US3923504A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Migration imaging member and method
Assignee: Xerox Corp
•
Filing: 1973-01-29
•
Granted: 1975-12-02
•
Expires: 1993-01-29
Abstract
Abstract Circuit components are prepared by providing a member comprising a softenable dielectric layer and a softenable migration layer containing conductive migration material; electrically latently imaging the member in circuit component or network configuration; softening the dielectric and migration layers thereby migrating some of the migration material from the migration layer into the dielectric layer, at least one of migrated and non-migrated migration materials conforming to said circuit component or network configuration. A double sided migration imaging member is disclosed.
Inventors
- 👤 Lloyd F Bean
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 13:43
CPC Classifications
G; G03; G03G; G03G17/00; G03G17/10
Claims Analysis
Total Claims: 71
Claim 1
Independent Claim
209 words
A METHOD OF PREPARING CIRCUIT COMPONENTS COMPRISING, A. PROVIDING A MEMBER COMPRISING A SOFTENABLE DILECTRIC LAYER AND A MIGRATION LAYER, SAID MIGRATION LAYER COMPRISING ELECTRICALLY CONDUCTIVE MIGRATION MATERIAL AND SUBSTANTIALLY ELECTRICALLY INSULATING SOFTENABLE MATERIAL, SAID SOFTENABLE DIELECTRIC LAYER AND ELECTRICALLY INSULATING SOFTENABLE MATERIAL CAPABLE OF BECOMING SOFTENED UPON EXPOSURE TO A SOFTENING AGENT, SUFFICIENTLY TO ALLOW MIGRATION OF MIGRATION MATERIAL IN DEPTH IN SAID SOFTENABLE DIELECTRIC LAYER AND ELECTRICALLY INSULATING SOFTENABLE MATERIAL, SAID PONENT CONFIGURATION, LAYER, B. APPLYING A MIGRATION FORCE TO SAID MIGRATION MATERIAL BY SELECTIVELY CREATING A CHARGE PATTERN WITHOUT OPTICAL EXPOSURE IN SAID MIGRATION LAYER IN AT LEAST ONE CIRCUIT COMPONENT CONFIGURATION, C. SOFTENING THE SOFTENABLE DIELECTRIC LAYER AND ELECTRICALLY INSULATING SOFTENABLE MATERIAL AT LEAST SUFFICIENT TO ALLOW IMAGEWIE MIGRATION OF AT LEAST ONE PORTION OF ELECTRICALLY CONDUCTIVE MIGRATION MATERIAL FROM SAID MIGRATION LAYER AT LEAST IN DEPTH INTO SAID SOFTENABLY DELECTRIC LAYER, WITH AT LAST ONE PORTION OF ELECTRICALLY CONDUCTIVE MIGRATION MATERIAL REMAINING IN SAID SOFTENABLE MIGRATION LAYER, AT LEAST ONE OF SAID MIGRATING AND REMAINING PORTIONS OF CONDUCTIVE MIGRATION MATERIAL BEING IN SAID CIRCUIT COMPONENT CONFIGURATION, AND, D. REMOVING THE ELECTRICALLY INSULATING SOFTENABLE MATERIAL FROM THE MIGRATION LAYER SO THAT SAID REMAINING PORTION OF ELECTRICALLY CONDUCTIVE MIGRATION MAERIAL REMAINS ATOP SAID SOFTENABLE DIELECTRIC LAYER.
