US3933755A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Melamine, formaldehyde, thiourea and diol ether thermosetting resin and method of preparing the same
Assignee: Evonik Operations GmbH
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Filing: 1974-05-22
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Granted: 1976-01-20
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Expires: 1994-05-22
Abstract
Abstract A thermosetting resin useful for attaching decorative paper facings to chipboard and like cellulosic panels is prepared by condensation of melamine with thiourea, formaldehyde, and a diol ether, up to one half by weight of the melamine being capable of being replaced by urea without seriously effecting the quality of the resin.
Inventors
- 👤 Horst Michaud
- 👤 Josef Seeholzer
- 👤 Ludwig Pentzel
- 👤 Josefa Mangs
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 16:16
CPC Classifications
C; C09; C09J; C09J161/00; C09J161/20; C09J161/30; C08; C08G; C08G12/00; C08G12/02; C08G12/26; C08G12/34; C08G12/36; C08G12/38; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31942; Y10T428/31949; Y10T428/31964
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
158 words
A thermosetting resin composition capable of bonding paper to clipboard within two minutes at a temperature of 160°C and a pressure of 20 kg/cm 2 when mixed with 0.05% formamidinesulfinic acid, the resulting bond between said paper and said clipboard being stable at said temperature at atmospheric pressure, said resin composition essentially consisting of a liquid condensation mixture obtained by heating melamine, formaldehyde, thiourea, and a diol ether at 80° - 100°C and pH 8.6 - 8.8 until the condensation mixture first becomes turbid at 20°C when diluted with water to a solids content of 10% - 50%, said diol ether being of the formula HO--(CH 2 ) m --O--(CH 2 ) m --OH, wherein m is 2 or 3, the amount of said thiourea being 0.08 to 0.12 mole, the amount of said formaldehyde being 2 moles, and the amount of said diol ether being between 0.06 and 0.13 mole, said amounts being per mole of melamine.
Claim 2
Dependent Claim
158 words
A thermosetting resin composition capable of bonding paper to clipboard within two minutes at a temperature of 160°C and a pressure of 20 kg/cm 2 when mixed with 0.05% formamidinesulfinic acid, the resulting bond between said paper and said clipboard being stable at said temperature at atmospheric pressure, said resin composition essentially consisting of a liquid condensation mixture obtained by heating melamine, formaldehyde, thiourea, and a diol ether at 80° - 100°C and pH 8.6 - 8.8 until the condensation mixture first becomes turbid at 20°C when diluted with water to a solids content of 10% - 50%, said diol ether being of the formula HO--(CH 2 ) m --O--(CH 2 ) m --OH, wherein m is 2 or 3, the amount of said thiourea being 0.08 to 0.12 mole, the amount of said formaldehyde being 2 moles, and the amount of said diol ether being between 0.06 and 0.13 mole, said amounts being per mole of melamine.
Claim 3
Dependent Claim
21 words
A resin composition as set forth in claim 1, further comprising 0.2 to 0.4 mole urea per mole of said melamine.
Claim 4
Dependent Claim
33 words
A resin composition as set forth in claim 1, the specific gravity of said composition being 1.24 to 1.26 at 20°C, and the index of refraction thereof being 1.48 to 1.50 at 20°C.
References Cited (Backward Citations)
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US2329651A
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US2358276A
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US2456568A
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US2839484A
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US3488310A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1979-01-19 | 1979-07-21 | 1980-01-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1983-01-19 | 1983-07-21 | 1984-01-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1987-01-19 | 1987-07-21 | 1988-01-20 | $7700.00 | Window Closed / Lapsed |