Modified hectorite for electroless plating

Abstract

Abstract A method and composition of matter useful for rendering an insulating material, self-catalytic to deposition of electroless metal from solutions thereof are shown. A base exchangeable clay material such as hectorite is base exchanged with a source of cations of a metal selected from Group I-B and VIII of the Periodic Table of Elements, preferably nickel or copper, and thereafter, the cation exchanged hectorite is heated under reducing conditions. This thermal treatment activates the exchanged hectorite as a catalyst to induce metal deposition in electroless plating baths. Without such a treatment the exchanged hectorite is not catalytic. The structure of the hectorite is altered by the thermal treatment as it no longer swells or gels when immersed in water. In addition the mechanical strength of the material is increased by the ''''sintering like'''' treatment. The modified base exchanged material can be incorporated or coated on insulating materials to provide the exterior or interior surfaces thereof with a catalytic sensitivity to deposition of electroless metal. The methods and compositions are useful in processes for manufacture of printed circuitry on substrates such as films, glass reinforced laminates, tapes, and boards. Methods of molding printed circuit substrates in desired geometrical form with vias located in predetermined pattern are disclosed along with chemical and mechanical methods of etching the surface of resin to expose base exchanged mineral that serves as the catalyst for electroless plating.

Inventors

• 👤 John Peter Redmond
• 👤 Daniel Marshall Andrews
• 👤 Charles Parsons Brooks
• 👤 Dominic A Cinalli
• 👤 Joseph Francis Merlina

Bibliographic Details