Claim 2
Independent Claim
209 words
A METHOD OF PREPARING CIRCUIT COMPONENTS COMPRISING, A. PROVIDING A MEMBER COMPRISING A SOFTENABLE DILECTRIC LAYER AND A MIGRATION LAYER, SAID MIGRATION LAYER COMPRISING ELECTRICALLY CONDUCTIVE MIGRATION MATERIAL AND SUBSTANTIALLY ELECTRICALLY INSULATING SOFTENABLE MATERIAL, SAID SOFTENABLE DIELECTRIC LAYER AND ELECTRICALLY INSULATING SOFTENABLE MATERIAL CAPABLE OF BECOMING SOFTENED UPON EXPOSURE TO A SOFTENING AGENT, SUFFICIENTLY TO ALLOW MIGRATION OF MIGRATION MATERIAL IN DEPTH IN SAID SOFTENABLE DIELECTRIC LAYER AND ELECTRICALLY INSULATING SOFTENABLE MATERIAL, SAID PONENT CONFIGURATION, LAYER, B. APPLYING A MIGRATION FORCE TO SAID MIGRATION MATERIAL BY SELECTIVELY CREATING A CHARGE PATTERN WITHOUT OPTICAL EXPOSURE IN SAID MIGRATION LAYER IN AT LEAST ONE CIRCUIT COMPONENT CONFIGURATION, C. SOFTENING THE SOFTENABLE DIELECTRIC LAYER AND ELECTRICALLY INSULATING SOFTENABLE MATERIAL AT LEAST SUFFICIENT TO ALLOW IMAGEWIE MIGRATION OF AT LEAST ONE PORTION OF ELECTRICALLY CONDUCTIVE MIGRATION MATERIAL FROM SAID MIGRATION LAYER AT LEAST IN DEPTH INTO SAID SOFTENABLY DELECTRIC LAYER, WITH AT LAST ONE PORTION OF ELECTRICALLY CONDUCTIVE MIGRATION MATERIAL REMAINING IN SAID SOFTENABLE MIGRATION LAYER, AT LEAST ONE OF SAID MIGRATING AND REMAINING PORTIONS OF CONDUCTIVE MIGRATION MATERIAL BEING IN SAID CIRCUIT COMPONENT CONFIGURATION, AND, D. REMOVING THE ELECTRICALLY INSULATING SOFTENABLE MATERIAL FROM THE MIGRATION LAYER SO THAT SAID REMAINING PORTION OF ELECTRICALLY CONDUCTIVE MIGRATION MAERIAL REMAINS ATOP SAID SOFTENABLE DIELECTRIC LAYER.
Claim 3
Dependent Claim
12 words
The method of claim 1 wherein said conductive migration material comprises particles.
Claim 4
Dependent Claim
37 words
The method of claim 1 wherein said conductive migration material comprises particles, further including the step of (e) flowing material from said softenable dielectric layer into the interstices of said remaining portion of conductive migration material particles.
Claim 5
Dependent Claim
69 words
The method of claim 1 wherein said softenable dielectric layer and migration layer softenable material are sufficiently dissimilar so as to prevent the migration of migrating material from said migration layer into said softenable dielectric layer in the absence of circulating said softenable dielectric layer; further including in the developing step (c), circulating the softenable dielectric layer so that the migrating migration material migrates into the softenable dielectric layer.
Claim 6
Dependent Claim
13 words
The method of claim 1 wherein said conductive migration material comprises fusible particles.
Claim 7
Dependent Claim
17 words
The method of claim 5 further including the step of (d) fusing said fusible, conductive migration particles.
Claim 8
Dependent Claim
26 words
The method of claim 1 wherein said conductive migration material comprises fusible conductive particles, further including the step (e) of fusing said fusible conductive migration particles.
Claim 9
Dependent Claim
48 words
The method of claim 1 wherein the amount of migration material in said softenable migration layer is sufficiently great, and the relative thicknesses of migration layer to softenable dielectric layer is such, that the softenable dielectric layer in migrated areas is filled with migration material throughout its thickness.
Claim 10
Dependent Claim
41 words
The method of claim 8 further including the step of (d) removing the entire remaining migration layer and wherein said at least one of migrated and remaining migration material portions in circuit component configuration is said migrated portion of migration material.
Claim 11
Dependent Claim
14 words
The method of claim 1 further including a substrate upon which said member resides.
Claim 12
Dependent Claim
10 words
The method of claim 10 wherein said substrate is conductive.
Claim 13
Dependent Claim
10 words
The method of claim 10 wherein said substrate is dielectric.
Claim 14
Dependent Claim
19 words
The method of claim 12 wherein said dielectric substrate is provided with a conductive coating on its free surface.
Claim 15
Dependent Claim
11 words
The method of claim 13 wherein said conductive coating is discontinuous.
Claim 16
Dependent Claim
57 words
The method of claim 12 wherein said member provided in step (a) is further provided on its free surface with a second softenable dielectric layer and a second migration layer having conductive migration material and softenable material; further including the subjection of said second softenable dielectric layer and said second migration layer to steps (b) and (c).
Claim 17
Dependent Claim
38 words
The method of claim 4 wherein said charge pattern includes an electrostatic charge level which produces an electrical field strength across said softenable dielectric layer of from about 10 volts per micron to about 80 volts per micron.
Claim 18
Dependent Claim
23 words
The method of claim 16 wherein said electrical field strength is from about 30 volts per micron to about 50 volts per micron.
Claim 19
Dependent Claim
23 words
The method of claim 5 wherein said fusible conductive migration particles are from about 0.1 micron to about 2 microns in average diameter.
