Ultrasonic image converter and system

Claim 3

A system as set forth in claim 1 including a switching means electrically synchronized with said transmitting means connected to said converter means and a colour switching means for sequentially switching the colour of the displayed image to provide range information by means of colour hue.

Claim 4

A system as set forth in claim 2 including a colour oscillator which electrically changes the colour of the video display.

Claim 5

A system as set forth in claim 1 wherein said transmitting means includes a sonic transducer, a pulse generator and a pulse transmitter electrically connected to said transducer and said generator.

Claim 6

A sonic image converter comprising: a. a transparent supportive substrate; b. a transparent conductive film deposited on said substrate; c. a layer of electroluminescent material deposited on said film; d. an array of N spaced apart conductive pads deposited on said layer; e. an array of N spaced apart amplifiers, each of said amplifiers having a pair of electrical contact elements, one said pair being in electrical contact with an associated conductive pad, and each of said amplifiers having electrical connector means adapted for connection to a power source; f. an array of N spaced apart piezoelectric transducers, each of said transducers being in electrical contact with the other of said pair of electrical contact elements on an associated amplifier; g. a second electrical conductive film positioned over said array of transducers and in electrical contact therewith; and h. a low loss protective covering deposited over said second conductive film.

Claim 7

A sonic image converter comprising: a. a transparent supportive substrate; b. a transparent conductive film deposited on said substrate; c. a layer of electroluminescent material deposited on said film; d. an array of N spaced apart conductive pads deposited on said layer; e. an array of N spaced apart amplifiers, each of said amplifiers having a pair of electrical contact elements, one said pair being in electrical contact with an associated conductive pad, and each of said amplifiers having electrical connector means adapted for connection to a power source; f. an array of N spaced apart piezoelectric transducers, each of said transducers being in electrical contact with the other of said pair of electrical contact elements on an associated amplifier; g. a second electrical conductive film positioned over said array of transducers and in electrical contact therewith; and h. a low loss protective covering deposited over said second conductive film.

Claim 8

A sonic image converter of claim 5 wherein said array of amplifiers comprise n rows, each of said rows having m equally spaced apart amplifier circuits (where n.m N) integrated therein, and m pairs of electrical contact elements, one element of each pair mounted in the upper surface and said other element of each pair mounted in the lower surface, means for electrically connecting said pairs to an associated amplifier circuit, and means extending the length of each of said rows for electrically connecting said amplifiers to a source of electrical power.

Claim 9

A sonic image converter as set forth in claim 5 including a perforated acoustic absorbing material positioned between said second electrical conductive film and said amplifier array for positioning said array of piezoelectric transducers.

Claim 10

A sonic image converter as set forth in claim 6 wherein said amplifiers are integrated circuit amplifiers embedded within strips of insulating mateRial.

Claim 11

An ultrasonic image converter comprising: a. a transparent supportive substrate; b. a transparent conductive film deposited on said substrate; c. a layer of electroluminescent material deposited on said film; d. an array of N spaced apart conductive pads deposited on said layer; e. a first insulating layer positioned over said array of conductive pads, said first insulating layer including N first conducting members extending therethrough and arranged in N/4 groups of four members each, each of said members making electrical contact with an associated conductive pad; f. an array of N/4 semiconductive areas positioned over said first insulating layer, each of said semiconductive areas including four integrated circuit amplifiers, each of said amplifiers including an input and an output terminal, said output terminal making electrical contact with an associated first conductive member; g. a conductive grid evaporated onto said first insulating layer and comprising a plurality of parallel ground potential electrodes extending in each row between said semiconductive areas and first and second electrodes positioned at right angles to said ground electrodes and each extending in alternate columns between each semiconductive area for providing electrical power to each amplifier, said orthogonal sets of strips being insulated from each other; h. a second insulating layer positioned over said semiconductive areas and conductive grid, said second layer including N second conducting members extending therethrough and arranged in N/4 groups of four members each, each of said second members making electrical contact with an associated input terminal; i. an array of N spaced apart piezoelectric transducers, each transducer making electrical contact with an associated second conducting member; j. a second conductive film positioned over said array of transducers and in electrical contact therewith; and k. a low loss protective covering deposited over said second conductive film.

Claim 12

An ultrasonic image converter comprising: a. a transparent supportive substrate; b. a transparent conductive film deposited on said substrate; c. a layer of electroluminescent material deposited on said film; d. an array of N spaced apart conductive pads deposited on said layer; e. a first insulating layer positioned over said array of conductive pads, said first insulating layer including N first conducting members extending therethrough and arranged in N/4 groups of four members each, each of said members making electrical contact with an associated conductive pad; f. an array of N/4 semiconductive areas positioned over said first insulating layer, each of said semiconductive areas including four integrated circuit amplifiers, each of said amplifiers including an input and an output terminal, said output terminal making electrical contact with an associated first conductive member; g. a conductive grid evaporated onto said first insulating layer and comprising a plurality of parallel ground potential electrodes extending in each row between said semiconductive areas and first and second electrodes positioned at right angles to said ground electrodes and each extending in alternate columns between each semiconductive area for providing electrical power to each amplifier, said orthogonal sets of strips being insulated from each other; h. a second insulating layer positioned over said semiconductive areas and conductive grid, said second layer including N second conducting members extending therethrough and arranged in N/4 groups of four members each, each of said second members making electrical contact with an associated input terminal; i. an array of N spaced apart piezoelectric transducers, each transducer making electrical contact with an associated second conducting member; j. a second conductive film positioned over said array of transducers and in electrical contact therewith; and k. a low loss protective covering deposited over said second conductive film.

Claim 13

An ultrasonic image converter as set forth in claim 9 including a perforated acoustic absorbing material positioned between said second conductive film and said second insulating layer for positioning said array of piezoelectric transducers.