Integrated circuit extraction tool

Claim 2

A tool for extracting an integrated circuit package from a circuit board, said circuit package having a first and a second plurality of equally spaced-apart pins affixed along parallel sidewalls, said tool including a handle member, means, affixed to said handle member, for grasping an underside of said circuit package about at least one pin of each of said first and second plurality of pins, means for straddling said circuit package perpendicular to said first and second plurality of pins, said straddling means including first and second pairs of parallel, spaced-apart legs, means for slidably coupling said straddling means to said grasping means, and first and second oppositely directed bow springs each of which has one end affixed to said handle member and an opposite end affixed to said coupling means, said bow springs converting a compressive force applied thereto into a compressive component and an extensive component, said compressive component actuating said grasping means and said extensive component shifting said straddling means downwardly away from said handle member thereby producing a nearly uniform perpendicular force on each of said parallel pairs of legs to effect the extraction of said circuit package by said grasping means.

Claim 3

The integrated circuit extraction tool in accordance with claim 1 wherein said grasping means includes first and second leaf springs, each of said springs having a pair of generally right-angle bends at an end opposite to an end affixed to said handle member, said bends having a space therebetween to accommodate the width of one of said pins affixed to said circuit package sidewalls, said bends on said first spring being directed toward said bends on said second spring.

Claim 4

The integrated circuit extraction tool in accordance with claim 2 wherein said grasping means further includes an insulative layer encasing said right-angle bends on said first and second leaf springs and said first and second pairs of parallel, spaced-apart legs on said straddling means, said insulative layer enabling the extraction of an integrated circuit while electrical power is supplied thereto.

Claim 5

The integrated circuit extraction tool in accordance with claim 1 wherein said straddling means includes first and second panel members spaced apart from one another by a predetermined distance, said panel members lying in parallel planes which are parallel with a plane containing said first and second oppositely directed bow springs, and first and second channel members spaced apart from one another by a width of said panel members, said channel members affixed to said panel members so as to lie in first and second parallel planes which are perpendicular to said plane containing said first and second bow springs, one end of each of said channel members extending beyond an end of said panel members by a predetermined distance in a direction away from said handle member, said extending end of each of said channel members forming said first and second pairs of parallel, spaced-apart legs.

Claim 6

The integrated circuit extraction tool in accordance with claim 4 wherein each of said first and second channel members further includes pairs of first and second parallel spaced-apart cuts of specified lengths along a length dimension so as to form a pair of oppositely directed cantilevered leaf springs for slidably supporting said straddling means about said grasping means.

Claim 7

The integrated circuit extraction tool in accordance with claim 1 wherein said coupling means includes first and second tapped pins each having one end portion for fixedly attaching an end of said bow springs to said straddling means.

Claim 8

A tool for extracting an integrated circuit package from a circuit board, said circuit package having a first and a second plurality of equally spaced-apart pins affixed along parallel sidewalls, said tool including, a handle member, first and second leaf springs, each of said springs having one end affixed to said handle member and a pair of generally right-angle bends at an opposite end for engaging an underside of said circuit package, said bends having a space therebetween to accommodate the width of one of said pins affixed to said circuit package sidewalls, said bends on said first spring being directed toward said bends on said second spring, first and second panel members spaced apart from one another by a predetermined distance, said panel members lying in parallel planes which are perpendicular to parallel planes containing said first and second leaf springs, first and second channel members spaced apart from one another by a width of said panel members, said channel members affixed to said panel members so as to lie in parallel planes which are parallel with said parallel planes containing said first and second leaf springs, one end of each of said channel members extending beyond an end of said panel members by a predetermined distance in a direction away from said handle member, said extending end of each of said channel members forming first and second pairs of parallel, spaced-apart legs, pairs of first and second parallel, spaced-apart cuts along a length dimension of each of said channel members so as to form a pair of oppositely directed cantilevered leaf springs for slidably supporting said channel members and said panel members which are affixed to said channel members about said first and second leaf springs, first and second tapped pins affixed to said first and second channel members, respectively, and first and second oppositely directed bow springs each of which has one end affixed to said handle member and an opposite end affixed to said tapped pins, said bow springs converting a compressive force applied thereto into a compressive component and an extensive component, said compressive component actuating said first and second leaf springs to grasp said circuit package and said extensive component shifting said channel members and said panel members affixed thereto downwardly away from said handle member thereby producing a nearly uniform perpendicular force on each of said parallel pairs of legs on said channel members to effect the extraction of said circuit package.

Claim 9

A tool for extracting an integrated circuit package from a circuit board, said circuit package having a first and a second plurality of equally spaced-apart pins affixed along parallel sidewalls, said tool including, a handle member, first and second leaf springs, each of said springs having one end affixed to said handle member and a pair of generally right-angle bends at an opposite end for engaging an underside of said circuit package, said bends having a space therebetween to accommodate the width of one of said pins affixed to said circuit package sidewalls, said bends on said first spring being directed toward said bends on said second spring, first and second panel members spaced apart from one another by a predetermined distance, said panel members lying in parallel planes which are perpendicular to parallel planes containing said first and second leaf springs, first and second channel members spaced apart from one another by a width of said panel members, said channel members affixed to said panel members so as to lie in parallel planes which are parallel with said parallel planes containing said first and second leaf springs, one end of each of said channel members extending beyond an end of said panel members by a predetermined distance in a direction away from said handle member, said extending end of each of said channel members forming first and second pairs of parallel, spaced-apart legs, pairs of first and second parallel, spaced-apart cuts along a length dimension of each of said channel members so as to form a pair of oppositely directed cantilevered leaf springs for slidably supporting said channel members and said panel members which are affixed to said channel members about said first and second leaf springs, first and second tapped pins affixed to said first and second channel members, respectively, and first and second oppositely directed bow springs each of which has one end affixed to said handle member and an opposite end affixed to said tapped pins, said bow springs converting a compressive force applied thereto into a compressive component and an extensive component, said compressive component actuating said first and second leaf springs to grasp said circuit package and said extensive component shifting said channel members and said panel members affixed thereto downwardly away from said handle member thereby producing a nearly uniform perpendicular force on each of said parallel pairs of legs on said channel members to effect the extraction of said circuit package.

Claim 10

The integrated circuit extraction tool in accordance with claim 7 further including an insulative layer encasing said right-angle bends on said first and second leaf springs and said first and second pair of parallel, spaced-apart legs on said first and second channel members, said insulative layer enabling the extraction of an integrated circuit while electrical power is supplied thereto.