US3924323A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making a multiplicity of multiple-device semiconductor chips and article so produced
Assignee: RCA Corp
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Filing: 1974-08-23
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Granted: 1975-12-09
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Expires: 1994-08-23
Abstract
Abstract A multiplicity of semiconductor devices are made in a semiconductor wafer or slice. Grooves are made in the back of the slice such that individual devices are separated. The grooves preferably do not extend completely through the slice. The grooves are then filled with resin, isolating the devices and the backside of the slice is also coated with resin. Later, the remainder of the semiconductor material opposite each groove is removed and the slice is divided so that each chip unit has a plurality of isolated devices.
Inventors
- 👤 Lewis Herbert Trevail
- 👤 Brian Anthony Hegarty
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 23:15
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/70; H10P72/74; H10P72/7402; H10P95/00; H10W; H10W74/00; H10W74/01; H10W74/014; H10W74/019; H10W74/10; H10W74/131; H10P72/7416; H10P72/7422; H10W72/00; H10W72/01; H10W72/013; H10W72/01331; H10W72/0198; H10W72/071; H10W72/0711; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/20
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
167 words
A method of fabricating a multiplicity of semiconductor unit chips each of which contains a plurality of substantially completely electrically isolated semiconductor devices, comprising: forming an array of devices within a single wafer of semiconducting material, each of said devices having one face on which circuit contacts are adapted to be formed and another face opposite thereto, mounting said wafer on a temporary substrate with said contact face facing said substrate, forming grooves in said opposite wafer face between some but not all of said devices, filling said grooves with and coating said opposite surface with, a resin, removing said wafer from said substrate, remounting said wafer on a substrate with said opposite face facing said last mentioned substrate, dividing said wafer between devices which do not have grooves therebetween such that said wafer is divided into said unit chips, and separating said unit chips with said devices in each unit chip being electrically isolated from one another by the resin in the grooves from the substrate.
Claim 2
Independent Claim
167 words
A method of fabricating a multiplicity of semiconductor unit chips each of which contains a plurality of substantially completely electrically isolated semiconductor devices, comprising: forming an array of devices within a single wafer of semiconducting material, each of said devices having one face on which circuit contacts are adapted to be formed and another face opposite thereto, mounting said wafer on a temporary substrate with said contact face facing said substrate, forming grooves in said opposite wafer face between some but not all of said devices, filling said grooves with and coating said opposite surface with, a resin, removing said wafer from said substrate, remounting said wafer on a substrate with said opposite face facing said last mentioned substrate, dividing said wafer between devices which do not have grooves therebetween such that said wafer is divided into said unit chips, and separating said unit chips with said devices in each unit chip being electrically isolated from one another by the resin in the grooves from the substrate.
Claim 3
Dependent Claim
28 words
A method according to claim 1 in which test operations are performed on the devices of said divided wafer after the wafer is divided in said ungrooved areas.
Claim 4
Dependent Claim
15 words
A method according to claim 1 in which said grooves extend entirely through said wafer.
Claim 5
Dependent Claim
36 words
A method according to claim 1 in which said grooves at first extend only partially through said wafer and then, after said resin is applied, the remainder of the semiconductor material opposite said grooves is removed.
Claim 6
Dependent Claim
20 words
A method according to claim 1 in which said wafer is mounted on the substrate with a layer of wax.
Claim 7
Dependent Claim
14 words
A method according to claim 1 in which said grooves are formed by sawing.
Claim 8
Dependent Claim
37 words
a method according to claim 1 in which said wafer is divided into unit chips after the wafer is re-mounted on a substrate by making a gridwork of saw-cuts which extend through said opposite coating or resin.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-12-08 | 1979-06-09 | 1979-12-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-12-08 | 1983-06-09 | 1983-12-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-12-08 | 1987-06-09 | 1987-12-09 | $7700.00 | Window Closed / Lapsed |