Claim 20
Dependent Claim
19 words
The method of claim 1 wherein said migration layer is from about 0.5 micron to about 6 microns thick.
Claim 21
Dependent Claim
19 words
The method of claim 19 wherein said migration layer is from about .5 micron to about 1 micron thick.
Claim 22
Dependent Claim
28 words
The method of claim 1 wherein the weight ratio of said migration material to said softenable material in said migration layer is from about 1:6 to about 4:1.
Claim 23
Dependent Claim
16 words
The method of claim 21 wherein said weight ratio is from about 1:3 to about 2:3.
Claim 24
Dependent Claim
20 words
The method of claim 1 wherein said softenable dielectric layer is from about 1 micron to about 12 microns thick.
Claim 25
Dependent Claim
20 words
The method of claim 23 wherein said softenable dielectric layer is from about 1 micron to about 6 microns thick.
Claim 26
Dependent Claim
26 words
The method of claim 1 wherein the volume ratio of migration material to softenable material in the migration layer is from about 1:19 to about 1:1.
Claim 27
Dependent Claim
19 words
The method of claim 5 wherein said fusible conductive migration particles comprise fusible insulating material loaded with conductive material.
Claim 28
Dependent Claim
26 words
The method of claim 26 wherein the ratio of conductive material to fusible insulating material is from about 10 percent to about 95 percent by weight.
Claim 29
Dependent Claim
19 words
The method of claim 26 wherein said ratio is from about 30 percent to about 95 percent by weight.
Claim 30
Dependent Claim
83 words
A CIRCUIT MEMBER, COMPRISING: A. A SOFTENABLE DIELECTRIC LAYER, B. ELECTRICALLY CONDUCTIVE MIGRATION MATERIAL WITHIN SAID SOFTENABLE DIELECTRIC LAYER FORMING AT LEAST ONE ELECTRIALLY CONDUCTIVE CIRCUIT COMPONENT, AND C. A DIELECTRIC SUBSTRATE UPON WHICH SAID SOFTENABLE DIELECTRIC LAYER RESIDES, SAID DELECTRIC SUBSTRATE EING PROVIDED ON ITS FREE SURFACE WITH A DISCONTINUOUS CONDUCTIVE COATING COMPRISING DISCRETE PORTIONS, AT LAST ONE OF WHICH DISCRETE PORTIONS SANDWICHES THE DIELETRIC SUBSTRATE BETWEEN SAID AT LAST ONE DISCRETE PORTION AND SAID AT LEAST ONE ELECTRICALLY CONDUCTIVE CIRCUIT COOMPONENT.
Claim 31
Dependent Claim
83 words
A CIRCUIT MEMBER, COMPRISING: A. A SOFTENABLE DIELECTRIC LAYER, B. ELECTRICALLY CONDUCTIVE MIGRATION MATERIAL WITHIN SAID SOFTENABLE DIELECTRIC LAYER FORMING AT LEAST ONE ELECTRIALLY CONDUCTIVE CIRCUIT COMPONENT, AND C. A DIELECTRIC SUBSTRATE UPON WHICH SAID SOFTENABLE DIELECTRIC LAYER RESIDES, SAID DELECTRIC SUBSTRATE EING PROVIDED ON ITS FREE SURFACE WITH A DISCONTINUOUS CONDUCTIVE COATING COMPRISING DISCRETE PORTIONS, AT LAST ONE OF WHICH DISCRETE PORTIONS SANDWICHES THE DIELETRIC SUBSTRATE BETWEEN SAID AT LAST ONE DISCRETE PORTION AND SAID AT LEAST ONE ELECTRICALLY CONDUCTIVE CIRCUIT COOMPONENT.
Claim 32
Dependent Claim
18 words
The member of claim 29 wherein said conductive migration material fills said softenable dielectric layer throughout its thickness.
Claim 33
Dependent Claim
12 words
The member of claim 29 wherein said conductive component is a resistor.
Claim 34
Dependent Claim
31 words
The member of claim 29 wherein said at least one discrete portion of discontinuous conductive coating, said sandwiched dielectric substrate and said at least on conductive circuit component form a capacitor.
Claim 35
Dependent Claim
27 words
The member of claim 29, further including on the free surface of said softenable dielectric layer a softenable migration layer comprising conductive migration material and softenable material.
Claim 36
Dependent Claim
19 words
The member of claim 33 wherein said conductive migration material is in at least one conductive circuit component configuration.
