Synergistic peroxide cures for high vinyl rubbers

Claim 2

A peroxide cured high vinyl resin composition comprising by weight, 100 parts of a peroxide cured resin selected from the class consisting of a homopolymer of butadiene or a copolymer of butadiene and styrene containing at least 40 percent of butadiene, at least 80 percent of the butadiene repeating units in the polymer or copolymer being in the 1,2-configuration, said resin cured utilizing from 0.4 to about 4.0 parts based upon an equivalent amount of dicumyl peroxide of a peroxide curing agent selected from a first class consisting of dicumyl peroxide, bis (t-butylperoxy) diisopropyl benzene, t-butyl perbenzoate, and n-butyl 4,4-bis (t-butylperoxy) valerate and from 0.25 to about 2.5 parts based upon an equivalent amount of dicumyl peroxide of a peroxide curing agent selected from a second class consisting of benzoyl peroxide, bis (4-t-butylcyclohexyl) peroxydicarbonate, t-butyl peroctoate, 2,5-dimethyl-2,5-bis(t-butylperoxy)-hexane, 2,5-dimethyl-2,5-bis (t-butylperoxy)-hexyne-3, and t-butyl hydroperoxide.

Claim 3

A cured high vinyl resin composition according to claim 1, wherein the amount of said first class of peroxide ranges from about 1.5 to about 3.0 parts and the amount of said second class of peroxide ranges from about 0.5 to about 2.0.

Claim 4

A cured high vinyl resin composition according to claim 1, wherein the ratio of the amount of peroxide of said first class to the amount of peroxide of said second class is 1.1 to about 3.5.

Claim 5

A cured high vinyl resin composition according to claim 1, wherein said second class of peroxide is selected from the group consisting of benzoyl peroxide, bis(4-t-butylcyclohexyl) peroxydicarbonate and 2,5-dimethyl-2,5-bis(t-butylperoxy)-hexane.

Claim 6

A cured high vinyl resin composition according to claim 1, wherein said dicuymyl peroxide, bis(t-butylperoxy) diiosopropyl benzene and t-butyl perbenzoate is in combination with benzoyl peroxide.

Claim 7

A curable high vinyl polybutadiene composition comprising by weight, 100 parts of a curable resin selected from the class consisting of a homopolymer of butadiene or a copolymer of butadiene and styrene containing at least 40 percent of butadiene, at least 80 percent of the butadiene repeating units in the polymer or copolymer being in the 1,2-configuration, from 0.4 to about 4.0 parts based upon an equivalent amount of dicuymyl peroxide of a peroxide curing agent selected from a first class consisting of dicumyl peroxide, t-butyl perbenzoate, bis (t-butylperoxy) diisopropyl benzene, and n-butyl perbenzoate, bis(t-butylperoxy) valerate and from 0.25 to about 2.5 parts based upon an equivalent amount of dicumyl peroxide of a peroxide curing agent selected from a second class consisting of benzoyl peroxide, bis (4-t-butylcyclohexyl) peroxydicarbonate, t-butyl peroctoate, 2,5-dimethyl-2,5-bis (t-butylperoxy)-hexane, 2,5-dimethyl-2,5-bis(t-butylperoxy)-hexyne-3, and t-butyl hydroperoxide.

Claim 8

A curable high vinyl polybutadiene composition comprising by weight, 100 parts of a curable resin selected from the class consisting of a homopolymer of butadiene or a copolymer of butadiene and styrene containing at least 40 percent of butadiene, at least 80 percent of the butadiene repeating units in the polymer or copolymer being in the 1,2-configuration, from 0.4 to about 4.0 parts based upon an equivalent amount of dicuymyl peroxide of a peroxide curing agent selected from a first class consisting of dicumyl peroxide, t-butyl perbenzoate, bis (t-butylperoxy) diisopropyl benzene, and n-butyl perbenzoate, bis(t-butylperoxy) valerate and from 0.25 to about 2.5 parts based upon an equivalent amount of dicumyl peroxide of a peroxide curing agent selected from a second class consisting of benzoyl peroxide, bis (4-t-butylcyclohexyl) peroxydicarbonate, t-butyl peroctoate, 2,5-dimethyl-2,5-bis (t-butylperoxy)-hexane, 2,5-dimethyl-2,5-bis(t-butylperoxy)-hexyne-3, and t-butyl hydroperoxide.

Claim 9

A curable high vinyl composition according to claim 6, wherein the amount of said first class of peroxide ranges from about 1.5 to about 3.0 and the amount of said second class of peroxide ranges from about 0.5 to about 2.0.

Claim 10

A curable high vinyl composition according to claim 6, wherein the ratio of the amount of peroxide of said first class to the amount of peroxide of said second class is about 1.1 to about 3.5.

Claim 11

A curable high vinyl composition according to claim 6, wherein said second class of peroxide is selected from the group consisting of benzoyl peroxide, bis(4-t-butylcyclohexyl) peroxydicarbonate and 2,5-dimethyl-2,5-bis(t-butylperoxy)-hexane.

Claim 12

A curable high vinyl composition according to claim 7, wherein said dicumyl peroxide, bis (t-butylperoxy) diiosopropyl benzene and t-butyl perbenzoate is in combination with benzoyl peroxide.

