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US3929516A Expired / Lapsed US ⏱️ 0.0 years remaining

Process for producing Cu-base alloys

Assignee: Olin Corp
•
Filing: 1974-08-30
•
Granted: 1975-12-30
•
Expires: 1994-08-30
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Abstract

Abstract A processing method for certain copper base alloys is described which reduces or eliminates the tendency for blister formation during annealing of alloy strip. The problem involves the formation of internal voids and subsequent migration and expansion of hydrogen within these voids, and the solution to the problem includes annealing under carefully controlled conditions of temperature and metal thickness so as to reduce the hydrogen level followed by a controlled deformation which heals the internal defects.

Inventors

  • 👤 Harvey P Cheskis
  • 👤 Stanley Shapiro
  • 👤 Michael J Pryor

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-27 02:36
CPC Classifications
C; C22; C22F; C22F1/00; C22F1/08

Claims Analysis

Total Claims: 26
Claim 1
Independent Claim 81 words
A METHOD FOR PRODUCING BLISTER FREE COPPER ALLOY MATERIAL USING AS A STARTING MATERIAL A COPPER ALLOY WHICH HAS BEEN HOT WORKED AT LEAST 50 PERCENT TO A THICKNESS OF FROM 0.200 TO 0.750 INCH INCLUDING THE STEPS OF: A. ANNEALING THE COPPER ALLOY MATERIAL AT A TEMPERATURE OF FROM 40 T0 70 PERCENT OF THE ABSOLUTE MELTING TEMPERATURE OF THE ALLOY FOR A TIME OF FROM 1 TO 24 HOURS; AND B. COLD WORKING THE MATERIAL AT LEAST 60 PERCENT.
Claim 2
Independent Claim 81 words
A METHOD FOR PRODUCING BLISTER FREE COPPER ALLOY MATERIAL USING AS A STARTING MATERIAL A COPPER ALLOY WHICH HAS BEEN HOT WORKED AT LEAST 50 PERCENT TO A THICKNESS OF FROM 0.200 TO 0.750 INCH INCLUDING THE STEPS OF: A. ANNEALING THE COPPER ALLOY MATERIAL AT A TEMPERATURE OF FROM 40 T0 70 PERCENT OF THE ABSOLUTE MELTING TEMPERATURE OF THE ALLOY FOR A TIME OF FROM 1 TO 24 HOURS; AND B. COLD WORKING THE MATERIAL AT LEAST 60 PERCENT.
Claim 3
Dependent Claim 32 words
A method as in claim 1 wherein the starting material contains from 2.5 to 3.1 percent aluminum, from 1.5 to 2.1 percent silicon, from 0.25 to 0.55 percent cobalt, balance essentially copper.
Claim 4
Dependent Claim 25 words
A method as in claim 1 wherein the hot worked starting material has been reduced in area by at least 75 percent during hot working.
Claim 5
Dependent Claim 19 words
A method as in claim 1 wherein the thickness of the starting material is from 0.300 to 0.500 inch.
Claim 6
Dependent Claim 16 words
A method as in claim 1 wherein Step A is performed in a protective reducing atmosphere.
Claim 7
Dependent Claim 17 words
A method as in claim 1 wherein the deformation in Step B is at least 75 percent.
Claim 8
Independent Claim 97 words
A method for producing annealed blister free copper alloy material using as a starting material a copper alloy which has been hot worked at least 50 percent to a thickness from 0.200 to 0.750 inch including the steps of: A. annealing the copper alloy material at a temperature of from 40 to 70 percent of the absolute melting temperature of the alloy for a time of from 1 to 24 hours; B. cold working the material at least 40 percent at a temperature of less than the temperature used in Step A; and C. annealing the material.
Claim 9
Independent Claim 97 words
A method for producing annealed blister free copper alloy material using as a starting material a copper alloy which has been hot worked at least 50 percent to a thickness from 0.200 to 0.750 inch including the steps of: A. annealing the copper alloy material at a temperature of from 40 to 70 percent of the absolute melting temperature of the alloy for a time of from 1 to 24 hours; B. cold working the material at least 40 percent at a temperature of less than the temperature used in Step A; and C. annealing the material.
Claim 10
Dependent Claim 32 words
A method as in claim 7 wherein the starting material contains from 2.5 to 3.1 percent aluminum, from 1.5 to 2.1 percent silicon, from 0.25 to 0.55 percent cobalt, balance essentially copper.
