US3888053A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of shaping semiconductor workpiece
Assignee: RCA Corp
•
Filing: 1973-05-29
•
Granted: 1975-06-10
•
Expires: 1993-05-29
Abstract
Abstract To accurately mount a number of semiconductor wafers on an accurately dimensioned mounting plate, using a wax adhesive, an unusually high amount of pressure is used to render the wax adhesive films beneath the wafers as thin as possible, and thus of uniform thickness from wafer to wafer. To avoid breakage of the wafers, a slip plate is used between the pressure applying means, which includes a compressible pad, and the wafers, the slip plate allowing lateral expansion of the compressible pad while not imparting lateral stresses to the wafers. The wafers are eventually polished using a polishing pad having a convex surface to provide exceptionally flat wafer surfaces.
Inventors
- 👤 Joseph Paul White
- 👤 Paul Joseph Delpriore
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 15:28
CPC Classifications
H; H10; H10P; H10P90/00; H10P90/12; H10P90/123; B; B24; B24B; B24B37/00; B24B37/04; B24B37/07; B24B37/10; B24B37/105; B24B37/107; B24B37/27; B24B37/30; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1089
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
87 words
In a process for shaping semiconductor workpieces, the steps of: providing a layer of wax adhesive on a surface of a mounting plate and disposing a number of workpieces on said layer, and applying a uniform pressure to each of said workpieces for pressing them into said layer utilizing a compressible pressure applying means to accommodate thickness variations among said workpieces and a slip plate disposed between said compressible pressure applying means and said workpieces for preventing stressing of said workpieces in directions parallel to said layer.
Claim 2
Dependent Claim
87 words
In a process for shaping semiconductor workpieces, the steps of: providing a layer of wax adhesive on a surface of a mounting plate and disposing a number of workpieces on said layer, and applying a uniform pressure to each of said workpieces for pressing them into said layer utilizing a compressible pressure applying means to accommodate thickness variations among said workpieces and a slip plate disposed between said compressible pressure applying means and said workpieces for preventing stressing of said workpieces in directions parallel to said layer.
Claim 3
Dependent Claim
37 words
A process according to claim 1 wherein the amount of pressure applied in said pressure applying step is such that the said layer beneath said workpieces is reduced to a thickness in the order of 0.5 micrometers.
Claim 4
Dependent Claim
18 words
The process of claim 1 in which said slip plate comprises two superimposed sheets of low friction material.
References Cited (Backward Citations)
US3475867A
Cited
US3571984A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-06-09 | 1978-12-09 | 1979-06-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-06-09 | 1982-12-09 | 1983-06-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-06-09 | 1986-12-09 | 1987-06-10 | $7700.00 | Window Closed / Lapsed |