom of one unit is connected to the benzene nucleus of the next adjoining unit, n is a positive integer and is at least 50, and each Q is a monovalent substituent selected from the group consisting of hydrogen, halogen, hydrocarbon radicals free of a tertiary alpha carbon atom, halohydrocarbon radicals having at least two carbon atoms between the halogen atom and the phenyl nucleus, hydrocarbonoxy radicals and halohydrocarbonoxy radicals having at least two carbon atoms.

Claim 4

The stabilized composition of claim 1 wherein said polyphenylene ether resin is poly(2,6-dimethyl-1,4-phenylene) ether.

Claim 5

The stabilized composition of claim 1 wherein at least 25% of the units of said vinyl aromatic resin are derived from monomer of the formula: ##STR5## wherein R 1 and R 2 are selected from the group consisting of lower alkyl or alkenyl groups of from 1 to 6 carbon atoms and hydrogen; R 3 and R 4 are selected from the group consisting of chloro, bromo, hydrogen and lower alkyl of from 1 to 6 carbon atoms; R 5 and R 6 are selected from the group consisting of hydrogen and lower alkyl and alkenyl groups of from 1 to 6 carbons or R 5 and R 6 may be concatenated together with hydrocarbyl groups to form a naphthyl group.

Claim 6

The stabilized composition of claim 4 wherein said vinyl aromatic resin is a rubber-modified, high-impact polystyrene.

Claim 7

The stabilized composition of claim 1 which includes from 10 to 90 parts by weight of a polyphenylene ether resin; from 90-10 parts by weight of a vinyl aromatic resin and from 0.5 parts by weight of an N-alkanoyl-p-aminophenol.

Claim 8

The stabilized composition of claim 6 wherein the N-alkanoyl-p-aminophenol is N-lauroyl-p-aminophenol.

Claim 9

The stabilized composition of claim 6 wherein the N-alkanoyl-p-aminophenol is N-stearoyl-p-aminophenol.

Claim 10

The stabilized composition of claim 1 including a flame retardant amount of a flame retardant agent.

Claim 11

The stabilized composition of claim 1 including a reinforcing amount of reinforcing filler.

Claim 12

The stabilized composition of claim 9 including a reinforcing amount of a reinforcing filler.

Claim 13

The stabilized composition of claim 1 including a stabilizing amount of triphenylphosphate.

Claim 14

The stabilized composition of claim 12 including a stabilizing amount of zinc sulfide.

Claim 15

The stabilized composition of claim 13 including a stabilizing amount of tridecylphosphite.

Claim 16

The stabilized composition of claim 14 including a stabilizing amount of zinc oxide.

Claim 19

A thermoplastic molding composition having improved resistance to thermal aging, in the presence of air said composition comprising: a. from 10 to 90 by weight of a polyphenylene ether resin of the formula: ##STR6## wherein the oxygen ether atom of one unit is connected to the benzene nucleus of the next adjoining unit, n is a positive integer and is at least 50, and each Q is a monovalent substituent selected from the group consisting of hydrogen, halogen, hydrocarbon radicals free of a tertiary alpha carbon atom, halohydrocarbon radicals having at least two carbon atoms between the halogen atom and the phenyl nucleus, hydrocarbonoxy radicals and halohydrocarbonoxy radicals having at least two carbon atoms; b. from 90 to 10 parts by weight of a vinyl aromatic resin wherein at least 25% of the units of said vinyl aromatic resin are derived from a monomer of the formula: ##STR7## wherein R 1 and R 2 are selected from the group consisting of lower alkyl or alkenyl groups of from 1 to 6 carbon atoms and hydrogen; R 3 and R 4 are selected from the group consisting of chloro, bromo, hydrogen and lower alkyl of from 1 to 6 carbon atoms; R 5 and R 6 are selected from the group consisting of hydrogen and lower alkyl and alkenyl groups of from 1 to 6 carbon atoms or R 5 and R 6 may be concatenated together with hydrocarbyl groups to form a naphthyl group; and c. from 0.5 to 10 parts by weight of an N-alkanoyl-p-aminophenol.

Claim 20

A thermoplastic molding composition having improved resistance to thermal aging, in the presence of air said composition comprising: a. from 10 to 90 by weight of a polyphenylene ether resin of the formula: ##STR6## wherein the oxygen ether atom of one unit is connected to the benzene nucleus of the next adjoining unit, n is a positive integer and is at least 50, and each Q is a monovalent substituent selected from the group consisting of hydrogen, halogen, hydrocarbon radicals free of a tertiary alpha carbon atom, halohydrocarbon radicals having at least two carbon atoms between the halogen atom and the phenyl nucleus, hydrocarbonoxy radicals and halohydrocarbonoxy radicals having at least two carbon atoms; b. from 90 to 10 parts by weight of a vinyl aromatic resin wherein at least 25% of the units of said vinyl aromatic resin are derived from a monomer of the formula: ##STR7## wherein R 1 and R 2 are selected from the group consisting of lower alkyl or alkenyl groups of from 1 to 6 carbon atoms and hydrogen; R 3 and R 4 are selected from the group consisting of chloro, bromo, hydrogen and lower alkyl of from 1 to 6 carbon atoms; R 5 and R 6 are selected from the group consisting of hydrogen and lower alkyl and alkenyl groups of from 1 to 6 carbon atoms or R 5 and R 6 may be concatenated together with hydrocarbyl groups to form a naphthyl group; and c. from 0.5 to 10 parts by weight of an N-alkanoyl-p-aminophenol.

Claim 21

A thermoplastic molding composition as defined in claim 17 which also includes from 0.05-5% by weight of a metal sulfide and a metal oxide.