Claim 37
Dependent Claim
30 words
The member of claim 29 further including conductive migration material residing in depth atop the free surface of said softenable dielectric layer and forming at least one conductive circuit component.
Claim 38
Dependent Claim
19 words
The member of claim 33 wherein said softenable dielectric material and said migration layer softenable material are dissimilar materials.
Claim 39
Dependent Claim
14 words
The member of claim 29 wherein said conductive migration material comprises fusible conductive particles.
Claim 40
Dependent Claim
13 words
The member of claim 29 wherein said conductive material comprises fused conductive particles.
Claim 41
Dependent Claim
18 words
The member of claim 37 wherein said fusible conductive particles comprise fusible insulating material loaded with conductive material.
Claim 42
Dependent Claim
26 words
The member of claim 39 wherein the ratio of conductive material to fusible insulating material is from about 10 percent to about 95 percent by weight.
Claim 43
Dependent Claim
19 words
The member of claim 40 wherein said ratio is from about 30 percent to about 95 percent by weight.
Claim 44
Dependent Claim
22 words
The member of claim 37 wherein said fusible conductive particles are from about 0.1 micron to about 2 microns in average diameter.
Claim 45
Dependent Claim
20 words
The member of claim 29 wherein said softenable dielectric layer is from about 0.5 micron to about 12 microns thick.
Claim 46
Dependent Claim
81 words
A circuit member, comprising: a. a softenable dielectric layer containing electrically conductive migration material therein; and b. upon said softenable dielectric layer, a softenable migration layer comprising substantially electrically insulating softenable material and electrically conductive migration material forming at least one electrically conductive circuit component therein; wherein said conductive material within the softenable dielectric layer forms at least one conductive circuit component therein, further including means electrically connecting the softenable dielectric layer circuit component with the softenable migration layer circuit component.
Claim 47
Dependent Claim
81 words
A circuit member, comprising: a. a softenable dielectric layer containing electrically conductive migration material therein; and b. upon said softenable dielectric layer, a softenable migration layer comprising substantially electrically insulating softenable material and electrically conductive migration material forming at least one electrically conductive circuit component therein; wherein said conductive material within the softenable dielectric layer forms at least one conductive circuit component therein, further including means electrically connecting the softenable dielectric layer circuit component with the softenable migration layer circuit component.
Claim 48
Dependent Claim
18 words
The member of claim 33 further including a softenable photoconductive layer interpositioned between said dielectric and migration layers.
Claim 49
Dependent Claim
70 words
A migration imaging member, comprising: a. a support; b. a layer of substantially electrically insulating softenable material residing on each side of said support; c. a softenable migration layer residing on each of said softenable layers and comprising substantially electrically insulating softenable material and migration material; and d. a softenable photoconductive layer interpositioned between the layer of softenable material and the softenable migration layer on each side of said support.
Claim 50
Dependent Claim
70 words
A migration imaging member, comprising: a. a support; b. a layer of substantially electrically insulating softenable material residing on each side of said support; c. a softenable migration layer residing on each of said softenable layers and comprising substantially electrically insulating softenable material and migration material; and d. a softenable photoconductive layer interpositioned between the layer of softenable material and the softenable migration layer on each side of said support.
Claim 51
Dependent Claim
19 words
The imaging member of claim 46 wherein said softenable photoconductive layer comprises electrically photosensitive particles dispersed in softenable material.
Claim 52
Dependent Claim
25 words
The imaging member of claim 47 wherein the weight ratio of said electrically photosensitive material to softenable material is from about 1:6 to about 4:1.
Claim 53
Dependent Claim
17 words
The imaging member of claim 48 wherein said weight ratio is from about 1:3 to about 2:3.
Claim 54
Dependent Claim
23 words
The imaging member of claim 46 wherein said softenable photoconductive layer has a thickness of from about 0.5 micron to about 5 microns.
Claim 55
Dependent Claim
18 words
The imaging member of claim 50 wherein said thickness is from about 0.5 micron to about 1 micron.
Claim 56
Dependent Claim
22 words
The imaging member of claim 46 wherein each of said migration layers is from about 0.5 micron to about 6 microns thick.
Claim 57
Dependent Claim
23 words
The imaging member of claim 52 wherein each of said migration layers has a thickness from about 0.5 micron to about 1 micron.
Claim 58
Dependent Claim
29 words
The imaging member of claim 46 wherein the volume ratio of migration material to softenable material in each of the migration layers is from about 1:19 to about 1:1.
Claim 59
Dependent Claim
26 words
The imaging member of claim 46 wherein each of said layers of softenable material has a thickness form about 1 micron to about 12 microns thick.
