Gold alloy electroplating bath

Claim 1

IN AN IMPROVED AQUEOUS BATH FOR THE ELECTROLYTIC DEPOSITION OF GOLD OR GOLD ALLOYS ON ELECTRICALLY CONDUCTIVE OBJECTS, SAID BATH CONTAINING AT LEAST ONE CHELATING AGENT, AN ALKALI METAL GOLD SULFITE, AT LEAST ONE GOLD ALLOYING METAL, AND ABOUT 0.5-100 G/L OF AT LEAST ONE ELECTRICALLY CONDUCTIVE SALT OTHER THAN SAID ALKALI METAL GOLD SULFITE, SAID GOLD ALLOYING METAL AND SAID CHELATING AGENT, THE IMPROVEMENT WHEREIN WHITE GOLD IS DEPOSITED ON SAID OBJECT AND WHEREIN SAID AT LEAST ONE GOLD ALLOYING METAL IS AT LEAST ONE WATER SOLUBLE SALT OF CADMIMUM, AT LEAST ONE WATER SOLUBLE SALT OF COPPER, AT LEAST WATER SOLUBLE SALT OF NICKEL, AND ADDITIONALLY THERE IS INCORPORATED IN SAID BATH AN ORGANIC PHOSPHORUS COMOUND OF EITHER A. A COMPOUND OF THE FORMULA (R1-)(3-N)-N(-R-P(=O)(-OH)2)N IN WHICH R1 IS A HYDROGEN ATOM OR ABOUT A C1-C6 LOWER ALKYL RADICAL, R IS ABOUT A C1-C8 ALKYLENE RADICAL, AND N IS A WHOLE NUMBER OF ABOUT 1-3, OR B. AN ALKYLENE DIAMINO TETRA-(METHYLPHOSPHONIC ACID) OR A L-(HYDROXYALKYLIDENE-1,1-DIPHOSPHONIC ACID, THE ALKYLENE AND ALKYLIDENE GROUPS OF WHICH CONTAIN ABOUT 1-12 CARBON ATOMS, OR C. A WATER SOLUBLE SALT OF COMPOUNDS OF A OR B, SAID BATH HAVING A PH OF ABOUT 8.5-11, AND FURTHER WHEREIN SAID BATH CONTAINS GOLD IN AN AMOUNT OF ABOUT 1-8 G/L, CADMIUM IN AN AMOUNT OF ABOUT 0.1-30 G/L, COPPER IN AN AMOUNT OF ABOUT 0.001-0.5 G/L, NICKEL IN AN AMOUNT OF ABOUT 0.001 -10 G/L AND THE ORGANIC PHOSPHROUS COMPOUNDS IN AN AMOUNT OF ABOUT 0.01-10 G/L, WHEREIN SAID AT LEAST ONE CHELATING AGENT IS OTHER THAN A, B AND C AND IS PRESENT IN AN AMOUNT SUFFICIENT TO SUBSTANTIALLY COMPLETELY COMPLEX ALL OF THE METALS PRESENT IN THE PLATING BATH.