Apparatus for solder coating printed circuit boards

Claim 2

Apparatus for obtaining a uniform coating of solder on the conductive areas of a printed circuit board comprising: a tank having a first pool of molten solder and a second pool of a substance that is less dense than said solder and immiscible therewith floated on top of said pool of molten solder and in contact therewith, first means associated with said tank for contacting the conductive areas of said printed circuit board with molten solder from said first pool, second means for moving said board downwardly past said first means to immerse said board in said second pool, and upwardly to remove board from said second pool, and third means for vibrating said circuit board within said second pool in an orbital motion.

Claim 3

The apparatus of claim 1 wherein said substance of said second pool is a wax at a temperature substantially above the melting temperature of said solder.

Claim 4

The apparatus of claim 1 wherein said temperature is between 400* and 440* F and said circuit board is vibrated in said second pool for between 15 and 20 seconds.

Claim 5

The apparatus of claim 1 wherein said third means includes a motor having an eccentric drive system.

Claim 6

The apparatus of claim 1 wherein said first means includes two rows of spray nozzles situated above said pool, said circuit board being lowered between said rows of nozzles.

Claim 7

Apparatus for obtaining a substantially uniform coating of solder on the conductive areas of a printed circuit board comprising: a tank having a first pool of molten solder and a second pool of a substance that is less dense than said solder and immiscible therewith floated on top of said pool of molten solder and in contact therewith, first means associated with said tank for contacting said circuit board to be coated with molten solder from said first pool to coat the conductive areas thereof with solder, second means for moving said board downwardly past said first means to immerse the coated circuit board in said second pool and for removing said circuit board upwardly from said second pool, and third means for vibrating said circuit board in an orbital motion while said circuit board is within said second pool and while said circuit board is being removed from said second pool.

Claim 8

Apparatus for obtaining a substantially uniform coating of solder on the conductive areas of a printed circuit board comprising: a tank having a first pool of molten solder and a second pool of a substance that is less dense than said solder and immiscible therewith floated on top of said pool of molten solder and in contact therewith, first means associated with said tank for contacting said circuit board to be coated with molten solder from said first pool to coat the conductive areas thereof with solder, second means for moving said board downwardly past said first means to immerse the coated circuit board in said second pool and for removing said circuit board upwardly from said second pool, and third means for vibrating said circuit board in an orbital motion while said circuit board is within said second pool and while said circuit board is being removed from said second pool.

Claim 9

The apparatus of claim 6 wherein said third means includes a motor having an eccentric drive system.

Claim 10

The apparatus of claim 6 wherein said first means includes two rows of nozzles situated above said pool, said circuit board being lowered between said rows of nozzles.

Claim 11

Apparatus for obtaining a substantially uniform coating of solder on the conductive areas of a printed circuit board comprising: a tank having a first pool of molten solder and a second pool of a substance that is less dense than said solder and immiscible therewith floated on top of said pool of molten solder and in contact therewith, first means for immersing said circuit board into said second pool and for removing said circuit board from said second pool, second means associated with said tank for spraying said circuit board with solder from said first pool only while said circuit board is being lowered into said second pool, and third means for vibrating said circuit board in an orbital motion while said circuit board is within said second pool.

Claim 12

Apparatus for obtaining a substantially uniform coating of solder on the conductive areas of a printed circuit board comprising: a tank having a first pool of molten solder and a second pool of a substance that is less dense than said solder and immiscible therewith floated on top of said pool of molten solder and in contact therewith, first means for immersing said circuit board into said second pool and for removing said circuit board from said second pool, second means associated with said tank for spraying said circuit board with solder from said first pool only while said circuit board is being lowered into said second pool, and third means for vibrating said circuit board in an orbital motion while said circuit board is within said second pool.

Claim 13

The apparatus of claim 9 wherein said second means includes two rows of spray nozzles situated above said said pools, and valve means communicating with said rows of nozzles for terminating said spraying when said circuit board is immersed in said second pool.

Claim 14

The appaRatus of claim 10 wherein said third means includes a motor having an eccentric drive system.

Claim 15

The apparatus of claim 11 where said third means further includes means for supporting said circuit board while it is immersed in said second pool, said support means being coupled to said eccentric drive system.

Claim 16

The apparatus of claim 9 wherein said orbital motion is circular.

Claim 17

Apparatus for obtaining a substantially uniform coating of solder on the conductive areas of a printed circuit board comprising: a plurality of tanks, a first group of said tanks being provided with substances for cleaning said circuit board prior to solder coating, a second group of said tanks being provided with substances for washing and drying said circuit boards after solder coating, an additional tank having therein a first pool of molten solder and a second pool of a substance that is less dense than said solder and immiscible therewith floated on top of said pool of molten solder and in contact therewith, first means for lowering said circuit board successively into said first group of tanks, said second pool of said additional tank and said second group of tanks, second means associated with said additional tank for spraying said circuit board with solder from said first pool while said circuit board is being lowered in said second pool, and third means for vibrating said circuit board in an orbital motion while said circuit board is within said second pool.

Claim 18

Apparatus for obtaining a substantially uniform coating of solder on the conductive areas of a printed circuit board comprising: a plurality of tanks, a first group of said tanks being provided with substances for cleaning said circuit board prior to solder coating, a second group of said tanks being provided with substances for washing and drying said circuit boards after solder coating, an additional tank having therein a first pool of molten solder and a second pool of a substance that is less dense than said solder and immiscible therewith floated on top of said pool of molten solder and in contact therewith, first means for lowering said circuit board successively into said first group of tanks, said second pool of said additional tank and said second group of tanks, second means associated with said additional tank for spraying said circuit board with solder from said first pool while said circuit board is being lowered in said second pool, and third means for vibrating said circuit board in an orbital motion while said circuit board is within said second pool.

Claim 19

The apparatus of claim 14 wherein said third means includes a motor having an eccentric drive system.

Claim 20

The apparatus of claim 15 wherein said second means includes two rows of nozzles situated above said pools, said circuit board passing between said rows of nozzles.

Claim 21

The apparatus of claim 16, wherein said third means further includes means for supporting said circuit board while in said second pool, said supporting means being coupled to said eccentric drive system.

Claim 22

The apparatus of claim 17 wherein one of said first group of tanks contains an acid solution and another of said first group of tanks contains solder flux.

Claim 23

The apparatus of claim 18 wherein at least one of said second group of tanks provides the solder circuit board with a hot water bath.