Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
129 words
Self-destruct apparatus for combustibly destroying circuit board electrical interconnectors comprising: a box-like enclosure, a microelectronic circuit board provided on one of its surfaces with electrical circuit interconnectors formed of superimposed films of metallized electrically-conductive exothermicallyreactive materials adapted when ignited to self-destructively maintain combustion, an ignitable and combustible sheet formed of exothermically reactive materials having an auto-ignition temperature approximating that of said interconnector materials, and remotely-controllable means of igniting said sheet, said circuit board and said ignitable sheet being disposed in a spaced relationship within said box-like enclosure with said circuit board interconnectors spanned by and directly exposed to said sheet, whereby ignition and combustion of said exothermic sheet directly and indirectly applies to said interconnectors a temperature sufficient to produce the auto-ignition and the desired destruction of said interconnectors.
Claim 2
Dependent Claim
129 words
Self-destruct apparatus for combustibly destroying circuit board electrical interconnectors comprising: a box-like enclosure, a microelectronic circuit board provided on one of its surfaces with electrical circuit interconnectors formed of superimposed films of metallized electrically-conductive exothermicallyreactive materials adapted when ignited to self-destructively maintain combustion, an ignitable and combustible sheet formed of exothermically reactive materials having an auto-ignition temperature approximating that of said interconnector materials, and remotely-controllable means of igniting said sheet, said circuit board and said ignitable sheet being disposed in a spaced relationship within said box-like enclosure with said circuit board interconnectors spanned by and directly exposed to said sheet, whereby ignition and combustion of said exothermic sheet directly and indirectly applies to said interconnectors a temperature sufficient to produce the auto-ignition and the desired destruction of said interconnectors.
Claim 3
Dependent Claim
18 words
The apparatus of claim 1 wherein said interconnectors are formed by adjacently-deposited films of aluminum and tungstic oxide.
Claim 4
Dependent Claim
17 words
The apparatus of claim 2 wherein said ignitable sheet is a pyrofuse foil formed lead and aluminum.
Claim 5
Dependent Claim
32 words
The apparatus of claim 3 wherein said circuit board includes a metal-oxide semiconductor substrate and said metallized interconnectors are employed to complete an electronic circuit incorporating circuit elements formed in said substrate.
Claim 6
Dependent Claim
29 words
The apparatus of claim 4 wherein the aluminum film is about 1000 A, the tungstic oxide film is about 1200 A and the pyrofuse foil is about .0008 inch.
Claim 7
Independent Claim
74 words
A method of combustibly destroying microelectronic circuit board interconnectors comprising: forming the interconnectors of superimposed films of metallized electrically-conductive exothermically-reactive materials adapted when ignited to self-destructively maintain combustion, and igniting said interconnectors by combustibly disintegrating a pyrofuse-like film in close proximity to the interconnectors, the ignition and combustion of said interconnectors being promoted by the heat of combustion of said pyrofuse-like film and by the direct contacts of hot film fragments with the interconnectors.
Claim 8
Independent Claim
74 words
A method of combustibly destroying microelectronic circuit board interconnectors comprising: forming the interconnectors of superimposed films of metallized electrically-conductive exothermically-reactive materials adapted when ignited to self-destructively maintain combustion, and igniting said interconnectors by combustibly disintegrating a pyrofuse-like film in close proximity to the interconnectors, the ignition and combustion of said interconnectors being promoted by the heat of combustion of said pyrofuse-like film and by the direct contacts of hot film fragments with the interconnectors.