Claim 13

A process for producing a cured high vinyl resin, composition comprising the steps of, adding by weight 100 parts of a curable resin selected from the class consisting of a homopolymer of butadiene or a copolymer of butadiene and styrene containing at least 40 percent of polybutadiene, at least 80 percent of the polybutadiene repeating units in the polymer or copolymer being in the 1,2configuration, adding from 0.4 to about 4.0 parts based upon an equivalent amount of dicumyl peroxide of a peroxide curing agent selected from a first class consisting of dicumyl peroxide, t-butyl perbenzoate, bis (t-butylperoxy) diisopropyl benzene, and n-butyl 4,4-bis (t-butylperoxy) valerate and adding from 0.2 to about 2.5 parts based upon an equivalent amount of dicumyl peroxide of a peroxide curing agent selected from a second class consisting of benzoyl peroxide, bis (4-t-butylcyclohexyl) peroxydicarbonate, t-butyl hydroperoxide, t-butyl peroctoate, 2,5-dimethyl-2,5-bis(t-butylperoxy)-hexane and 2,5-dimethyl-2,5-bis(t-butylperoxy)-hexyne-3 and then curing said curable resin.

Claim 14

A process for producing a cured high vinyl resin, composition comprising the steps of, adding by weight 100 parts of a curable resin selected from the class consisting of a homopolymer of butadiene or a copolymer of butadiene and styrene containing at least 40 percent of polybutadiene, at least 80 percent of the polybutadiene repeating units in the polymer or copolymer being in the 1,2configuration, adding from 0.4 to about 4.0 parts based upon an equivalent amount of dicumyl peroxide of a peroxide curing agent selected from a first class consisting of dicumyl peroxide, t-butyl perbenzoate, bis (t-butylperoxy) diisopropyl benzene, and n-butyl 4,4-bis (t-butylperoxy) valerate and adding from 0.2 to about 2.5 parts based upon an equivalent amount of dicumyl peroxide of a peroxide curing agent selected from a second class consisting of benzoyl peroxide, bis (4-t-butylcyclohexyl) peroxydicarbonate, t-butyl hydroperoxide, t-butyl peroctoate, 2,5-dimethyl-2,5-bis(t-butylperoxy)-hexane and 2,5-dimethyl-2,5-bis(t-butylperoxy)-hexyne-3 and then curing said curable resin.

Claim 15

A process according to claim 11, wherein the amount of said first class of peroxide ranges from about 1.5 to about 3.0 and the amount of said second class of peroxide ranges from about 0.5 to about 2.0.

Claim 16

A process according to claim 11, wherein the ratio of the amount of peroxide of said first class to the amount of peroxides of said second class is about 1.1 to about 3.5.

Claim 17

A process according to claim 11, wherein said second class of peroxide is selected from the group consisting of benzoyl peroxide, bis(4-t-butylcyclohexyl) peroxydicarbonate and 2,5-dimethyl-2,5-bis(t-butylperoxy)-hexane.

Claim 18

A process according to claim 11, wherein said dicumyl peroxide, bis (t-butylperoxy) diiosopropyl benzene and t-butyl perbenzoate is in combination with benzoyl peroxide.

Claim 19

A peroxide cured high vinyl resin composition according to claim 1 wherein at least 90 percent of the butadiene repeating units are in the 1,2 configuration.

Claim 20

A cured high vinyl resin composition according to claim 1, wherein the amount of said first class peroxide agent is about 2 parts of the amount of said second class of peroxide agent is about 1 part.

Claim 21

A cured high vinyl resin composition according to claim 1, wherein said first peroxide curing agent is dicumyl peroxide and said second class of peroxide curing agent is selected from the class consisting of bis (4-t-butylcyclohexyl) peroxydicarbonate and 2,5-dimethyl-2,5-bis(t-butylperoxy)-hexane.

Claim 22

A curable high vinyl polybutadiene composition according to claim 6, wherein at least 90 percent of the butadiene repeating units are in the 1,2 configuration.

Claim 23

A curable high vinyl polybutadiene composition according to claim 6, wherein the amount of said first class peroxide agent is about 2 and the amount of said second class peroxide agent is about 1.

Claim 24

A curable high vinyl polybutadiene composition according to claim 6, wherein said first class peroxide curing agent is dicumyl peroxide and the second class peroxide curing agent is selected from the class consisting of bis(4-t-butylcyclohexyl) peroxydicarbonate and 2,5-dimethyl-2,5-bis(t-butylperoxy)-hexane.

Claim 25

A process according to claim 11, wherein at least 90 percent of the polybutadiene repeating units are in the 1,2 configuration.

Claim 26

A process according to claim 11, wherein the amount of said first class peroxide agent is about 2 and the amount of second class of peroxide agent is about 1.

Claim 27

A process according to claim 11, wherein said first class curing agent is dicumyl peroxide and said second class peroxide curing agent is selected from the class consisting of bis (4-t-butylcyclohexyl) peroxydicarbonate and 2,5-dimethyl-2,5-bis(t-butylperoxy)-hexane.