US3894329A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making high density electronic interconnections in a termination device
Assignee: Unisys Corp
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Filing: 1974-01-28
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Granted: 1975-07-15
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Expires: 1994-01-28
Abstract
Abstract There is disclosed herein an arrangement for terminating elements such as plated wire memory devices (which have the size of a human hair), wire resistor elements, or similar devices for connection to external circuitry. The arrangement is also suitable for coupling similar devices which are on different planes and are oriented either in parallel or at different angles. The arrangement includes positioning slots which serve as connecting lands as well as non-conducting walls to prevent short circuits between adjacent wires when molten solder is applied to the end of the wire.
Inventors
- 👤 Jr John Niemirovich
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 03:47
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3452; H01; H01R; H01R4/00; H01R4/02; H01R4/028; H05K3/10; H05K3/20; H05K3/205; H05K1/00; H05K1/02; H05K1/11; H05K1/117; H05K2201/00; H05K2201/09; H05K2201/09818; H05K2201/09909; H05K2203/00; H05K2203/05; H05K2203/0502; H05K2203/0537; H05K3/3405
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
218 words
The method of making high density electronic interconnections in a termination device having a plurality of depressed parallel, substantially no resistance metallic lands formed between parallel and contiguous insulating members and having both a terminal end and a receiving end wherein said terminal end of said respective parallel lands provides circuit connecting means and said receiving end is adapted to connect to an electrical wire component comprising: a. laying a respective end of a wire member having a diameter on the order of 5 mils horizontally in each such depresed land at its receiving end and wherein the insulating members extend in height above said depressed metallic lands, adjacent insulating members further preventing movement away from said land in order to provide a center-to-center spacing on the order of 30 mils; b. applying solder in a molten state to the respective ends of said wires, the excessive solder applied to said ends flowing within each respective depressed land area without bridging into an adjacent land area, the hardening of said solder providing a permanent connection of each said wire to said termination device, c. connecting the terminal end of each said land with a respective circuit connector whereby ohmic continuity is provided between a respective wire member and a respective circuit connector via said substantially no resistance land.
Claim 2
Independent Claim
218 words
The method of making high density electronic interconnections in a termination device having a plurality of depressed parallel, substantially no resistance metallic lands formed between parallel and contiguous insulating members and having both a terminal end and a receiving end wherein said terminal end of said respective parallel lands provides circuit connecting means and said receiving end is adapted to connect to an electrical wire component comprising: a. laying a respective end of a wire member having a diameter on the order of 5 mils horizontally in each such depresed land at its receiving end and wherein the insulating members extend in height above said depressed metallic lands, adjacent insulating members further preventing movement away from said land in order to provide a center-to-center spacing on the order of 30 mils; b. applying solder in a molten state to the respective ends of said wires, the excessive solder applied to said ends flowing within each respective depressed land area without bridging into an adjacent land area, the hardening of said solder providing a permanent connection of each said wire to said termination device, c. connecting the terminal end of each said land with a respective circuit connector whereby ohmic continuity is provided between a respective wire member and a respective circuit connector via said substantially no resistance land.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-07-14 | 1979-01-13 | 1979-07-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-07-14 | 1983-01-13 | 1983-07-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-07-14 | 1987-01-13 | 1987-07-15 | $7700.00 | Window Closed / Lapsed |