Pick up assembly for fragile devices

Claim 2

In an apparatus for contacting a fragile device comprising, means for supporting said fragile device in a predetermined position, a contact element containing a pick up pencil and, means for moving said contact element toward said device, said moving means including fluid means for providing a controlled deacceleration to said contact element to cause the motion of the element toward the device to be substantially zero as the element comes in contact with the device, said fluid means including a chamber having an opening to exhaust the fluid out of the apparatus and reduce the pressure on said fluid to atmospheric pressure.

Claim 3

In an apparatus for contacting a fragile device as set forth in claim 1 wherein, said fluid means further includes a chamber having a plurality of openings through which said fluid is forced out of the apparatus at a controlled rate.

Claim 4

The apparatus of claim 1 wherein said contact element comprises a hold down cylinder adjacent to said pick up pencil.

Claim 7

The apparatus of claim 4 wherein said needle is comprised of tungsten carbide and has a point radius of between 0.001 inches and 0.005 inches.

Claim 8

The apparatus of claim 4 wherein said fragile device comprises a semiconductor wafer fractured into a plurality of individual dice and said supporting means comprises a contoured head for supporting a selected dice in a preferred position over said needle and under said pencil and for supporting each of said dice adjacent to said selected device.

Claim 9

The apparatus of claim 6 wherein said hold down cylinder is contoured to mate with said contoured head and to positively hold said adjacent devices on said head.

Claim 10

The apparatus of claim 6 wherein said pencil is provided with fluid means to force said pencil against said selected dice with a predetermined pressure when said element comes into contact with fragile device.

Claim 11

The apparatus of claim 8 wherein said pencil is further provided with vacuum means for positively holding said selected dice against said pencil.

Claim 12

Pick up apparatus for semiconductor dice comprising, a sheet of adhesive material to which a plurality of dice is adhered, a needle assembly having an extendable needle and a contoured head, through which said needle can pass, for supporting a selected one of said dice in a preferred position over said needle, and a pick up head comprising a housing, upper and lower bearings in said housing, a hold down cylinder supported in said bearings and having a constrained bidirectional path, and a pencil in said hold down cylinder, each of said bearings being provided with means for providing a controlled deacceleration to said hold down cylinder as it approaches either end of said constrained path.

Claim 13

Pick up apparatus for semiconductor dice comprising, a sheet of adhesive material to which a plurality of dice is adhered, a needle assembly having an extendable needle and a contoured head, through which said needle can pass, for supporting a selected one of said dice in a preferred position over said needle, and a pick up head comprising a housing, upper and lower bearings in said housing, a hold down cylinder supported in said bearings and having a constrained bidirectional path, and a pencil in said hold down cylinder, each of said bearings being provided with means for providing a controlled deacceleration to said hold down cylinder as it approaches either end of said constrained path.

Claim 16

The apparatus of claim 11 wherein said hold down cylinder is provided with a seal bearing between said upper bearing and said lower bearing to bisect the interior of said housing and said hold down cylinder and said pencil are both provided with compressable mats.

Claim 17

The apparatus of claim 11 wherein said constant force is about 75 grms.

Claim 18

The apparatus of claim 12 wherein said mats on said hold down cylinder is contoured to mate with said contoured head on said needle assembly.

Claim 19

The apparatus of claim 11 wherein said contoured head is maintained a fixed distance from said pick up head, and said path length is sufficient to cause said hold down cylinder to positively hold down said sheet on said head held at said fixed distance and said needle extends from said housing a distance sufficient to remove said selected one of said dice from said sheet.