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US3894872A Expired / Lapsed US ⏱️ 0.0 years remaining

Technique for fabricating high Q MIM capacitors

Assignee: RCA Corp
•
Filing: 1974-07-17
•
Granted: 1975-07-15
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Expires: 1994-07-17
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Abstract

Abstract A process for making an MIM (metal-insulator-metal) capacitor comprising thermally depositing or growing a dielectric on a silicon substrate, depositing an electrode on the dielectric, removing the silicon substrate, thereby exposing the dielectric, and depositing a second electrode on the exposed dielectric is disclosed.

Inventors

  • 👤 Jr Joseph Mitchell
  • 👤 Jr Lester Andrew Carr

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 08:28
CPC Classifications
H; H01; H01G; H01G4/00; H01G4/002; H01G4/018; H01G4/06; H01G4/08; Y; Y10; Y10S; Y10S438/00; Y10S438/977; Y10T; Y10T29/00; Y10T29/43; Y10T29/435

Claims Analysis

Total Claims: 14
Claim 1
Independent Claim 53 words
A METHOD OF MAKING A CAPACITOR COMPRISING: A. THERMALLY DEPOSITING OR GROWING A LAYER OF DIELECTRIC ON A SILICON SUBSTRATE: B. DEPOSITING A FIRST ELECTRODE ON THE SURFACE OF SAID DIELECTRIC LAYER C. REMOVING SAID SILICON SUBSTRATE, THEREBY EXPOSING SAID DIELECTRIC LAYER: AND D. DEPOSITING A SECOND ELECTRODE ON SAID EXPOSED DIELECTRIC LAYER.
Claim 2
Independent Claim 53 words
A METHOD OF MAKING A CAPACITOR COMPRISING: A. THERMALLY DEPOSITING OR GROWING A LAYER OF DIELECTRIC ON A SILICON SUBSTRATE: B. DEPOSITING A FIRST ELECTRODE ON THE SURFACE OF SAID DIELECTRIC LAYER C. REMOVING SAID SILICON SUBSTRATE, THEREBY EXPOSING SAID DIELECTRIC LAYER: AND D. DEPOSITING A SECOND ELECTRODE ON SAID EXPOSED DIELECTRIC LAYER.
Claim 3
Dependent Claim 14 words
A method according to claim 1 wherein said dielectric is thermally grown silicon dioxide.
Claim 4
Dependent Claim 19 words
A method according to claim 2 wherein said silicon dioxide is grown by steam oxidation of said silicon substrate.
Claim 5
Dependent Claim 12 words
A method according to claim 1 wherein said dielectric is silicon nitride.
Claim 6
Dependent Claim 32 words
A method according to claim 4 wherein said silicon nitride is deposited by passing a mixture of silicon tetrachloride and ammonia over said silicon substrate heated at a temperature of about 1000*C.
Claim 7
Dependent Claim 28 words
A method according to claim 4 wherein said silicon nitride is deposited by passing a mixture of silane and ammonia over said silicon substrate heated to about 800*C.
Claim 8
Dependent Claim 12 words
A METHOD ACCORDING TO CLAIM 1 WHEREIN SAID DIELECTRIC IS ALUMINIUM OXIDE.
Claim 9
Dependent Claim 29 words
A method according to claim 1 wherein said first and second electrodes are layers of a metal selected from the group consisting of chromium, copper, aluminum, gold and silver.
Claim 10
Dependent Claim 19 words
A method according to claim 1 wherein said first and second electrode comprise successive layers of chromium and copper.
Claim 11
Dependent Claim 58 words
A method according to claim 1 wherein said capacitor is completed by the steps of: a. masking one of said electrodes; b. covering the unmasked electrode with a photoresist; c. exposing and developing said photomask to reveal a desired pattern on said unmasked electrode; d. etching said revealed electrode; and e. removing said remaining photoresist and said mask.
Claim 12
Dependent Claim 17 words
A method according to claim 1 wherein a plurality of capacitors are made from said silicon substrate.
Claim 13
Dependent Claim 119 words
A METHOD ACCORDING TO CLAIM 11 WHEREIN SAID CAPACITORS ARE COMPLETED BY THE STEPS OF: A. SEPARATING SAID DIELECTRIC INTO ISLANDS ON SAID FIRST ELECTRODE: B. DEPOSITING A LAYER OF A CONDUCTIVE METAL ON SAID DIELECTRIC ISLANDS AND SAID FIRST ELECTRODE: C. COATING SAID METAL LAYER WITH A PHOTORESIST: D. EXPOSING THE DEVELOPNG SAID PHOTORESIST SO AS TO REVEAL ONLY PORTIONS OF THE SURFACES OF SAID METAL LAYER DISPOSED DIRECTLY ON SAID DIELECTRIC ISLANDS: E. COATING SAID REVEALED METAL LAYWR WITH A SECOND LAYER OF A CONDUCTIVE METAL: F. COATING SAID SECOND METAL LAYER WITH A PROTECTIVE LAYER OF A CONDUCTIVE METAL: G. REMOVING THE REMAINING PHOTORESIST: ABD H. ETCHING AWAY SAID FIRST METAL LAYER NEATH SAID REMAINING PHOTORESIST.
Claim 14
Dependent Claim 12 words
A method according to claim 12 wherein the resulting capacitors are separated.

References Cited (Backward Citations)

US3231421A Cited
US3274025A Cited
US3385729A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1978-07-14 1979-01-13 1979-07-15 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1982-07-14 1983-01-13 1983-07-15 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1986-07-14 1987-01-13 1987-07-15 $7700.00 Window Closed / Lapsed

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