US3879839A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing multi-function LSI wafers
Assignee: International Business Machines Corp
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Filing: 1973-06-04
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Granted: 1975-04-29
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Expires: 1993-06-04
Abstract
Abstract A system that is to be placed on a wafer is partitioned into reasonably large functions, each provided with a set of I/O and power pads. The wafer design is called ''''design A''''. A second wafer design (design B) that is the mirror image of design A is also constructed. Wafers of designs A and B are tested and divided into two groups: group I wafers have relatively few functions that are inoperative; group II wafers have relatively few functions that are operative. Inoperative functions are removed from group I wafers and discarded; good functions are removed from group II wafers and retained. A given function on wafer A is the mirror image of the same function on wafer B. Therefore, a given function from a group II wafer A (or B) can be inverted and attached to a group I wafer B (or A) that has had the corresponding function removed from it. The I/O and power pads of the function removed from the group II wafer are joined to the I/O and power pads remaining on the group I wafer.
Inventors
- 👤 Joseph C Logue
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 10:04
CPC Classifications
H; H10; H10D; H10D84/00; H10D84/90; H10D99/00; H10P; H10P95/00
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
214 words
In a method for manufacturing a multifunction wafer, the steps of: manufacturing multi-island wafers in accordance with a first design; manufacturing multi-island wafers in accordance with a second design; said first and second designs being related in that each contains at least one island that, with respect to input-output pads, is the mirror image of an island on the other design; testing said wafers; sorting from said tested wafers a first group for which said one island is inoperative and a second group for which said one island is operative; electrically isolating said one island from the remainder of a wafer A in said first group while leaving its associated inputoutput pads connected to the remainder of the wafer, said wafer A having been manufactured in accordance with said first design; removing said one island, including its associated input-output pads, from a wafer B in said second group, said wafer B having been manufactured in accordance with said second design; said wafers A and B being, with respect to the input-output pads of said one island, mirror images of each other; and electrically connecting the input-output pads associated with said one island removed from said wafer B to the input-output pads associated with said one island that was electrically isolated from said wafer A.
Claim 2
Dependent Claim
214 words
In a method for manufacturing a multifunction wafer, the steps of: manufacturing multi-island wafers in accordance with a first design; manufacturing multi-island wafers in accordance with a second design; said first and second designs being related in that each contains at least one island that, with respect to input-output pads, is the mirror image of an island on the other design; testing said wafers; sorting from said tested wafers a first group for which said one island is inoperative and a second group for which said one island is operative; electrically isolating said one island from the remainder of a wafer A in said first group while leaving its associated inputoutput pads connected to the remainder of the wafer, said wafer A having been manufactured in accordance with said first design; removing said one island, including its associated input-output pads, from a wafer B in said second group, said wafer B having been manufactured in accordance with said second design; said wafers A and B being, with respect to the input-output pads of said one island, mirror images of each other; and electrically connecting the input-output pads associated with said one island removed from said wafer B to the input-output pads associated with said one island that was electrically isolated from said wafer A.
Claim 3
Dependent Claim
24 words
The method of claim 1 wherein said step of electrically isolating comprises the step of physically removing said one island from said wafer A.
Claim 4
Dependent Claim
88 words
In a method for manufacturing a multifunction, multi-island wafer, the steps of: electrically isolating a first island from the remainder of a wafer, said first island having originally been manufactured as an integral part of said wafer; and replacing said first island in said wafer with a second island that, with respect to certain input-output connections, was manufactured as the mirror image of said first island; said replacement being accomplished by electrically connecting the input-output connections of said second island to corresponding input-output connections of said first island.
Claim 5
Dependent Claim
88 words
In a method for manufacturing a multifunction, multi-island wafer, the steps of: electrically isolating a first island from the remainder of a wafer, said first island having originally been manufactured as an integral part of said wafer; and replacing said first island in said wafer with a second island that, with respect to certain input-output connections, was manufactured as the mirror image of said first island; said replacement being accomplished by electrically connecting the input-output connections of said second island to corresponding input-output connections of said first island.
Claim 6
Dependent Claim
23 words
The method of claim 3 wherein said step of electrically isolating comprises the step of physically removing said first island from said wafer.
