Composition and method for neutralizing and sensitizing resinous surfaces and improved sensitized resinous surfaces for adherent metallization

Claim 2

In a process for producing a securely bonded layer of metal on a resinous surface by electroless metal deposition, the improvement which comprises the steps: a. treating the substrate to be metallized with an oxidizing agent; b. contacting the treated substrate with a primary neutralizer so as to effect bulk removal of said oxidizing agent from said substrate; and c. contacting the substrate with a composition comprising hydrazine and a sequestering agent capable of forming soluble complexes with at least one member of the group consisting of chromium ions and manganese ions, all prior to electroless metal deposition on said substrate.

Claim 3

The process of claim 1, wherein said sequestering agent comprises at least one member selected from the group consisting of ethylenediaminetetraacetic acid, sodium tartrate and triethanolamine.

Claim 4

The process of claim 1, wherein said composition also includes a pH adjuster.

Claim 5

The process of claim 3, wherein said pH adjuster comprises at least one member of the group consisting of sodium hydroxide, potassium hydroxide and sodium carbonate.

Claim 6

The process of claim 1, including the additional step of contacting the substrate with a solution comprising precious metal ions.

Claim 7

The process of claim 5, wherein said precious metal ions comprise at least one member of the group consisting of palladium and silver.

Claim 8

The process of claim 1, wherein said resinous surface comprises a catalytic filler.

Claim 9

The process of claim 1, wherein said oxidizing agent comprises chromic acid and said primary neutralizer comprises a strong base.

Claim 10

The process of claim 8, wherein said primary neutralizer also includes a chelating agent capable of forming soluble complexes with chromium ions.

Claim 11

In a process for producing a securely bonded layer of metal on a resinous surface by electroless metal deposition, the improvement comprising the steps: a. treating the substrate to be metallized with an oxidizing agent comprising a member of the group consisting of chromic acid and permanganate ions; b. contacting the treated substrate with a primary neutralizer so as to effect bulk removal of said oxidizing agent from said substrate; and c. contacting the substrate with an aqueous composition comprising hydrazine, a sequestering agent capable of forming soluble complexes with at least one member of the group consisting of chromium ions and manganese ions, and a pH adjuster, all prior to electroless metal deposition on said substrate.

Claim 12

In a process for producing a securely bonded layer of metal on a resinous surface by electroless metal deposition, the improvement comprising the steps: a. treating the substrate to be metallized with an oxidizing agent comprising a member of the group consisting of chromic acid and permanganate ions; b. contacting the treated substrate with a primary neutralizer so as to effect bulk removal of said oxidizing agent from said substrate; and c. contacting the substrate with an aqueous composition comprising hydrazine, a sequestering agent capable of forming soluble complexes with at least one member of the group consisting of chromium ions and manganese ions, and a pH adjuster, all prior to electroless metal deposition on said substrate.

Claim 13

The process of claim 10, wherein said pH adjuster comprises at least one member of the group consisting of sodium hydroxide, potassium hydroxide and sodium carbonate.

Claim 14

The process of claim 10, wherein said sequestering agent comprises at least one member of the group consisting of ethylenediaminetetraacetic acid, sodium tartrate and triethanolamine.

Claim 15

A process for producing a securely bonded layer of metal on a catalytic resinous surface by electroless metal deposition, said process comprising the steps: a. treating the substrate to be metallized with an oxidizing agent; b. contacting the treated substrate with a primary neutralizer so as to effect bulk removal of said oxidizing agent from said substrate; c. contacting the neutralized substrate with a composition comprising hydrazine and a sequestering agent capable of forming soluble complexes with at least one member of the group consisting of chromium ions and manganese ions; and d. metallizing said substrate in an electroless metal deposition bath.

Claim 16

A process for producing a securely bonded layer of metal on a catalytic resinous surface by electroless metal deposition, said process comprising the steps: a. treating the substrate to be metallized with an oxidizing agent; b. contacting the treated substrate with a primary neutralizer so as to effect bulk removal of said oxidizing agent from said substrate; c. contacting the neutralized substrate with a composition comprising hydrazine and a sequestering agent capable of forming soluble complexes with at least one member of the group consisting of chromium ions and manganese ions; and d. metallizing said substrate in an electroless metal deposition bath.

Claim 17

The process of claim 13, wherein said composition also comprises water and a pH adjuster.

Claim 18

The process of claim 14, wherein said pH adjuster comprises at least one member of the group consisting of sodium hydroxide, potassium hydroxide and sodium carbonate.

Claim 19

The process of claim 15, wherein said sequestering agent comprises at least one member selected from the group consisting of ethylenediaminetetraacetic acid, sodium tartrate and triethanolamine.

Claim 20

A process for producing a securely bonded layer of metal on a resinous surface by electroless metal deposition, said process comprising the steps: a. treating the substrate to be metallized with an oxidizing agent; b. contacting the treated substrate with a primary neutralizer so as to effect bulk removal of said oxidizing agent from said substrate; c. contacting the neutralized substrate with a composition comprising hydrazine and a sequestering agent capable of forming soluble complexes with at least one member of the group consisting of chromium ions and manganese ions; d. contacting the substrate with a solution comprising precious metal ions; and e. metallizing said substrate in an electroless metal deposition bath.

Claim 21

A process for producing a securely bonded layer of metal on a resinous surface by electroless metal deposition, said process comprising the steps: a. treating the substrate to be metallized with an oxidizing agent; b. contacting the treated substrate with a primary neutralizer so as to effect bulk removal of said oxidizing agent from said substrate; c. contacting the neutralized substrate with a composition comprising hydrazine and a sequestering agent capable of forming soluble complexes with at least one member of the group consisting of chromium ions and manganese ions; d. contacting the substrate with a solution comprising precious metal ions; and e. metallizing said substrate in an electroless metal deposition bath.

Claim 22

The process of claim 17, wherein said composition also comprises water and a pH adjuster.

Claim 23

The process of claim 18, wherein said pH adjuster comprises at least one member of the group consisting of sodium hydroxide, potassium hydroxide and sodium carbonate.

Claim 24

The process of claim 19, wherein said sequestering agent comprises at least one member selected from the group consisting of ethylenediaminetetraacetic acid, sodium tartrate and triethanolamine.