US3935986A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Solid state bonding process employing the isothermal solidification of a liquid interface
Assignee: Texas Instruments Inc
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Filing: 1975-03-03
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Granted: 1976-02-03
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Expires: 1995-03-03
Abstract
Abstract A solid state bonding process of malleable metals employing the isothermal solidification of a liquid interface to overcome bonding problems inherent in certain material combinations especially when subjected to high annealing temperatures. The technique employs the use of a solid metal interliner clad between the two components to be bonded which has a lower melting point than the adjacent components, is diffusible into either one or both of the adjacent components and maintains ductility after alloying with the adjacent components. The composite material is then heat treated above the melting point of the interliner causing momentary liquifying of the interliner, diffusing the liquid metal into either one or both of the adjacent components thereby forming a progressively higher melting point alloy and subsequent isothermal solidification of the high melting alloy to securely bond the two components together.
Inventors
- 👤 Pasquale R. Lattari
- 👤 Carl Redfield
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 12:25
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/001; B23K20/00; B23K20/16
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
156 words
An improved system for bonding selected metals comprising: arranging an interliner metal layer between a first and a second layer, said interliner layer having a lower initial melting temperature than either the first or second layers and being heat diffusible with at least one of said layers to form a ductile alloy having a relatively higher melting temperature. solid state pressure bonding said interliner and said layers to form a composite material, and post bond heating of said metal layers at a temperature above said initial melting temperature of said interliner layer and below said relatively higher melting temperature of said alloy for sufficient time to melt said interliner and initiate diffusion of said intermediate layer meterial with at least said one of the two layers to form a layer of said new alloy of higher melting point and to solidify said new alloy layer for securely bonding said first and second layers of metal together.
Claim 2
Dependent Claim
156 words
An improved system for bonding selected metals comprising: arranging an interliner metal layer between a first and a second layer, said interliner layer having a lower initial melting temperature than either the first or second layers and being heat diffusible with at least one of said layers to form a ductile alloy having a relatively higher melting temperature. solid state pressure bonding said interliner and said layers to form a composite material, and post bond heating of said metal layers at a temperature above said initial melting temperature of said interliner layer and below said relatively higher melting temperature of said alloy for sufficient time to melt said interliner and initiate diffusion of said intermediate layer meterial with at least said one of the two layers to form a layer of said new alloy of higher melting point and to solidify said new alloy layer for securely bonding said first and second layers of metal together.
Claim 3
Dependent Claim
33 words
An improved system for bonding as set forth in claim 1 wherein said first layer is silver or a high silver alloy and said second layer is copper or a high copper alloy.
Claim 4
Dependent Claim
33 words
An improved system for bonding as set forth in claim 2 wherein the composition by weight of said interliner is 52 percent silver, 16 percent copper, 15.5 percent zinc, and 16.5 percent cadmium.
Claim 5
Dependent Claim
27 words
An improved system for bonding as set forth in claim 2 wherein the composition by weight of said interliner is 72 percent silver and 28 percent copper.
Claim 6
Dependent Claim
194 words
An improved system for bonding a first layer of silver or silver alloy component to a second layer of copper or copper component to a third layer of a high work hardening component comprising: arranging an interliner metal layer between the first and the second layer, said interliner layer having a lower initial melting temperature than any of the layers and being heat diffusible with at least one of said adjacent layers to form a ductile alloy having a relatively higher melting temperature, solid state pressure bonding said interliner and said layers to form a composite material, and post bond heating of said metal layers at a temperature above the recrystallization temperature of said high work hardening layer and initial melting temperature of said interliner layer and below said relatively higher melting temperature of said alloy for sufficient time to recrystallize said work hardening layer and to melt said interliner and initiate diffusion of said interliner layer material with at least one of the two adjacent layers to form a layer of said new alloy of higher melting point and to solidify said new alloy layer for securely bonding said layers of metal together.
Claim 7
Dependent Claim
194 words
An improved system for bonding a first layer of silver or silver alloy component to a second layer of copper or copper component to a third layer of a high work hardening component comprising: arranging an interliner metal layer between the first and the second layer, said interliner layer having a lower initial melting temperature than any of the layers and being heat diffusible with at least one of said adjacent layers to form a ductile alloy having a relatively higher melting temperature, solid state pressure bonding said interliner and said layers to form a composite material, and post bond heating of said metal layers at a temperature above the recrystallization temperature of said high work hardening layer and initial melting temperature of said interliner layer and below said relatively higher melting temperature of said alloy for sufficient time to recrystallize said work hardening layer and to melt said interliner and initiate diffusion of said interliner layer material with at least one of the two adjacent layers to form a layer of said new alloy of higher melting point and to solidify said new alloy layer for securely bonding said layers of metal together.
Claim 8
Dependent Claim
37 words
An improved system for bonding as set forth in claim 5 wherein the third layer of a high work hardening component is selected from a group cnsisting of low carbon steel, nickel, monel, and ferritic stainless steel.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1979-02-02 | 1979-08-04 | 1980-02-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1983-02-02 | 1983-08-04 | 1984-02-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1987-02-02 | 1987-08-04 | 1988-02-03 | $7700.00 | Window Closed / Lapsed |