Claim 60
Dependent Claim
18 words
The imaging member of claim 55 wherein said thickness is from about 1 micron to about 6 microns.
Claim 61
Dependent Claim
45 words
The imaging member of claim 46 wherein the migration material on one side of said support is differently colored from the migration material on the other side of said support, and wherein said support, layers of softenable material and migration layer softenable material are transparent.
Claim 62
Dependent Claim
13 words
The imaging member of claim 57 wherein said softenable photoconductive layer is transparent.
Claim 63
Independent Claim
209 words
A method of preparing circuit components comprising: a. providing a member comprising: a softenable dielectric layer; a migration layer comprising electrically conductive migration material and substantially electrically insulating softenable material; and, a softenable photoconductive layer sandwiched between said softenable dielectric layer and said migration layer; said softenable dielectric layer, said softenable photoconductive layer and said electrically insulating softenable material capable of having their resistance to migration of migration material decreased sufficiently to allow migration material in depth in said softenable dielectric layer, said softenable photoconductive layer and said electrically insulating softenable material; b. applying a migration force to said migration material by electrically latently imaging said member in at least one circuit component configuration; c. developing said member by decreasing the resistance to migration of migration material in depth in the softenable dielectric layer, the softenable photoconductive layer and the electrically insulating softenable material at least sufficient to allow imagewise migration of at least one portion of electrically conductive migration material from said migration layer at least in depth into said softenable dielectric layer, with at least one portion of conductive migration material remaining in said softenable migration layer, at least one of said migrating and remaining portions of electrically conductive migration mateRial being in said circuit component configuration.
Claim 64
Independent Claim
209 words
A method of preparing circuit components comprising: a. providing a member comprising: a softenable dielectric layer; a migration layer comprising electrically conductive migration material and substantially electrically insulating softenable material; and, a softenable photoconductive layer sandwiched between said softenable dielectric layer and said migration layer; said softenable dielectric layer, said softenable photoconductive layer and said electrically insulating softenable material capable of having their resistance to migration of migration material decreased sufficiently to allow migration material in depth in said softenable dielectric layer, said softenable photoconductive layer and said electrically insulating softenable material; b. applying a migration force to said migration material by electrically latently imaging said member in at least one circuit component configuration; c. developing said member by decreasing the resistance to migration of migration material in depth in the softenable dielectric layer, the softenable photoconductive layer and the electrically insulating softenable material at least sufficient to allow imagewise migration of at least one portion of electrically conductive migration material from said migration layer at least in depth into said softenable dielectric layer, with at least one portion of conductive migration material remaining in said softenable migration layer, at least one of said migrating and remaining portions of electrically conductive migration mateRial being in said circuit component configuration.
Claim 65
Dependent Claim
27 words
The method of claim 59 wherein said step of electrically latently imaging further includes charging the imaging member and exposing the photoconductive layer to actinic electromagnetic radiation.
Claim 66
Dependent Claim
60 words
The method of claim 60 wherein said developing step is carried out by contacting said member with partial solvent, solvent vapor or heat, or mixtures thereof, further including the step of (d) removing the electrically insulating softenable material from the migration layer so that said remaining portion of electrically conductive migration material remains in depth atop said softenable photoconductive layer.
Claim 67
Dependent Claim
17 words
The method of claim 60 wherein said softenable photoconductive layer comprises photosensitive particles dispersed in softenable material.
Claim 68
Dependent Claim
23 words
The method of claim 62 wherein the weight ratio of said photosensitive material to softenable material is from about 1:6 to about 4:1.
Claim 69
Dependent Claim
16 words
The method of claim 63 wherein said weight ratio is from about 1:3 to about 2:3.
Claim 70
Dependent Claim
21 words
The method of claim 60 wherein said softenable photoconductive layer has a thickness of from about 0.5 micron to 5 microns.
Claim 71
Dependent Claim
16 words
The method of claim 65 wherein said thickness is from about 0.5 to about 1 micron.
References Cited (Backward Citations)
US3111422A
Cited
US3656990A
Cited
US3707391A
Cited
US3801314A
Cited
US3515549A
Cited
US3450831A
Cited
US3723112A
Cited
GB1235894A
Cited
US3753706A
Cited
US3741762A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-12-01 | 1979-06-02 | 1979-12-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-12-01 | 1983-06-02 | 1983-12-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-12-01 | 1987-06-02 | 1987-12-02 | $7700.00 | Window Closed / Lapsed |