Abstract A solderless filter assembly wherein a filter in the form of a sleeve having a hollow bore extending therethrough is placed in electrical contact with a mounting body positioned therearound and an electrically conductive pin passing through the bore of the filter without requirement of solder. This is accomplished by providing an internal spring positioned around the pin and having convex tines thereon which provide a pressure fit with the internal diameter of the filter sleeve and is frictionally locked onto the pin. A second spring having concave tines is positioned around the outer diameter of the filter sleeve and provides a pressure fit therewith, the outer spring also making electrical contact with the shell or mounting body surrounding the filter. The filter sleeve and spring members are isolated from the external environment by pot stops which are positioned within cut out regions of the mounting body. Potting material is then placed into the hollow regions in the mounting body and against the pot stop to lock the pin in place within the mounting body by providing a bond to both the pin and the mounting body as well as to the pot stop. One end of the pin has an enlarged region positioned within the potting material to prevent lateral or rotational movement of the pin after formation of the filter assembly. The mounting body also can include threads thereon for threading the filter assembly into a bulkhead or the like directly or for securing the filter assembly into a bulkhead by means of a mating nut. In addition, the mounting body can be made straight and the filter assembly can be soldered into the bulkhead.
A solderless filter assembly, comprising: a feed-through type filter of sleeve configuration, a conductive pin, a first resilient spring connecting an internal surface of said filter to said conductive pin projecting through said filter, a conductive housing receiving said filter and said pin, a second resilient spring received in said housing against an internal flange and electrically connecting an external surface of said filter with an internal surface of said housing, opposite ends of said housing being provided with corresponding recesses, opposite ends of said pin projecting outwardly of said recesses, nonconductive sealing means press-fit internally of each recess and in encirclement about said pin for sealing said filter and said first and second springs internally of said housing, and nonconductive potting material in said recesses provided in said housing bonded to said housing and bonded in encirclement about said pin.
Claim 2
Dependent Claim
141 words
A solderless filter assembly, comprising: a feed-through type filter of sleeve configuration, a conductive pin, a first resilient spring connecting an internal surface of said filter to said conductive pin projecting through said filter, a conductive housing receiving said filter and said pin, a second resilient spring received in said housing against an internal flange and electrically connecting an external surface of said filter with an internal surface of said housing, opposite ends of said housing being provided with corresponding recesses, opposite ends of said pin projecting outwardly of said recesses, nonconductive sealing means press-fit internally of each recess and in encirclement about said pin for sealing said filter and said first and second springs internally of said housing, and nonconductive potting material in said recesses provided in said housing bonded to said housing and bonded in encirclement about said pin.
Claim 3
Dependent Claim
48 words
The structure as recited in claim 1, wherein, one end of said pin includes a region of non-uniform shape freely disposed within one of said recesses provided in said housing, said potting material bonding to said non-uniform shape and to said housing to prevent movement of said pin.