US3896076A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Adhesive composition for flexible printed circuit and method for using the same
Assignee: Sumitomo Bakelite Co Ltd
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Filing: 1973-12-11
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Granted: 1975-07-22
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Expires: 1993-12-11
Abstract
Abstract As an adhesive used for a laminate for a flexible printed circuit, there is provided an adhesive composition comprising as the essential components a polyester resin, an isocyanate compound, and a B-stage epoxy resin. This composition is excellent in flow property and rapid curability and is suitable for use in a continuous adhesion between a plastic insulating film and a conductive foil by means of a roll-laminator and it affords an excellent characteristic to the laminate for a printed circuit. There is also provided an adhesive composition which contains, in addition to the above ingredients, a styrene copolymer comprising maleic anhydride, or an alkyl maleate as a structural unit, or a metallic salt of an aliphatic carboxylic acid in order to prevent blocking and promote curing of the adhesive in a roll laminating process. The addition of a small amount of a pigment results in an adhesive composition which is effective in the economical production of a laminate for a colored flexible printed circuit, and which has the effect of preventing the blocking and improving the weather resistance of the adhesive.
Inventors
- 👤 Tsutomu Watanabe
- 👤 Shigenori Yamaoka
- 👤 Koichi Tanaka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 17:55
CPC Classifications
B; B32; B32B; B32B15/00; B32B15/04; B32B15/08; C; C09; C09J; C09J175/00; C09J175/04; C09J175/06; B32B7/00; B32B7/04; B32B7/12; C08; C08K; C08K3/00; C08K3/02; C08K3/04; C08K3/18; C08K3/20; C08K3/22; C08K5/00; C08L; C08L35/00; C08L35/06; C08L63/00; C08L75/00; C08L75/04; C08L75/06; H; H05; H05K; H05K3/00; H05K3/38; H05K3/386; B32B2457/00; B32B2457/08; H05K1/00; H05K1/02; H05K1/03; H05K1/0393; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0145; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
174 words
AN ADHESIVE COMPOSITION FOR A FLEXIBLE PRINTED CIRCUIT COMPRISING A MIXTURE OF (A) A HIGH MOLECULAR WEIGHT LINEAR POLYESTER RESIN OBTAINED BY POLY-CONDENSATION OF DIBASIC ACIDS AND DIVALENT ALCOHOLS, (B) 1-20 PARTS Y WEIGHT, PER 100 PARTS BY WEIGHT OF SAID POLYESTER ESIN, OF A POLYISOCYANATE COMPOUND HAVING AT LEAST TWO ISOCYANATE GROUPS IN THE MOLECULE SELECTED FROM THE GROUP CONSISTING OF A POLYISOCYANATE HAVING SUCH GROUPS AS ALKYL, ARYL ARALKYL, AND A REACTION PRODUCT OF TOLYLENE DIISOCYANATE AND RIMETHYLOL PROPANE, AND (C) 2 TO 50 PARTS BY WEIGHT, PER 100 PARTS BY WEIGHT OF SAID POLYESTER RESIN, OF A B-STAGE RESIN CONTAINING SUBSTANTIALLY NO FREE CURING AGENT AND HAVING A NUMBER AVERAGE MOLECULAR WEIGHT OF FROM 1,000 TO 10,000, AND OBTAINED BY REACTING A COMPOUND HAVING AT LEAST TWO EPOXY GROUPS IN THE MOLECULE AND THE EPOXY EQUIVALENT OF FROM 100 TO 4,000 WITH A COMPOUND CONTAINING AT LEAST TWO ACTIVE HYDROGEN ATOMS IN AN EQUIVALENT RATIO OF FROM 0.2 TO 1.0 MOLE OF ACTIVE HYDROGEN COMPOUND TO 1.0 MOLE OF EPOXY COMPOUND.
