US3970494A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for adhering one surface to another
Assignee: AT&T Inc
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Filing: 1975-04-18
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Granted: 1976-07-20
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Expires: 1995-04-18
Abstract
Abstract A chlorinated naphthalene and a paraterphenyl are mixed to provide an adhesive for adhering a semiconductor wafer to a support for processing. The adhesive so formed may be evaporated at the end of processing the wafer, without leaving a residue, to release the devices which have been formed from the wafer.
Inventors
- 👤 Edwin J. Pritchard
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 00:53
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/70; H10P72/74; H10P72/7412; Y; Y10; Y10S; Y10S156/00; Y10S156/918; Y10S156/93; Y10T; Y10T156/00; Y10T156/10; Y10T156/1089; Y10T156/1092; Y10T156/11; Y10T29/00; Y10T29/49; Y10T29/4981; Y10T29/49812; Y10T428/00; Y10T428/31504; Y10T428/31801
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
45 words
A method for temporarily adhering one surface to another surface comprising the steps of: applying a temporary adhesive mixture comprising at least one chlorinated naphthalene and at least one terphenyl to at least one surface; and contacting one surface with the other to join them.
Claim 2
Independent Claim
45 words
A method for temporarily adhering one surface to another surface comprising the steps of: applying a temporary adhesive mixture comprising at least one chlorinated naphthalene and at least one terphenyl to at least one surface; and contacting one surface with the other to join them.
Claim 3
Independent Claim
55 words
A method for temporarily mounting an article on a support with an adhesive mixture comprising the steps of: a. applying a temporary adhesive mixture, comprising at least one chlorinated naphthalene and at least one terphenyl, to the article or support; and b. pressing the article and support together to adhere the article to the support.
Claim 4
Independent Claim
55 words
A method for temporarily mounting an article on a support with an adhesive mixture comprising the steps of: a. applying a temporary adhesive mixture, comprising at least one chlorinated naphthalene and at least one terphenyl, to the article or support; and b. pressing the article and support together to adhere the article to the support.
Claim 5
Dependent Claim
19 words
A method as recited in claim 2 wherein the mixture comprises: a. at least 8-15% by weight of p-terphenyl.
Claim 6
Dependent Claim
49 words
A method for temporarily mounting an article on a support as recited in claim 2, wherein the article is a semiconductor wafer and the temporary adhesive mixture applied comprises: a. a chlorinated naphthalene mixture comprising tetra, penta and hexa chloronaphthalene; and b. 11 to 12% by weight of p-terphenyl.
Claim 7
Dependent Claim
35 words
A method as recited in claim 4 wherein said chlorinated naphthalene mixture comprises tetra, penta and hexa chloronaphthalenes in the proportions of approximately 20, 40 and 40 percent by weight respectively, of the total chloronaphthalene.
Claim 8
Independent Claim
79 words
A method for temporarily cementing an article to a support comprising the steps of: applying an adhesive mixture comprising, in eutectic proportions, (1) a first component which comprises 20, 40 and 40 percent, respectively, of tetra, penta and hexachloronaphthalenes and (2) a second component which comprises p-terphenyl, to one surface of the article or the support to coat it with said adhesive mixture; and pressing an uncoated surface against the coated surface to adhere the article to the support.
Claim 9
Independent Claim
79 words
A method for temporarily cementing an article to a support comprising the steps of: applying an adhesive mixture comprising, in eutectic proportions, (1) a first component which comprises 20, 40 and 40 percent, respectively, of tetra, penta and hexachloronaphthalenes and (2) a second component which comprises p-terphenyl, to one surface of the article or the support to coat it with said adhesive mixture; and pressing an uncoated surface against the coated surface to adhere the article to the support.
Claim 10
Independent Claim
76 words
A method for handling a semiconductor wafer, which comprises the steps of: a. heating the wafer and support therefor; b. applying a mixture of chloronaphthalene and 8-15% p-terphenyl to the support, said chloronaphthalene comprising the tetra, penta, and hexa isomers of chloronaphthalene; c. pressing the wafer and support together to temporarily mount the wafer on the support; d. processing the wafer into individual semiconductor devices; and e. heating the support and devices to evaporate the mixture.
Claim 11
Independent Claim
76 words
A method for handling a semiconductor wafer, which comprises the steps of: a. heating the wafer and support therefor; b. applying a mixture of chloronaphthalene and 8-15% p-terphenyl to the support, said chloronaphthalene comprising the tetra, penta, and hexa isomers of chloronaphthalene; c. pressing the wafer and support together to temporarily mount the wafer on the support; d. processing the wafer into individual semiconductor devices; and e. heating the support and devices to evaporate the mixture.
Claim 12
Dependent Claim
32 words
A method for handling a semiconductor wafer as recited in claim 7 wherein the tetra, penta and hexa isomers of chloronaphthalene are respectively 20, 40 and 40 percent of the total chloronaphthalene.
Claim 13
Dependent Claim
22 words
A method for handling a semiconductor wafer as recited in claim 8 wherein the p-terphenyl comprises 8-15% by weight of the mixture.
Claim 14
Dependent Claim
23 words
A method for handling a semiconductor wafer as recited in claim 8 wherein the mixture comprises the eutectic proportions of chloronaphthalenes and p-terphenyl.
Claim 15
Dependent Claim
26 words
A method for handling a semiconductor wafer as recited in claim 8 wherein the wafer and support are cooled slowly after they have been pressed together.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1979-07-20 | 1980-01-19 | 1980-07-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1983-07-20 | 1984-01-19 | 1984-07-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1987-07-20 | 1988-01-19 | 1988-07-20 | $7700.00 | Window Closed / Lapsed |