Claim 11
Dependent Claim 25 words
A method as in claim 7 wherein the hot worked starting material has been reduced in area by at least 75 percent during hot working.
Claim 12
Dependent Claim 19 words
A method as in claim 7 wherein the thickness of the starting material is from 0.300 to 0.500 inch.
Claim 13
Dependent Claim 16 words
A method as in claim 7 wherein Step A is performed in a protective reducing atmosphere.
Claim 14
Dependent Claim 18 words
A method as in claim 7 wherein the deformation as in Step B is at least 75 percent.
Claim 15
Independent Claim 72 words
A method for producing blister free copper alloy material including the steps of: A. hot working the alloy at least 50 percent to a thickness of from 0.200 to 0.750 inch; B. annealing the copper material at a temperature of from 40 to 70 percent of the absolute melting temperature of the alloy for a time of from 1 to 24 hours; and C. cold working the material at least 60 percent.
Claim 16
Independent Claim 72 words
A method for producing blister free copper alloy material including the steps of: A. hot working the alloy at least 50 percent to a thickness of from 0.200 to 0.750 inch; B. annealing the copper material at a temperature of from 40 to 70 percent of the absolute melting temperature of the alloy for a time of from 1 to 24 hours; and C. cold working the material at least 60 percent.
Claim 17
Dependent Claim 32 words
A method as in claim 13 wherein the starting material contains from 2.5 to 3.1 percent aluminum, from 1.5 to 2.1 percent silicon, from 0.25 to 0.55 percent cobalt, balance essentially copper.
Claim 18
Dependent Claim 18 words
A method as in claim 13 wherein the material is reduced at least 75 percent during Step A.
Claim 19
Dependent Claim 23 words
A method as in claim 13 wherein the thickness of the copper alloy material following Step A is from 0.300 to 0.500 inch.
Claim 20
Dependent Claim 17 words
A method as in claim 13 wherein the deformation in Step C is at least 75 percent.
Claim 21
Independent Claim 76 words
A method for producing blister free copper alloy material including the steps of: A. hot working the alloy at least 50 percent to a thickness of from 0.200 to 0.750 inch; B. annealing the copper material at a temperature of from 40 to 70 percent of the absolute melting temperature of the alloy for a time of from 1 to 24 hours; C. cold working the material at least 40 percent; and D. annealing the material.
Claim 22
Independent Claim 76 words
A method for producing blister free copper alloy material including the steps of: A. hot working the alloy at least 50 percent to a thickness of from 0.200 to 0.750 inch; B. annealing the copper material at a temperature of from 40 to 70 percent of the absolute melting temperature of the alloy for a time of from 1 to 24 hours; C. cold working the material at least 40 percent; and D. annealing the material.
Claim 23
Dependent Claim 32 words
A method as in claim 18 wherein the starting material contains from .25 to 3.1 percent aluminum, from 1.5 to 2.1 percent silicon, from 0.25 to 0.55 percent cobalt, balance essentially copper.
Claim 24
Dependent Claim 18 words
A method as in claim 18 wherein the material is reduced at least 75 percent during Step A.
Claim 25
Dependent Claim 23 words
A method as in claim 18 wherein the thickness of the copper alloy material following Step A is from 0.300 to 0.500 inch.
Claim 26
Dependent Claim 17 words
A method as in claim 18 wherein the deformation in Step C is at least 75 percent.

References Cited (Backward Citations)

US3259491A Cited
US3788902A Cited
US3841921A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1978-12-29 1979-06-30 1979-12-30 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1982-12-29 1983-06-30 1983-12-30 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1986-12-29 1987-06-30 1987-12-30 $7700.00 Window Closed / Lapsed

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