Claim 7
Dependent Claim
242 words
In a method of manufacturing a multi-function wafer, the steps of: manufacturing multi-island wafers in accordance with a first design; manufacturing multi-island wafers in accordance with a second design; said first and second designs being related in that each contains a plurality of islands each of which, with respect to input-output pads, is the mirror image of an island of similar function on The other design; testing said wafers; sorting from said tested wafers a first group for which a relatively large number of said islands are satisfactory for use and a second group for which a relatively small number of said islands are satisfactory for use; electrically isolating, from the remainder of a wafer A in said first group, at lease one island that is not satisfactory for use while leaving its associated input-out pads connected to the remainder of the wafer, said wafer A having been manufactured in accordance with said first design; removing an island of similar function to said one island, including its associated input-output pads, from a wafer B in said second group, said wafer B having been manufactured in accordance with said second design; said wafers A and B being, with respect to the input-output pads of said one island, mirror images of each other; and electrically connecting the input-output pads associated with the island removed from said wafer B to the input-output pads associated with the island that was electrically isolated from said wafer A.
Claim 8
Dependent Claim
242 words
In a method of manufacturing a multi-function wafer, the steps of: manufacturing multi-island wafers in accordance with a first design; manufacturing multi-island wafers in accordance with a second design; said first and second designs being related in that each contains a plurality of islands each of which, with respect to input-output pads, is the mirror image of an island of similar function on The other design; testing said wafers; sorting from said tested wafers a first group for which a relatively large number of said islands are satisfactory for use and a second group for which a relatively small number of said islands are satisfactory for use; electrically isolating, from the remainder of a wafer A in said first group, at lease one island that is not satisfactory for use while leaving its associated input-out pads connected to the remainder of the wafer, said wafer A having been manufactured in accordance with said first design; removing an island of similar function to said one island, including its associated input-output pads, from a wafer B in said second group, said wafer B having been manufactured in accordance with said second design; said wafers A and B being, with respect to the input-output pads of said one island, mirror images of each other; and electrically connecting the input-output pads associated with the island removed from said wafer B to the input-output pads associated with the island that was electrically isolated from said wafer A.
Claim 9
Dependent Claim
24 words
The method of claim 5 wherein said step of electrically isolating comprises the step of physically removing said one island from said wafer A.
Claim 10
Dependent Claim
47 words
The method of claim 6 wherein each of said plurality of islands has both inner and outer input-output pads associated therewith and wherein the inner input-output pads are removed along with said one island while the outer input-output pads are allowed to remain on said wafer A.
Claim 11
Dependent Claim
157 words
In a method for manufacturing a multi- function wafer, the steps of: manufacturing multi-island wafers in accordance with a first design; manufacturing wafer islands in accordance with a second design; said first and second designs being related in that each island of said second design is, with respect to input-output pads, the mirror image of an island of similar function of said first design; sorting from said wafers a group of wafers each containing at least one island that is not satisfactory for use; electrically isolating said one island from the remainder of one wafer in said group while leaving its associated input- output pads connected to the remainder of the wafer; replacing said one island on said one wafer by electrically connecting the input-output pads associated with an island of similar function manufactured in accordance with said second design to the input-output pads associated with said one island that was electrically isolated from said one wafer.
Claim 12
Dependent Claim
157 words
In a method for manufacturing a multi- function wafer, the steps of: manufacturing multi-island wafers in accordance with a first design; manufacturing wafer islands in accordance with a second design; said first and second designs being related in that each island of said second design is, with respect to input-output pads, the mirror image of an island of similar function of said first design; sorting from said wafers a group of wafers each containing at least one island that is not satisfactory for use; electrically isolating said one island from the remainder of one wafer in said group while leaving its associated input- output pads connected to the remainder of the wafer; replacing said one island on said one wafer by electrically connecting the input-output pads associated with an island of similar function manufactured in accordance with said second design to the input-output pads associated with said one island that was electrically isolated from said one wafer.
Claim 13
Dependent Claim
24 words
The method of claim 8 wherein said step of electrically isolating comprises the step of physically removing said one island from said one wafer.
Claim 14
Dependent Claim
44 words
The method of claim 9 wherein said one island has both inner and outer input-output pads associated therewith and wherein the inner input-output pads are removed along with said one island while the outer input-output pads are allowed to remain on said one wafer.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-04-28 | 1978-10-28 | 1979-04-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-04-28 | 1982-10-28 | 1983-04-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-04-28 | 1986-10-28 | 1987-04-29 | $7700.00 | Window Closed / Lapsed |