US3899559A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing waferboard
Assignee: Macmillan Bloedel Research Ltd
•
Filing: 1972-12-27
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Granted: 1975-08-12
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Expires: 1992-12-27
Abstract
Abstract A method of manufacturing waferboard comprising cutting thin wafers from wood logs, drying the wafers to lower the moisture content thereof, mixing the wafers with powdered binder resin and wax in molten or emulsified form to coat the wafers with wax and resin, forming mats of uniform density and thickness of the wafers, pressing the mats in a hot press at suitable temperature, pressure and time to form waferboards of predetermined thickness and density.
Inventors
- 👤 Fred E Johnanson
- 👤 William L Watkins
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 11:37
CPC Classifications
B; B27; B27N; B27N1/00; B27N3/00; B27N3/04
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
125 words
A METHOD OF MANUFACTURING WAFERBOARD, WHICH COMPRISES CUTTING THIN WAFERS FROM WOOD LOGS HAVING A MOISTURE CONTENT OF ABOUT 40 TO ABOUT 70% BASED ON DRY WEIGHT OF THE WOOD, SCREENING THE CUT WAFERS TO REMOVE THEREFROM ANY FINE WOOD PARTICLES, DRYING THE WAFERS AT SURFACE TEMPERATURES RANGING FROM ABOUT 200* TO ABOUT 240*F TO REDUCE THE MOISTURE CONTENT THEREOF TO ABOUT 2 TO ABOUT 10% BASED ON THE DRY WEIGHT OF THE WOOD, MIXING THE WAFERS WITH ABOUT 1.5% TO ABOUT 4% BY WEIGHT FINE POWDERED BINDER RESIN AND FROM 1 TO 6% BY WEIGHT WAX IN MOLTEN OR EMULSIFIED FORM TO COAT EACH WAFER WITH A COAT OF WAX COVERED BY POWDERED RESIN, DEPOSITING THE COATED WAFERS UNIFORMLY ON SUPPORTING PLATES TO FORM
Claim 2
Independent Claim
125 words
A METHOD OF MANUFACTURING WAFERBOARD, WHICH COMPRISES CUTTING THIN WAFERS FROM WOOD LOGS HAVING A MOISTURE CONTENT OF ABOUT 40 TO ABOUT 70% BASED ON DRY WEIGHT OF THE WOOD, SCREENING THE CUT WAFERS TO REMOVE THEREFROM ANY FINE WOOD PARTICLES, DRYING THE WAFERS AT SURFACE TEMPERATURES RANGING FROM ABOUT 200* TO ABOUT 240*F TO REDUCE THE MOISTURE CONTENT THEREOF TO ABOUT 2 TO ABOUT 10% BASED ON THE DRY WEIGHT OF THE WOOD, MIXING THE WAFERS WITH ABOUT 1.5% TO ABOUT 4% BY WEIGHT FINE POWDERED BINDER RESIN AND FROM 1 TO 6% BY WEIGHT WAX IN MOLTEN OR EMULSIFIED FORM TO COAT EACH WAFER WITH A COAT OF WAX COVERED BY POWDERED RESIN, DEPOSITING THE COATED WAFERS UNIFORMLY ON SUPPORTING PLATES TO FORM
Claim 3
Dependent Claim
48 words
The method as claimed in claim 1 in which the wood wafers are from about 0.010 to 0.060 inch thick, about 40 to 100 times said thickness in length in direction of the wood grains, to about 5 to 60 times said thickness in width across the grain.
Claim 4
Dependent Claim
28 words
The method as claimed in claim 2 in which the time in the press is from about 40 to 55 seconds for each sixteenth inch in waferboard thickness.
Claim 5
Dependent Claim
29 words
The method as claimed in claim 2 in which the waferboards from the press are cooled to about 270*F, and are stored at temperatures from about 210* to 250*F.
Claim 6
Dependent Claim
49 words
The method as claimed in claim 2 in which the time in the press is from about 40 to 55 seconds for each sixteenth inch in waferboard thickness, and the waferboards from the press are cooled to about 270*F, and are stored at temperatures from about 210* to 250*F.
Claim 7
Dependent Claim
31 words
The method as claimed in claim 2 in which the logs, prior to the cutting of the wafers, are heated in water at a temperature of from about 100* to 150*F.
Claim 8
Dependent Claim
28 words
The method as claimed in claim 1 in which the time in the press is from about 40 to 55 seconds for each sixteenth inch in waferboard thickness.
Claim 9
Dependent Claim
29 words
The method as claimed in claim 1 in which the waferboards from the press are cooled to about 270*F, and are stored at temperatures from about 210* to 250*F.
Claim 10
Dependent Claim
49 words
The method as claimed in claim 1 in which the time in the press is from about 40 to 55 seconds for each sixteenth inch in waferboard thickness, and the waferboards from the press are cooled to about 270*F, and are stored at temperatures from about 210* to 250*F.
Claim 11
Dependent Claim
31 words
The method as claimed in claim 1 in which the logs, prior to the cutting of the wafers, are heated in water at a temperature of from about 100* to 150*F.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-08-11 | 1979-02-10 | 1979-08-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-08-11 | 1983-02-10 | 1983-08-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-08-11 | 1987-02-10 | 1987-08-12 | $7700.00 | Window Closed / Lapsed |