Patent US2095573A successfully refreshed from Google Patents.
US3899554A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for forming a ceramic substrate
Assignee: International Business Machines Corp
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Filing: 1973-12-14
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Granted: 1975-08-12
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Expires: 1993-12-14
Abstract
Abstract Production of a sintered ceramic dielectric formed from a green sheet having a uniform microporous structure providing uniform dielectric properties and compressibility for lamination of stacked green sheets into a unitary laminate which may be provided with an internal pattern of electrical conductors extending therein. The structure is obtained by blending the ceramic particulate with a binder resin soluble in an azeotropic mixture which is formed from a solvent for the binder resin and a non-solvent in which the resin is at most only slightly soluble, which on evaporation of said azeotropic mixture forms said structure.
Inventors
- 👤 Harold D Kaiser
- 👤 Robert W Nufer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 14:55
CPC Classifications
C; C04; C04B; C04B35/00; C04B35/622; C04B35/626; C04B35/63; C04B35/632; C04B35/634; C04B35/63404; C04B35/6342; B; B32; B32B; B32B3/00; B32B3/26; B32B3/266; B32B43/00; B32B43/006; B32B7/00; B32B7/04; B32B7/12; B32B38/00; B32B38/04; B32B2038/042; B32B2264/00; B32B2264/10; B32B2264/107; B32B2315/00; B32B2315/02
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
97 words
IN A PROCESS FOR FORMING CERAMIC SUBSTRATES, THE STEPS COMPRISING: A. FORMULATING A CERAMIC SLIP COMPOSITION BY BLENDING A CERAMIC PARTICULATE WITH A SOLVENT SOLUBLE THERMOPLATIC BINDER RESIN DISSLOVED IN A VOLATILE ORGANIC SOLVENT MIXTURE FORMING A COMPLETE SOLVENT FOR SAID RESIN AND COMPRISING A VOLATILE FIRST SOLVENT FRACTION AND A VOLATILE SECOND NON-SOLVENT FRACTION WITH SAID FIRST SOLVENT FRACTION CONSTITUTING A COMPLETE SOLVENT FOR SAID RESIN AND SAID SECOND FRACTION BEING SUBSTANTIALLY A NON-SOLVENT FOR SAID RESIN, SAID FIRST AD SECOND SOLVENT FRACTIONS COMBINING TO FORM AN AZEOTROPIC MIXTURE, WITH AN EXCESS OF SAID NONSOLVENT FRACTION:
Claim 2
Dependent Claim
97 words
IN A PROCESS FOR FORMING CERAMIC SUBSTRATES, THE STEPS COMPRISING: A. FORMULATING A CERAMIC SLIP COMPOSITION BY BLENDING A CERAMIC PARTICULATE WITH A SOLVENT SOLUBLE THERMOPLATIC BINDER RESIN DISSLOVED IN A VOLATILE ORGANIC SOLVENT MIXTURE FORMING A COMPLETE SOLVENT FOR SAID RESIN AND COMPRISING A VOLATILE FIRST SOLVENT FRACTION AND A VOLATILE SECOND NON-SOLVENT FRACTION WITH SAID FIRST SOLVENT FRACTION CONSTITUTING A COMPLETE SOLVENT FOR SAID RESIN AND SAID SECOND FRACTION BEING SUBSTANTIALLY A NON-SOLVENT FOR SAID RESIN, SAID FIRST AD SECOND SOLVENT FRACTIONS COMBINING TO FORM AN AZEOTROPIC MIXTURE, WITH AN EXCESS OF SAID NONSOLVENT FRACTION:
Claim 3
Dependent Claim
36 words
In a process for forming ceramic substrates as in claim 1 further including the step of varying the amount of the second non-solvent fraction with respect to the first solvent for adjusting the quantity of micropores.
Claim 4
Dependent Claim
46 words
In a process for forming ceramic substrates as in claim 1 wherein said azeotropic mixture is a ternary mixture, at least one member of which is a complete solvent for and at least one member of which is substantially a non-solvent for said thermoplastic binder resin.
Claim 5
Dependent Claim
23 words
In a process for forming ceramic substrates as in claim 1 wherein said first solvent is methanol and said second non-solvent is toluene.
Claim 6
Dependent Claim
27 words
In a process for forming ceramic substrates as claimed in claim 1 wherein the boiling point of said non-solvent is above the boiling point of the azeotrope.
Claim 7
Dependent Claim
35 words
In a process for forming ceramic substrates as claimed in claim 1 wherein the ratio in parts by weight of the binder resin system to solvent system is within the range of 1:2 to 1:12.
Claim 8
Dependent Claim
35 words
In a process for forming ceramic substrates as claimed in claim 1 wherein the ratio in parts by weight of the binder resin system to solvent system is within the range of 1:5 to 1:7.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-08-11 | 1979-02-10 | 1979-08-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-08-11 | 1983-02-10 | 1983-08-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-08-11 | 1987-02-10 | 1987-08-12 | $7700.00 | Window Closed / Lapsed |