US3888942A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Resinous compositions and laminates made therefrom
Assignee: General Electric Co
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Filing: 1973-12-13
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Granted: 1975-06-10
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Expires: 1993-12-13
Abstract
Abstract A particular mixture of epoxy resins and phenoxy resin along with curing agents, fillers and the like provides laminates for circuit boards characterized particularly by an improved Z-axis coefficient of expansion along with other desirable properties.
Inventors
- 👤 Lo Kwang Tsen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 02:24
CPC Classifications
C; C08; C08G; C08G59/00; C08G59/18; C08G59/20; C08G59/22; C08G59/226; B; B32; B32B; B32B27/00; B32B27/38; C08G59/40; C08G59/42; C08J; C08J5/00; C08J5/24; C08J5/241; C08J5/244; C08J5/249; C08L; C08L63/00; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/0326; H05K1/0353; H05K1/0373; B32B2315/00; B32B2315/08; B32B2363/00; C08J2363/00; H05K1/0366; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/012; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/06; H05K2201/068; Y; Y10; Y10S; Y10S525/00; Y10S525/93
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
129 words
A RESINOUS COMPOSITION COMPRISING, BY WEIGHT, A. AN EPOXY RESIN COMPOSITION COMPRISING A BLEND OF ABOUT 50 TO 90 PERCENT OF AN EPOXY RESIN HAVING AN EPOXY EQUIVALENT WEIGHT OF FROM ABOUT 170 TO 200 AND ABOUT 10 TO 50 PERCENT OF THE FUSION REACTION PRODUCT OF AN EPOXY RESIN AND TETRABROMOBISPHENOL-A, SAID FUSION REACTION PRODUCT HAVING AN EPOXY EQUIVALENT WEIGHT OF FROM ABOUT 900 TO 1,900. B. FROM ABOUT 1 TO 20 PARTS PER HUNDRED OF THE EPOXY RESIN COMPOSITION OF (A) OF A PHENOXY RESIN, C. FROM ABOUT 25 TO 75 PARTS PER HUNDRED OF THE EPOXY RSIN COMPOSITION OF (A) OF TRICARBOXYLIC ANHYDRIDE, AND D. FROM ABOUT 0.01 TO 0.05 PART PER HUNDRED OF THE EPOXY RESIN COMPOSITION OF (A) OF A TERTIARY AMINE CURING PROMOTER.
Claim 2
Dependent Claim
129 words
A RESINOUS COMPOSITION COMPRISING, BY WEIGHT, A. AN EPOXY RESIN COMPOSITION COMPRISING A BLEND OF ABOUT 50 TO 90 PERCENT OF AN EPOXY RESIN HAVING AN EPOXY EQUIVALENT WEIGHT OF FROM ABOUT 170 TO 200 AND ABOUT 10 TO 50 PERCENT OF THE FUSION REACTION PRODUCT OF AN EPOXY RESIN AND TETRABROMOBISPHENOL-A, SAID FUSION REACTION PRODUCT HAVING AN EPOXY EQUIVALENT WEIGHT OF FROM ABOUT 900 TO 1,900. B. FROM ABOUT 1 TO 20 PARTS PER HUNDRED OF THE EPOXY RESIN COMPOSITION OF (A) OF A PHENOXY RESIN, C. FROM ABOUT 25 TO 75 PARTS PER HUNDRED OF THE EPOXY RSIN COMPOSITION OF (A) OF TRICARBOXYLIC ANHYDRIDE, AND D. FROM ABOUT 0.01 TO 0.05 PART PER HUNDRED OF THE EPOXY RESIN COMPOSITION OF (A) OF A TERTIARY AMINE CURING PROMOTER.
Claim 3
Dependent Claim
26 words
A composition as in claim 1 which additionally contains from about 50 to 300 percent by weight, based on the resinous composition of finely divided filler.
Claim 4
Dependent Claim
30 words
A composition as in claim 1 which contains an additional flame retardant in amounts of from about 0.5 to 10 percent by weight of the resinous composition of claim 1.
Claim 5
Dependent Claim
19 words
A composition as in claim 1 which contains from about 20 to 40 percent by weight of compatible solvent.
Claim 6
Dependent Claim
30 words
A CIRCUIT BOARD SUBSTRATEE CHARACTERIZED BY A LOW Z-AXIS COEFFICIENT OF EXPANSION UNDER HEAT CYCLING, SAID SUBSTRATE COMPRISING AT LEAST ONE LAMINA TREATED WITH THE RESINOUS COMPOSITION OF CLAIM 2.
Claim 7
Dependent Claim
14 words
A circuit board substrate as in claim 5 wherein said lamina is glass mat.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-06-09 | 1978-12-09 | 1979-06-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-06-09 | 1982-12-09 | 1983-06-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-06-09 | 1986-12-09 | 1987-06-10 | $7700.00 | Window Closed / Lapsed |