Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
157 words
A method of mounting solar cells on a metallic panel to provide a direct thermal path between the cells and the panel comprising the steps of: coating an electrically insulative wafer with an electrically and thermally conductive coating on the top and bottom surfaces thereof; removing the conductive coating on the top surface of the coated wafer except on predetermined areas to form a number of prominences thereon, the number of said prominences being at least equal to the number of said cells; attaching said cells on said prominences, each cell being located on a different prominence; coating the surface of said panel with a coating to which it is easy to solder, said coating being thermally conductive; coating the panel coating with a soft solder capable of absorbing mechanical stresses due to thermally induced expansions, said solder being thermally conductive; and soldering the bottom surface of said solar-cell-bearing wafer to the soft-solder surface of said panel.
Claim 2
Independent Claim
157 words
A method of mounting solar cells on a metallic panel to provide a direct thermal path between the cells and the panel comprising the steps of: coating an electrically insulative wafer with an electrically and thermally conductive coating on the top and bottom surfaces thereof; removing the conductive coating on the top surface of the coated wafer except on predetermined areas to form a number of prominences thereon, the number of said prominences being at least equal to the number of said cells; attaching said cells on said prominences, each cell being located on a different prominence; coating the surface of said panel with a coating to which it is easy to solder, said coating being thermally conductive; coating the panel coating with a soft solder capable of absorbing mechanical stresses due to thermally induced expansions, said solder being thermally conductive; and soldering the bottom surface of said solar-cell-bearing wafer to the soft-solder surface of said panel.
Claim 3
Dependent Claim
14 words
A method as in claim 1, wherein: said wafer is formed from beryllium oxide.
Claim 4
Dependent Claim
25 words
A method as in claim 1, wherein: said coating on said wafer surfaces is an inner layer of chromium and an outer layer of copper.
Claim 5
Dependent Claim
14 words
A method as in claim 1, wherein: said cells are soldered on said prominences.
Claim 6
Dependent Claim
15 words
A method as in claim 1, wherein: said coating on said panel surface is copper.
Claim 7
Dependent Claim
14 words
A method as in claim 1, wherein: said soft solder is an indium solder.
Claim 8
Independent Claim
126 words
A method of mounting solar cells on a metallic panel to provide a direct thermal path between the cells and the panel comprising the steps of: coating a beryllia wafer first with chromium and then with copper on the top and bottom surfaces; removing the coating on the top surface of the wafer except on predetermined areas to form number of prominences thereon, the number of prominences being at least equal to the number of said cells; soldering said cells on said prominences, each cell being located on a different prominence; coating the surface of said panel with a copper coating; coating said panel coating with a soft indium solder; and soldering the bottom surface of said solar-cell-bearing wafer to the soft-solder surface of said panel.
Claim 9
Independent Claim
126 words
A method of mounting solar cells on a metallic panel to provide a direct thermal path between the cells and the panel comprising the steps of: coating a beryllia wafer first with chromium and then with copper on the top and bottom surfaces; removing the coating on the top surface of the wafer except on predetermined areas to form number of prominences thereon, the number of prominences being at least equal to the number of said cells; soldering said cells on said prominences, each cell being located on a different prominence; coating the surface of said panel with a copper coating; coating said panel coating with a soft indium solder; and soldering the bottom surface of said solar-cell-bearing wafer to the soft-solder surface of said panel.