Curable epoxy composition

Claim 2

A storage stable, moisture and room temperature curable epoxy resin composition comprising curable materials comprising epoxy resin, a salt of bis(fluoroalkylsulfonyl)methane or fluoroalkylsulfonic acid as a latent catalyst for the curing of said curable materials, an amount of phosphorus pentoxide to produce upon hydration thereof sufficient phosphoric acids to activate said latent catalyst when said composition is applied, and a base which is inert with respect to said curable materials, catalyst, and phosphorus pentoxide and is present in an amount sufficient to react and form salts with phosphoric acids formed by hydration of said phosphorus pentoxide upon contact thereof with adventitious moisture during preparation and storage of said composition, said base having the formula R 1 R 2 R 3 P, where R 1 , R 2 and R 3 are aliphatic groups.

Claim 3

A process for preparing a moisture and room temperature curable epoxy resin composition which comprises mixing, under anhydrous conditions, curable epoxy resin, phosphorus pentoxide, and a base, and then mixing the resulting mixture with a salt of bis(fluoroalkylsulfonyl)methane or fluoroalkylsulfonic acid as a latent catalyst for curing of said curable epoxy resin, said phosphorus pentoxide being present in at least that amount to produce upon hydration thereof sufficient phosphoric acids to activate said latent catalyst when said composition is applied, said base being inert with respect to said curable epoxy resin, catalyst, and phosphorus pentoxide and present in an amount sufficient to react and form salts with phosphoric acids formed by hydration of said phosphorus pentoxide upon contact thereof with adventitious moisture during preparation and storage of said composition, said base having the formula R 1 R 2 R 3 P, where R 1 , R 2 and R 3 are aliphatic groups.

Claim 4

A process for preparing a moisture and room temperature curable epoxy resin composition which comprises mixing, under anhydrous conditions, curable epoxy resin, phosphorus pentoxide, and a base, and then mixing the resulting mixture with a salt of bis(fluoroalkylsulfonyl)methane or fluoroalkylsulfonic acid as a latent catalyst for curing of said curable epoxy resin, said phosphorus pentoxide being present in at least that amount to produce upon hydration thereof sufficient phosphoric acids to activate said latent catalyst when said composition is applied, said base being inert with respect to said curable epoxy resin, catalyst, and phosphorus pentoxide and present in an amount sufficient to react and form salts with phosphoric acids formed by hydration of said phosphorus pentoxide upon contact thereof with adventitious moisture during preparation and storage of said composition, said base having the formula R 1 R 2 R 3 P, where R 1 , R 2 and R 3 are aliphatic groups.

Claim 5

A storage stable, moisture and room temperature curable epoxy resin composition comprising an admixture of curable epoxy resin having more than one epoxy group and one or more cyclohexeneoxide groups per molecule and curable acid anhydride co-reactant, 0.1 to 5 weight percent of a latent catalyst for the curing of said curable materials, said latent catalyst having the general formula [(R.sub.f SO.sub.2).sub.2 C .sup.-F].sub.n M.sup.n.sup.+ where R f is fluoroalkyl, R is hydrogen, halogen or a hydrocarbon radical, M is an ammonium cation or a metal cation, and n is an integer of 1 to 3 and equal to the valence of said cation M, 0.5 to 5 weight percent of phosphorus pentoxide, and 0.1 to 2 weight percent of a base which is inert with respect to said curable materials, catalyst, and phosphorus pentoxide and reacts and forms salts with phosphoric acids formed by hydration of said phosphorus pentoxide upon contact thereof with adventitious moisture during preparation and storage of said composition, said base having the formula R 1 R 2 R 3 P, where R 1 , R 2 , and R 3 are aliphatic groups, said weight percents being based on the total weight of said curable materials.

Claim 6

A storage stable, moisture and room temperature curable epoxy resin composition comprising an admixture of curable epoxy resin having more than one epoxy group and one or more cyclohexeneoxide groups per molecule and curable acid anhydride co-reactant, 0.1 to 5 weight percent of a latent catalyst for the curing of said curable materials, said latent catalyst having the general formula [(R.sub.f SO.sub.2).sub.2 C .sup.-F].sub.n M.sup.n.sup.+ where R f is fluoroalkyl, R is hydrogen, halogen or a hydrocarbon radical, M is an ammonium cation or a metal cation, and n is an integer of 1 to 3 and equal to the valence of said cation M, 0.5 to 5 weight percent of phosphorus pentoxide, and 0.1 to 2 weight percent of a base which is inert with respect to said curable materials, catalyst, and phosphorus pentoxide and reacts and forms salts with phosphoric acids formed by hydration of said phosphorus pentoxide upon contact thereof with adventitious moisture during preparation and storage of said composition, said base having the formula R 1 R 2 R 3 P, where R 1 , R 2 , and R 3 are aliphatic groups, said weight percents being based on the total weight of said curable materials.

Claim 7

The composition according to claim 3 wherein said epoxy resin is 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate; said acid anhydride is methendic anhydride, nadic methyl anhydride, or cis-1,2-cyclohexanedicarboxylic anhydride, or mixtures thereof; said catalyst is (CF 3 SO 2 ) 2 CHK; and said base is tri-n-octylphosphine.

