Package for microwave integrated circuits

Claim 2

An hermetically sealed flat package housing a microwave circuit board comprising: a thin, planar base of dielectric material having a metal layer on a central portion of a first planar surface thereof; a thin planar spacer of dielectric material having a peripheral shape generally corresponding to said planar base and having a central portion and first and second terminal end portions extending from said central portion, said central portion having a cut-out extending between the said first planar surface and the opposite, second planar surface of said spacer for exposing said metal layer of said planar base through said cut-out, said first terminal end portion extending outwardly from said base and including on said second planar surface a first plurality of electrically conductive metal film connector leads extending from the cut-out of said central portion to the outer edge of said first terminal end portion and at least one metal film on said first planar surface disposed to underlie and provide a ground plane for each of said first plurality of metal film connector leads whereby each of said metal film connector leads of said first terminal end portion comprises a microstrip transmission line, and said second end portion of said spacer having a second plurality of electrically conductive metal film leads thereon extending from said cut-out to an outer edge of said second terminal end portion; said spacer being bonded on a first planar surface thereof to said first planar surface of said base, with said cut-out of said central portion aligned with said metal layer of said base and with said metal film of said first planar surface of said first terminal end portion in mechanical and electrical contact with said metal layer of said base; a planar frame having a thickness substantially greater than that of said spacer and having a cut-out larger than said cutout of said spacer, said planar frame being bonded to said spacer with the respective cut-outs thereof in alignment exposing within said cut-out of said frame, portions of said first and second pluralities of said connector leads adjacent said cut-out of said planar spacer; a circuit board received within said cut-outs of said planar frame and of said planar spacer and mounted on said metal layer of said planar base, said circuit board having a first plurality of microstrip connector leads thereon and a second plurality of low frequency connector leads thereon, said first plurality of connector leads of said first terminal end portion being connected to said first plurality of microstrip connector leads of said circuit board and said second plurality of connector leads of said second terminal end portion being connected to said second plurality of low frequency connector leads of said circuit board at the said portions thereof adjacent the cut-out of said central portion as exposed within said cut-out of said frame, and a planar metal top plate having a peripheral shape generally corresponding to said planar frame and bonded thereto hermetically sealing said circuit board within said package.

Claim 3

The package of claim 1, including at least one metal tab bonded to the package on the first terminal end portion, and adapted for mechanically attaching the package to another structure.

Claim 4

The package of claim 1, wherein the dielectric material is selected from the group consisting of alumina and beryllia.

Claim 5

A package as recited in claim 1, wherein the interior edges of said spacer surrounding said cut-out portion thereof include at least one recess for facilitating access to and removal of said circuit board.

Claim 6

A rectangular package according to claim 1, wherein the cutout portions of the spacer and frame are substantially rectangular.

Claim 7

A package according to claim 1, wherein the base, spacer and frame comprise ceramic dielectric material.

Claim 8

A package according to claim 6, wherein the dielectrIc material consists essentially of alumina.

Claim 9

A package as recited in claim 1 wherein said metal layer of said base is larger in dimensions than the dimensions of said cut-out of said spacer and in electrical contact with said metal layer on said first planar surface of said spacer.

Claim 10

A package as recited in claim 1 wherein said first and second terminal end portions extend in opposite, longitudinal directions from said central portion of said spacer.

Claim 11

A package as recited in claim 1 wherein said second terminal end portion further includes at least one metal mounting tab bonded on one of said planar surfaces thereof and extending beyond said outer edge of said end portion.

Claim 12

A microwave assembly having a parent board and at least one hermetically sealed flat package housing a microwave circuit board, each said package comprising: a thin, planar base of dielectric material having a metal layer on a central portion of a first planar surface thereof; a thin planar spacer of dielectric material having a peripheral shape generally corresponding to said planar base and having a central portion and first and second terminal end portions extending from said central portion, said central portion having a cut-out extending between the said first planar surface and the opposite, second planar surface of said spacer for exposing said metal layer of said planar base through said cut-out, said first terminal end portion extending outwardly from said base and including on said second planar surface a first plurality of electrically conductive metal film connector leads extending from the cut-out of said central portion to the outer edge of said first terminal end portion and at least one metal film on said first planar surface disposed to underlie and provide a ground plane for each of said first plurality of metal film connector leads whereby each of said metal film connector leads of said first terminal end portion comprises a microstrip transmission line, and said second end portion of said spacer having a second plurality of electrically conductive metal film leads thereon extending from said cut-out to an outer edge of said second terminal end portion; said spacer being bonded on a first planar surface thereof to said first planar surface of said base, with said cut-out of said central portion aligned with said metal layer of said base and with said metal film of said first planar surface of said first terminal end portion in mechanical and electrical contact with said metal layer of said base; a planar frame having a thickness substantially greater than that of said spacer and having a cut-out larger than said cut-out of said spacer, said planar frame being bonded to said spacer with the respective cut-outs thereof in alignment exposing within said cut-out of said frame portions of said first and second pluralities of said connector leads adjacent said cut-out of said planar spacer; a circuit board received within said cut-outs of said planar frame and of said planar spacer and mounted on said metal layer of said planar base, said circuit board having a first plurality of microstrip connector leads thereon and a second plurality of low frequency connector leads thereon, said first plurality of connector leads of said first terminal end portion being connected to said first plurality of microstrip connector leads of said circuit board and said second plurality of connector leads of said second terminal end portion being connected to said second plurality of low frequency connector leads of said circuit board at the said portions thereof adjacent the cut-out of said central portion as exposed within said cut-out of said frame, and a planar metal top plate having a peripheral shape generally corresponding to said planar frame and bonded thereto hermetically sealing said circuit board within said package, and wherein said parent board includes microstrip transmission lines disposed to correspond in location to said miCrostrip transmission lines of said first terminal end portion, said package being mounted on said parent board with said microstrip transmission lines of said first terminal end portion thereof in electrical contact with said microstrip transmission lines of said parent board.

