Abstract A method for breaking scribed semiconductor wafers and an embodiment of apparatus for carrying out the method are described. The wafers are broken by placing a pair of thin nonresilient sheets each having a straight end edge on a flat support, one sheet lying above the other and positioned so that the straight end edges of the two sheets are perpendicular to each other, placing the scribed wafer on top of the upper sheet so that the scribe lines are parallel to one or the other of the straight end edges, applying a substantially uniform pressure to the wafer and while maintaining pressure withdrawing the upper sheet so that its straight end edge passes under the wafer and then withdrawing the lower sheet so that its straight end edge passes under the wafer.
Apparatus for breaking scribed semiconductor wafers comprising a. a generally flat base body having a first flat bottomed rectangular channel cut through its top surface, b. a second flat bottomed rectangular channel narrower than said first channel cut through the bottom of said first channel, c. a third flat bottomed rectangular channel cut through the base body perpendicular to said second channel and having a depth slightly greater than that of said second channel, d. a first thin rectangular shutter slidably fitted in said third channel, e. a second thin rectangular shutter slidably fitted in said second channel and overlaying said first shutter, and f. a rectangular carrier slidably fitted into said first channel, said carrier having an opening in the end entering the base body adapted to receive a mounted wafer.
Claim 2
Dependent Claim
132 words
Apparatus for breaking scribed semiconductor wafers comprising a. a generally flat base body having a first flat bottomed rectangular channel cut through its top surface, b. a second flat bottomed rectangular channel narrower than said first channel cut through the bottom of said first channel, c. a third flat bottomed rectangular channel cut through the base body perpendicular to said second channel and having a depth slightly greater than that of said second channel, d. a first thin rectangular shutter slidably fitted in said third channel, e. a second thin rectangular shutter slidably fitted in said second channel and overlaying said first shutter, and f. a rectangular carrier slidably fitted into said first channel, said carrier having an opening in the end entering the base body adapted to receive a mounted wafer.
Claim 3
Dependent Claim
19 words
Apparatus as defined in claim 1 having a thin pressureexpandable resilient sheet covering the opening in the rectangular carrier.
Claim 4
Dependent Claim
81 words
Apparatus as defined in claim 1 having a. a cover body registerable with the base body, b. said cover body having a recess in its bottom face, c. said recess having a cross-sectional area at least equal to that of a mounted wafer, d. a thin resilient pressUre-expandable sheet covering the recess opening in the lower face of the cover body, and e. a gas inlet passing through the upper face of the cover body and communicating with the recess therein.