US4000046A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of electroplating a conductive layer over an electrolytic capacitor
Assignee: Duracell Inc USA
•
Filing: 1974-12-23
•
Granted: 1976-12-28
•
Expires: 1994-12-23
Abstract
Abstract A method is provided for electroplating a solid electrolyte film-forming metal capacitor. The method includes placing an electroprocessed capacitor in an electroplating vessel which contains a plating source and electroplating solution, providing a voltage source and connecting the positive terminal of the voltage source to the anode side of the capacitor and to the plating source and the negative terminal of the voltage source to a conducting layer on the anode body, and then electroplating a layer containing metal over the capacitor. Any metal which can be plated may be used, such metals include electrically conductive metals such as silver, gold, copper, nickel, and mixtures thereof. The electroplated layer over the capacitor provides greater resistance to mechanical shock and allows the welding of a cathode termination means to the electroplated layer of the capacitor.
Inventors
- 👤 Charles A. Weaver
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 04:12
CPC Classifications
H; H01; H01G; H01G9/00; H01G9/15; H01G9/004; H01G9/04; H01G9/042; H01G9/0425
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
79 words
A method of depositing material over an electrode comprising the steps of providing a first electrode with a dielectric oxide film thereover and a second electrode contiguous to the dielectric oxide film, maintaining the voltage potential of the first electrode different from the voltage potential of the second electrode to retain the dielectric nature of the oxide film during deposition of material over the second electrode, and depositing material from a fluid over the second electrode using electrical forces.
Claim 2
Independent Claim
79 words
A method of depositing material over an electrode comprising the steps of providing a first electrode with a dielectric oxide film thereover and a second electrode contiguous to the dielectric oxide film, maintaining the voltage potential of the first electrode different from the voltage potential of the second electrode to retain the dielectric nature of the oxide film during deposition of material over the second electrode, and depositing material from a fluid over the second electrode using electrical forces.
Claim 3
Dependent Claim
13 words
The method of claim 1 wherein the electrical forces are static electrical forces.
Claim 4
Dependent Claim
15 words
The method of claim 1 wherein the electrical forces are produced by switching direct current.
Claim 5
Dependent Claim
15 words
The method of claim 1 wherein the electrical forces are produced by intermittent direct current.
Claim 6
Dependent Claim
132 words
In a method of making an electrolytic film-forming metal capacitor, the steps comprising the steps of providing a film-forming metal capacitor including a anode termination means and a anode body, the anode body having a dielectric oxide layer, a semiconductive layer over the dielectric oxide layer and a conductive layer over the semiconductive layer and providing a voltage source having a positive and negative terminal, placing the capacitor in an electroplating vessel which contains a plating source and an electroplating solution which contains metal ions, electrically connecting the positive terminal to the anode termination means and the plating source and the negative terminal to the conducting layer on the anode body, electroplating a layer containing metal over the anode body by applying a voltage, and removing the electroplated capacitor from the vessel.
Claim 7
Dependent Claim
132 words
In a method of making an electrolytic film-forming metal capacitor, the steps comprising the steps of providing a film-forming metal capacitor including a anode termination means and a anode body, the anode body having a dielectric oxide layer, a semiconductive layer over the dielectric oxide layer and a conductive layer over the semiconductive layer and providing a voltage source having a positive and negative terminal, placing the capacitor in an electroplating vessel which contains a plating source and an electroplating solution which contains metal ions, electrically connecting the positive terminal to the anode termination means and the plating source and the negative terminal to the conducting layer on the anode body, electroplating a layer containing metal over the anode body by applying a voltage, and removing the electroplated capacitor from the vessel.
Claim 8
Dependent Claim
27 words
In the method of claim 5 wherein the electroplating solution contains ions of metals selected from the group consisting of silver, gold, copper, nickel and mixtures thereof.
Claim 9
Dependent Claim
19 words
In the method of claim 6 wherein the electroplating solution has a pH of about 3.0 to about 9.0.
Claim 10
Dependent Claim
16 words
In the method of claim 7 wherein the electroplating solution contains nickel sulfamate and an acid.
Claim 11
Dependent Claim
17 words
In a method according to claim 5 wherein the conducting layer over the anode body contains graphite.
Claim 12
Dependent Claim
30 words
In a method according to claim 5 wherein the conducting layer on the anode body contains a metal selected from the group consisting of silver, tin, copper or mixtures thereof.
Claim 13
Dependent Claim
26 words
In the method of claim 5 wherein the plating source contains a metal selected from the group consisting of silver, gold, copper, nickel and mixtures thereof.
Claim 14
Dependent Claim
27 words
In the method of claim 5 wherein the film-forming metal of the anode body is selected from the group consisting of aluminum, titanium, zirconium, niobium and tantalum.
Claim 15
Dependent Claim
19 words
In the method of claim 12 wherein the semiconducting layer contains manganese dioxide and the film-forming metal is tantalum.
Claim 16
Dependent Claim
33 words
In the method of claim 5 wherein switching means are provided to alter the voltage applied to the plating source and the negative terminal connected to the conducting layer on the anode body.
Claim 17
Dependent Claim
28 words
In the method of claim 5, wherein electrical current flowing to the anode termination means is limited to such an extent that the capacitor is not harmfully affected.
References Cited (Backward Citations)
US2215890A
Cited
US2930951A
Cited
US3248618A
Cited
US3292053A
Cited
US3316463A
Cited
US3343047A
Cited
US3231800A
Cited
US3439231A
Cited
US3850764A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1979-12-28 | 1980-06-28 | 1980-12-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1983-12-28 | 1984-06-28 | 1984-12-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1987-12-28 | 1988-06-28 | 1988-12-28 | $7700.00 | Window Closed / Lapsed |