Claim 2
Dependent Claim
174 words
AN ADHESIVE COMPOSITION FOR A FLEXIBLE PRINTED CIRCUIT COMPRISING A MIXTURE OF (A) A HIGH MOLECULAR WEIGHT LINEAR POLYESTER RESIN OBTAINED BY POLY-CONDENSATION OF DIBASIC ACIDS AND DIVALENT ALCOHOLS, (B) 1-20 PARTS Y WEIGHT, PER 100 PARTS BY WEIGHT OF SAID POLYESTER ESIN, OF A POLYISOCYANATE COMPOUND HAVING AT LEAST TWO ISOCYANATE GROUPS IN THE MOLECULE SELECTED FROM THE GROUP CONSISTING OF A POLYISOCYANATE HAVING SUCH GROUPS AS ALKYL, ARYL ARALKYL, AND A REACTION PRODUCT OF TOLYLENE DIISOCYANATE AND RIMETHYLOL PROPANE, AND (C) 2 TO 50 PARTS BY WEIGHT, PER 100 PARTS BY WEIGHT OF SAID POLYESTER RESIN, OF A B-STAGE RESIN CONTAINING SUBSTANTIALLY NO FREE CURING AGENT AND HAVING A NUMBER AVERAGE MOLECULAR WEIGHT OF FROM 1,000 TO 10,000, AND OBTAINED BY REACTING A COMPOUND HAVING AT LEAST TWO EPOXY GROUPS IN THE MOLECULE AND THE EPOXY EQUIVALENT OF FROM 100 TO 4,000 WITH A COMPOUND CONTAINING AT LEAST TWO ACTIVE HYDROGEN ATOMS IN AN EQUIVALENT RATIO OF FROM 0.2 TO 1.0 MOLE OF ACTIVE HYDROGEN COMPOUND TO 1.0 MOLE OF EPOXY COMPOUND.
Claim 3
Dependent Claim
111 words
An adhesive composition for a flexible printed circuit comprising a mixture of (A) a high molecular weight linear polyester resin defined in claim 1; (B) 1 to 20 parts by weight of an isocyanate compound selected from the group consisting of a blocked polyisocyanate obtained by reacting a polyisocyanate defined in claim 1 with phenol or the like, and a polyurethane prepolymer obtained by reacting an excess of a polyisocyanate defined in claim 1 with a polyol per 100 parts by weight of said polyester; and (C) 2 to 50 parts by weight of a B-stage epoxy resin defined in claim 1, per 100 parts by weight of said polyester resin.
Claim 4
Dependent Claim
106 words
An adhesive composition for a flexible printed circuit comprising a mixture of the ingredients defined in claim 1 and (D) 0.5 to 20 parts by weight of at least one copolymer selected from the group consisting of a copolymer of styrene and/or styrene derivatives with maleic anhydride, an alkyl ester of said copolymer, and a copolymer of styrene and/or styrene derivatives with an alkyl maleate which is mono- or diester having an alkyl group of 1 to 20 carbon atoms, and a copolymer of styrene and/or styrene derivatives with maleic anhydride and said alkylmaleate, per 100 parts by weight of polyester resin defined in claim 1.
Claim 5
Dependent Claim
61 words
An adhesive composition for a flexible printed circuit comprising a mixture of the ingredients defined in claim 1 and (E) 0.01 to 5 parts by weight of a metal salt of an aliphatic mono- of di-carboxylic acids having alkyl, cycloalkyl or olefin group of 10 to 30 carbon atoms, per 100 parts by weight of polyester resin defined in claim 1.
Claim 6
Dependent Claim
63 words
An adhesive composition for a flexible printed circuit comprising a mixture of the ingredients defined in claim 1 and (F) 0.5 to 15 parts by weight of a pigment having a particle size of up to 10 Mu , insoluble in conventional solvents used in adhesive compositions, but readily dispersible therein, per 100 parts by weight of polyester resin defined in claim 1.
Claim 7
Dependent Claim
63 words
An adhesive composition for a flexible printed circuit comprising a mixture of the ingredients defined in claim 2 and (F) 0.5 to 15 parts by weight of a pigment having a particle size of up to 10 Mu , insoLuble in conventional solvents used in adhesive compositions, but readily dispersible therein, per 100 parts by weight of polyester resin defined in claim 2.
Claim 8
Dependent Claim
63 words
An adhesive composition for a flexible printed circuit comprising a mixture of the ingredients defined in claim 3 and (F) 0.5 to 15 parts by weight of a pigment having a particle size of up to 10 Mu , insoluble in conventional solvents used in adhesive compositions, but readily dispersible therein, per 100 parts by weight of polyester resin defined in claim 3.
Claim 9
Dependent Claim
63 words
An adhesive composition for a flexible printed circuit comprising a mixture of the ingredients defined in claim 4 and (F) 0.5 to 15 parts by weight of a pigment having a particle size of up to 10 Mu , insoluble in conventional solvents used in adhesive composition, but readily dispersible therein, per 100 parts by weight of polyester resin defined in claim 4.
References Cited (Backward Citations)
US3238273A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-07-21 | 1979-01-20 | 1979-07-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-07-21 | 1983-01-20 | 1983-07-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-07-21 | 1987-01-20 | 1987-07-22 | $7700.00 | Window Closed / Lapsed |