Abstract The invention relates to a method of manufacturing an electromechanical resonator comprising a substrate provided, in one of its faces, with a recess and a piezoelectric wafer adhering to said substrate at the periphery of said recess. The resonating portion of the device is delimited by electrodes deposited upon the respective faces of said wafer, the electrode located upon the free face of said wafer being located above said recess. The method comprises flattening the adjacent faces of the wafer and substrate and depositing films on said faces which may be secured together to form a conductive layer. The thickness of the wafer is reduced by erosion of its free face following which an electrode is deposited on said free face.
A METHOD OF MANUFACTURING AN ELECTROMECHANICAL SYSTEM HAVING A HIGH RESONANCE FREQUENCY, THE SYSTEM COMPRISING AT LEAST ONE WAFER OF PIEZOELECTRIC MATERIAL HAVING AT LEAST ONE PAIR OF ELECTRODES SECURED TO OPPOSITE FACES OF THE WAFER, SAID WAFER BEING ATTACHED TO A RIGID SUBSTRATE AT THE PERIPHERY OF A RECESS THEREIN, SAID RECESS OVERLAPPING A VIBRATIONAL ZONE IN THE WAFER DELIMITED BY SAID ELECTRODES, THE METHOD COMPRISING THE STEPS OF: FLATTENING A FACE OF SAID SUBSTRATE CONTANING RECESS; DEPOSITING A FIRST FILM OF METAL ON SAID FACE; FLATTENING A FACE OF SAID WAFER; DEPOSITING A CONDUCTIVE LAYER OF GOLD ON THE FLATTENED FACE OF THE WAFER; DEPOSITING A SECOND FILM OF METAL ONTO THE GOLD LAYER, SAID SECOND FILM OVERLYING AN ANNULAR REGION OF SAID WAFER SAID REGION, CORRESPONDING TO THE PERIPHERY OF SAID RECESS;
Claim 2
Independent Claim
135 words
A METHOD OF MANUFACTURING AN ELECTROMECHANICAL SYSTEM HAVING A HIGH RESONANCE FREQUENCY, THE SYSTEM COMPRISING AT LEAST ONE WAFER OF PIEZOELECTRIC MATERIAL HAVING AT LEAST ONE PAIR OF ELECTRODES SECURED TO OPPOSITE FACES OF THE WAFER, SAID WAFER BEING ATTACHED TO A RIGID SUBSTRATE AT THE PERIPHERY OF A RECESS THEREIN, SAID RECESS OVERLAPPING A VIBRATIONAL ZONE IN THE WAFER DELIMITED BY SAID ELECTRODES, THE METHOD COMPRISING THE STEPS OF: FLATTENING A FACE OF SAID SUBSTRATE CONTANING RECESS; DEPOSITING A FIRST FILM OF METAL ON SAID FACE; FLATTENING A FACE OF SAID WAFER; DEPOSITING A CONDUCTIVE LAYER OF GOLD ON THE FLATTENED FACE OF THE WAFER; DEPOSITING A SECOND FILM OF METAL ONTO THE GOLD LAYER, SAID SECOND FILM OVERLYING AN ANNULAR REGION OF SAID WAFER SAID REGION, CORRESPONDING TO THE PERIPHERY OF SAID RECESS;
Claim 3
Dependent Claim
18 words
A method of manufacturing as claimed in claim 1 wherein said erosion is carried out by ion machining.
Claim 4
Dependent Claim
16 words
A method of manufacturing as claimed in claim 1, wherein the films are deposited by vapourisation.
Claim 5
Dependent Claim
20 words
A method of manufacturing as claimed in claim 1 wherein The metal of said first and second films is indium.