Claim 8

The composition according to claim 1 where said latent catalyst has the general formula [(R.sub.f SO.sub.2).sub.2 C 116R].sub.n M.sup.n.sup.+ where R f is fluoroalkyl, R is hydrogen, halogen or a hydrocarbon radical, M is an amonium cation or a metal cation, and n is an integer of 1 to 3 and equal to the valence of said cation M.

Claim 9

The composition of claim 1 wherein said latent catalyst is [(CF 3 SO 2 ) 2 CH] 2 Ba, (CF 3 SO 2 ) 2 CHK, (CF 3 SO 2 ) 2 CHLi, (CF 3 SO 2 ) 2 CH 2 .sup.. (NH 2 ) 2 C=NH, (CF 3 SO 2 ) 2 CH 2 .sup.. N(CH 2 CH 3 ) 3 , (CF 3 SO 2 ) 2 CBrK, (CF 3 SO 3 ) 2 Cu, or (CF 3 SO 3 ) 2 Zn.

Claim 10

The composition according to claim 1 wherein said catalyst has the formula [R.sub.f SO.sub.3 .sup.-]nM.sup.n.sup.+ where R f is fluoroalkyl, M is an ammonium cation or a metal cation, and n is an integer of 1 to 3 and equal to the valence of said cation.

Claim 11

The composition of claim 1 wherein said latent catalyst is [(CF 3 SO 2 ) 2 CH] 2 Ba.

Claim 12

The composition of claim 1 wherein said latent catalyst is (CF 3 SO 2 ) 2 CHK.

Claim 13

The composition of claim 1 wherein said base is tri-n-butylphosphine, tri-n-octylphosphine, or mixtures thereof.

Claim 14

The composition according to claim 1 wherein the amount of said latent catalyst is 0.01 to 20 weight percent, the amount of said phosphorous pentoxide is 0.1 to 10 weight percent, and the amount of said base is 0.01 to 5 weight percent, said weight percents being based on the total weight of said curable materials.

Claim 15

The composition of claim 1 wherein said curable epoxy resin is 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, polyglycidyl ether of phenolformaldehyde novalak or digylcidyl ether of propylene glycol, or mixtures thereof.

Claim 16

The composition according to claim 1 wherein said curable materials include methendic anhydride, nadic methylanhydride, cis-1,2-cyclohexanedicarboxylic anhydride, or mixtures thereof.

Claim 17

A composite comprising a filler or reinforcement and the composition of claim 1.

Claim 18

A storage stable, moisture and room temperature curable composition comprising polyglycidyl ether of phenoloformaldehyde novolac, diglycidyl ether of propylene glycol, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, phosphorus pentoxide, tri-n-octylphosphine, and (CF 3 SO 2 ) 2 CHK, the latter being a latent catalyst for the cure of the curable epoxy material in said composition, the amount of said phosphorus pentoxide being at least that amount to produce upon hydration thereof sufficient phosphoric acids to activate said latent catalyst when said composition is applied, said phosphine being present in an amount sufficient to react and form salts with phosphoric acids formed by hydration of said phosphorous pentoxide upon contact thereof with adventitious moisture during preparation and storage of said composition.

Claim 19

A storage stable, moisture and room temperature curable composition comprising polyglycidyl ether of phenoloformaldehyde novolac, diglycidyl ether of propylene glycol, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, phosphorus pentoxide, tri-n-octylphosphine, and (CF 3 SO 2 ) 2 CHK, the latter being a latent catalyst for the cure of the curable epoxy material in said composition, the amount of said phosphorus pentoxide being at least that amount to produce upon hydration thereof sufficient phosphoric acids to activate said latent catalyst when said composition is applied, said phosphine being present in an amount sufficient to react and form salts with phosphoric acids formed by hydration of said phosphorous pentoxide upon contact thereof with adventitious moisture during preparation and storage of said composition.

Claim 20

A storage stable, moisture and room temperature curable composition comprising 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, methendic anhydride, phosphorus pentoxide, tri-n-heptylamine, and (CF 3 SO 2 ) 2 CHK, the latter being a latent catalyst for the cure of the curable epoxy material in said composition, the amount of said phosphorus pentoxide being at least that amount to produce upon hydration thereof sufficient phosphoric acids activate said latent catalyst when said composition is applied, said amine being present in an amount sufficient to react and form salts with phosphoric acids formed by hydration of said phosphorus pentoxide upon contact thereof with adventitious moisture during preparation and storage of said composition.

Claim 21

A storage stable, moisture and room temperature curable composition comprising 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, methendic anhydride, phosphorus pentoxide, tri-n-heptylamine, and (CF 3 SO 2 ) 2 CHK, the latter being a latent catalyst for the cure of the curable epoxy material in said composition, the amount of said phosphorus pentoxide being at least that amount to produce upon hydration thereof sufficient phosphoric acids activate said latent catalyst when said composition is applied, said amine being present in an amount sufficient to react and form salts with phosphoric acids formed by hydration of said phosphorus pentoxide upon contact thereof with adventitious moisture during preparation and storage of said composition.