Method and apparatus for thermo-chemically slicing crystal boules

Claim 3

A method of slicing a crystal boule in accordance with claim 1, wherein said propelling step occurs due to the rotation of a wheel which to the periphery thereof has been applied said etching solution.

Claim 4

A method of slicing a crystal boule in accordance with claim 1, wherein said heating step occurs by the steps of; providing a wire resistant to said chemical etching solution; positioning said wire adjacent said boule, intermediate said boule and said chemical solution, and passing an electric current through said wire to heat said wire.

Claim 5

A method in accordance with claim 3, wherein sufficient current is passed through said wire to heat said solution between 50*-100*C.

Claim 6

A method of slicing a crystal boule in accordance with claim 1, including the steps of; rotating an etchant applicator wheel in said predetermined plane to propel said chemical etching solution; providing a heating element between said applicator wheel and said boule, and passing a current through said element to heat said element and to thereby heat at least one of said boule and said solution.

Claim 7

A method of slicing a crystal boule in accordance with claim 5, including the step of applying said etchant to said etchant applicator wheel tangentially to said wheel whereby said etchant is propelled radially from said wheel.

Claim 10

a method of slicing a crystal boule in accordance with claim 7, including the steps of; rotating an etchant applicator wheel in said predetermined plane to propel said chemical etching solution; providing a heating element between said applicator wheel and said boule, and passing a current through said element to heat said element and to thereby heat at least one of said boule and said solution.

Claim 11

A method slicing a crystal boule in accordance with claim 8, including the step of applying said etchant to said etchant applicator wheel tangentially to said wheel whereby said etchant is propelled radially from said wheel.

Claim 12

Apparatus for slicing crystal boules, said apparatus comprising: means to clamp a boule in a predetermined position; means for propelling an etchant onto said boule along an intended line and plane of etch, means for applying heat to at least one of said boule and said solution along said intended line of etch, and means for providing relative movement between said boule and said chemical etchant to thereby effect a slicing action of said boule.

Claim 13

Apparatus for slicing crystal boules, said apparatus comprising: means to clamp a boule in a predetermined position; means for propelling an etchant onto said boule along an intended line and plane of etch, means for applying heat to at least one of said boule and said solution along said intended line of etch, and means for providing relative movement between said boule and said chemical etchant to thereby effect a slicing action of said boule.

Claim 14

Apparatus in accordance with claim 10, wherein said means for applying heat to at least one of said boule and said solution comprises a heating element resistant to said etching solution, in the plane of etch and adjacent said boule, and means to permit the passage of current through said element.

Claim 15

Apparatus in accordance with claim 11, wherein said heating element comprises a wire.

Claim 16

Apparatus in accordance with claim 10, wherein said etchant comprises an acid sOlution.

Claim 17

Apparatus in accordance with claim 12, wherein said means for propelling said etchant comprises a rotating etchant applicator wheel in said plane of etch.

Claim 18

Apparatus in accordance with claim 13, wherein said acid solution comprises a mixture of nitric acid, hydrofluoric acid and acetic acid.

Claim 19

Apparatus for slicing a boule of semi-conductor crystal into discrete wafers, said apparatus comprising; means to clamp a boule in a predetermined position; a rotatable etchant applicator wheel and a nozzle positioned to apply chemical etchant material onto the periphery of said wheel, said wheel being positioned in a plane along the intended line of etch of said boule; a heating element intermediate said boule and said wheel and in said plane; and means for providing relative movement between said boule and said chemical etchant to thereby effect a slicing action of said boule.

Claim 20

Apparatus for slicing a boule of semi-conductor crystal into discrete wafers, said apparatus comprising; means to clamp a boule in a predetermined position; a rotatable etchant applicator wheel and a nozzle positioned to apply chemical etchant material onto the periphery of said wheel, said wheel being positioned in a plane along the intended line of etch of said boule; a heating element intermediate said boule and said wheel and in said plane; and means for providing relative movement between said boule and said chemical etchant to thereby effect a slicing action of said boule.