Claim 13

A microwave assembly having a parent board and at least one hermetically sealed flat package housing a microwave circuit board, each said package comprising: a thin, planar base of dielectric material having a metal layer on a central portion of a first planar surface thereof; a thin planar spacer of dielectric material having a peripheral shape generally corresponding to said planar base and having a central portion and first and second terminal end portions extending from said central portion, said central portion having a cut-out extending between the said first planar surface and the opposite, second planar surface of said spacer for exposing said metal layer of said planar base through said cut-out, said first terminal end portion extending outwardly from said base and including on said second planar surface a first plurality of electrically conductive metal film connector leads extending from the cut-out of said central portion to the outer edge of said first terminal end portion and at least one metal film on said first planar surface disposed to underlie and provide a ground plane for each of said first plurality of metal film connector leads whereby each of said metal film connector leads of said first terminal end portion comprises a microstrip transmission line, and said second end portion of said spacer having a second plurality of electrically conductive metal film leads thereon extending from said cut-out to an outer edge of said second terminal end portion; said spacer being bonded on a first planar surface thereof to said first planar surface of said base, with said cut-out of said central portion aligned with said metal layer of said base and with said metal film of said first planar surface of said first terminal end portion in mechanical and electrical contact with said metal layer of said base; a planar frame having a thickness substantially greater than that of said spacer and having a cut-out larger than said cut-out of said spacer, said planar frame being bonded to said spacer with the respective cut-outs thereof in alignment exposing within said cut-out of said frame portions of said first and second pluralities of said connector leads adjacent said cut-out of said planar spacer; a circuit board received within said cut-outs of said planar frame and of said planar spacer and mounted on said metal layer of said planar base, said circuit board having a first plurality of microstrip connector leads thereon and a second plurality of low frequency connector leads thereon, said first plurality of connector leads of said first terminal end portion being connected to said first plurality of microstrip connector leads of said circuit board and said second plurality of connector leads of said second terminal end portion being connected to said second plurality of low frequency connector leads of said circuit board at the said portions thereof adjacent the cut-out of said central portion as exposed within said cut-out of said frame, and a planar metal top plate having a peripheral shape generally corresponding to said planar frame and bonded thereto hermetically sealing said circuit board within said package, and wherein said parent board includes microstrip transmission lines disposed to correspond in location to said miCrostrip transmission lines of said first terminal end portion, said package being mounted on said parent board with said microstrip transmission lines of said first terminal end portion thereof in electrical contact with said microstrip transmission lines of said parent board.

Claim 14

A microwave assembly as recited in claim 11 including plural said packages disposed with said bases thereof in a common plane and with said first terminal end portions thereof in alignment and wherein said parent board includes plural groups of microstrip transmission lines, each said group disposed to correspond to, and being electrically connected to, the first plurality of microstrip transmission lines of said first terminal end portion of a corresponding package.

Claim 15

A microwave assembly as recited in claim 11 wherein there is further provided an edge connector for receiving said second terminal end portion and including connector leads disposed to correspond to said second plurality of connector leads of said second terminal end portion and electrically connected thereto.

Claim 16

A microwave assembly as recited in claim 11 wherein there is provided a plurality of said packages disposed in parallel spaced planes with said edges of said second terminal end portions thereof disposed in a common plane and in alignment and wherein said parent board includes a plurality of parallel longitudinally extending microstrip transmission lines respectively corresponding to said first plurality of microstrip transmission lines of said first terminal end portions of said aligned packages and said first plurality of microstrip transmission lines of said first terminal end portion of each said package is selectively connected to said corresponding, parallel longitudinally extending microstrip transmission lines of said parent board.

Claim 17

A microwave assembly as recited in claim 14 wherein said second terminal end portion of each said package includes at least one metal mounting tab bonded on one of said planar surfaces of said second terminal end portion and extending beyond said outer edge thereof and connected to said parent board thereby mounting each said package to said parent board.