Dual resist usage in construction of apertured multilayer printed circuit articles

Claim 1

IN A PROCESS FOR DEPOSITING METAL SELECTIVELY UPON A MULTILAYER OBJECT HAVING INTERLAYER CONNECTING PERFORATIONS AND A FINELY RESOLVED METALLIZATION PATTERN OF INCISED LINES ANS LANDS ON EXTERIJOR SURFACES THE STEPS OF: PROVIDING TEMPORARY ELECTRICAL CIRCUIT PATHS FOR CONNECTING ELECTROLYTIC PLATING VOLTAGES TO THE SAID METALLIZED LANDS, CONSTRUCTING A COMPOSITE MASK, SECURED TO SAID OBJECT AND OUTLINING THE PERFFORATIONS AND LANDS FOR PLATING WHILE SEALABLE MASKING THE SAID LINES, BY THE FOLLOWING SEQUENCE OF STEPS: A. COATING SAID OBJECT SURFACE WITH A THIN UNIFORM LAYER OF A FIRST PHOTO-RESIST MATERIAL HAVING LIQUID FORM, B. IMAGE-WISE PHOTO-EXPOSING, DEVELOPING AND HARDENING SAID FIRST MATERIAL INTO A SOLUBLE PRIMARY MASK COMPONENT, C. APPLYING TO THE SURFACE OF SAID PRIMARY MASK A THICK FILM LAYER OF A SOLID UNEXPOSED PHOTOPOLYMERIZABLE SECOND RESIST MATERIAL WHICH FORMS A CONTINUOUS BRIDGING COVER OVER THE INCISED ASPECT OF SAID OBJECT SURFACE, D. IMAGE-WISE PHOTO-EXPOSING AND DEVELOPING BUT NOT HARDENING SAID SECOND PHOTO-RESIST LAYER INTO A SOLUBLE SECONDARY MASK COMPONENT, E. SAID STEP D) OF DEVELOPING THE PHOTO-EXPOSED SECOND LAYER COMPRISING IN IMMEDIATE SEQUENCE: EL. SPRAYING THE MASKED OBJECT WITH A SOLUTION OF 1.1.1. TRICHLOROETHANE - INHIBITED, AT A PRESSURE OF 8-16 PSI AND PEMPERATURE NOT EXCEEDING 60*F, FOR A PERIOD OF BETWEEN 30 AND 120 SECONDS, E2. CONTACTING THE OBJECT BY IMMERSION WITH A BATH OF 1.1.1. TRICHLOROETHANE FOR A PERIOD OF 5 TO 10 SECONDS, E3. RINSING THE OBJECT IN WARM WATER AT 75* TO 85*F FOR A PERIOD OF 15 TO 20 SECONDS, CONTACTING SAID MASKED OBJECT WITH ELECTROLESS AND ELECTROLYTIC METAL PLATING MEDIA, WHILE THE OBJECT IS IN CONTACT WITH SAID ELECTROLYTIC PLATING MEDIUM CONNECTING PLATING POTENTIAL TO THE SAID LANDS VIA SAID TEMPORARY PATH, AND REMOVING SAID MASK AND TEMPORARY CIRCUIT PATHS.