US3950142A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Lead assembly for semiconductive device
Assignee: GTE Sylvania Inc
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Filing: 1974-08-05
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Granted: 1976-04-13
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Expires: 1994-08-05
Abstract
Abstract An improved lead assembly adapted for utilization in a semiconductor device having a glass envelope, an electrical device positioned within said envelope having at least one end surface, said lead assembly comprising a metallic seal member adapted for extending through and bonding to said glass envelope and affixing to said end surface of said electrical device along a first common interface, and a metallic lead member bonded along a second common interface to said metallic seal member, said second common interface located externally of said glass envelope. The improvement comprises providing a secondary path for heat transfer in the form of a substantially uniform copper coating along the entire first common interface between said electrical device and said seal member to thereby facilitate the removal of heat from within said semiconductive device.
Inventors
- 👤 Robert R. Brenan
- 👤 Robert W. Smith
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 20:49
CPC Classifications
H; H10; H10W; H10W72/00; H10W70/00; H10W70/20; H10W76/00; H10W76/10; H10W76/12; H10W76/161; Y; Y10; Y10S; Y10S228/00; Y10S228/903; Y10S428/00; Y10S428/922; Y10S428/9335; Y10S428/934; Y10S428/935; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169; Y10T29/49171; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12535; Y10T428/12597; Y10T428/12771; Y10T428/12861; Y10T428/12903; Y10T428/1291
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
165 words
In a lead assembly adapted for utilization in a semiconductive device having a glass envelope and an electrical device positioned within said envelope having at least one end surface, said lead assembly comprising a metallic seal member having an outer portion adapted for providing a first path of heat transfer, said seal member further adapted for extending through and bonding to said glass envelope and affixing to said end surface of said electrical device along a first common interface, and a metallic lead member bonded along a second common interface to said metallic seal member, said second common interface located externally of said glass envelope, the improvement comprising: providing a substantially uniform copper coating along the entirety of said first common interface between said electrical device and said seal member to provide a second path for heat transfer and thereby facilitate the removal of heat from within said semiconductive device, said copper coating not providing a bond between said electrical device and said seal member.
Claim 2
Dependent Claim
165 words
In a lead assembly adapted for utilization in a semiconductive device having a glass envelope and an electrical device positioned within said envelope having at least one end surface, said lead assembly comprising a metallic seal member having an outer portion adapted for providing a first path of heat transfer, said seal member further adapted for extending through and bonding to said glass envelope and affixing to said end surface of said electrical device along a first common interface, and a metallic lead member bonded along a second common interface to said metallic seal member, said second common interface located externally of said glass envelope, the improvement comprising: providing a substantially uniform copper coating along the entirety of said first common interface between said electrical device and said seal member to provide a second path for heat transfer and thereby facilitate the removal of heat from within said semiconductive device, said copper coating not providing a bond between said electrical device and said seal member.
Claim 3
Dependent Claim
21 words
The improvement according to claim 1 wherein the core material for said seal member is of a nickel and iron composition.
Claim 4
Dependent Claim
31 words
The improvement according to claim 1 wherein the method for providing said uniform copper coating along said first common interface between said metallic seal member and said electrical device is electroplating.
Claim 5
Dependent Claim
39 words
The improvement according to claim 1 further including a third path of heat transfer in the form of a substantially uniform copper coating along the entirety of said second common interface between said seal member and said lead member.
Claim 6
Dependent Claim
31 words
The improvement according to claim 1 further including a substantially uniform copper coating along the entirety of said lead member to thereby further facilitate removal of heat from said semiconductive device.
Claim 7
Dependent Claim
201 words
A process for making an improved semiconductive device having a glass envelope, an electrical device positioned within said envelope and having at least one end surface, and at least one lead assembly comprising a metallic seal member having an outer portion adapted for providing a first path of heat transfer, said metallic seal member further adapted for extending through and bonding to said glass envelope and affixing to said end surface of said electrical device along a first common interface, and a metallic lead member bonded along a second common interface to said seal member, said second common interface located externally of said glass envelope, said process comprising: applying a substantially uniform copper coating to the external surface of said metallic seal member; and thereafter metallurgically bonding said metallic seal member to said metallic lead member, said glass envelope, and said end surface of said electrical device whereby said substantially uniform copper coating will be located along the entirety of said first common interface between said seal member and said end surface of said electrical device to thereby facilitate removal of heat from said semiconductive device, said copper coating not providing a bond between said seal member and said electrical device.
Claim 8
Dependent Claim
201 words
A process for making an improved semiconductive device having a glass envelope, an electrical device positioned within said envelope and having at least one end surface, and at least one lead assembly comprising a metallic seal member having an outer portion adapted for providing a first path of heat transfer, said metallic seal member further adapted for extending through and bonding to said glass envelope and affixing to said end surface of said electrical device along a first common interface, and a metallic lead member bonded along a second common interface to said seal member, said second common interface located externally of said glass envelope, said process comprising: applying a substantially uniform copper coating to the external surface of said metallic seal member; and thereafter metallurgically bonding said metallic seal member to said metallic lead member, said glass envelope, and said end surface of said electrical device whereby said substantially uniform copper coating will be located along the entirety of said first common interface between said seal member and said end surface of said electrical device to thereby facilitate removal of heat from said semiconductive device, said copper coating not providing a bond between said seal member and said electrical device.
Claim 9
Dependent Claim
23 words
The process according to claim 6 wherein the method for applying said substantially uniform copper coating to said metallic seal member is electroplating.
Claim 10
Dependent Claim
57 words
The process according to claim 7 further including the step of applying a substantially uniform copper coating to said metallic seal member whereby a substantially uniform copper coating will be positioned along the entirety of said second common interface between said seal member and said lead member to further facilitate removal of heat from said semiconductive device.
Claim 11
Dependent Claim
38 words
The process according to claim 6 further including the step of applying a substantially uniform copper coating along the entirety of the external surface of said lead member to thereby facilitate removal of heat from said semiconductive device.
Claim 12
Dependent Claim
16 words
The process according to claim 8 wherein the method for applying said copper coating is electroplating.
Claim 13
Dependent Claim
16 words
The process according to claim 9 wherein the method for applying said copper coating is electroplating.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1979-04-13 | 1979-10-13 | 1980-04-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1983-04-13 | 1983-10-13 | 1984-04-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1987-04-13 | 1987-10-13 | 1988-04-13 | $7700.00 | Window Closed / Lapsed |