US3879836A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Printed circuit card component removal method
Assignee: Control Data Corp
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Filing: 1974-08-02
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Granted: 1975-04-29
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Expires: 1994-08-02
Abstract
Abstract A method for removing a component whose leads pass through and are soldered into holes in a printed circuit board. The solder gripping the leads is melted, and a vacuum is then applied to the component side of the board to remove the component.
Inventors
- 👤 Harry S Coffin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 21:47
CPC Classifications
B; B23; B23K; B23K1/00; B23K1/018; H; H05; H05K; H05K13/00; H05K13/04; H05K13/0486; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49139; Y10T29/4914; Y10T29/49142
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
88 words
A method for removing a component, each lead of which is soldered into a hole passing through a printed circuit board, from the board, comprising the steps of: a. placing the printed circuit board component side down on an upwardly facing opening in a cavity in a vessel, said opening completely surrounding said component; b. forming a substantially airtight seal between the vessel containing the cavity and the printed circuit board; c. melting the solder surrounding the leads of said components; and d. applying vacuum to the cavity.
Claim 2
Independent Claim
88 words
A method for removing a component, each lead of which is soldered into a hole passing through a printed circuit board, from the board, comprising the steps of: a. placing the printed circuit board component side down on an upwardly facing opening in a cavity in a vessel, said opening completely surrounding said component; b. forming a substantially airtight seal between the vessel containing the cavity and the printed circuit board; c. melting the solder surrounding the leads of said components; and d. applying vacuum to the cavity.
Claim 3
Dependent Claim
36 words
The method of claim 1 wherein the sealing step comprises placing a resilient strip between the printed circuit board and the vessel and surrounding the opening, and pressing the printed circuit board against the resilient strip.
Claim 4
Dependent Claim
34 words
The method of claim 1 wherein the sealing step comprises placing a resilient strip along the edges of the printed circuit board and compressing the strip against the printed circuit board and the structure.
Claim 5
Dependent Claim
26 words
The method of claim 1 wherein the vacuum applying step further comprises applying vacuum of at least approximately five pounds per square inch to the cavity.
Claim 6
Dependent Claim
19 words
The method of claim 1, further comprising the step of repeating the solder-melting and vacuum-applying steps at least once.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-04-28 | 1978-10-28 | 1979-04-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-04-28 | 1982-10-28 | 1983-04-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-04-28 | 1986-10-28 | 1987-04-29 | $7700.00 | Window Closed / Lapsed |