Compositions and process for the electrodeposition of metals

Claim 2

A cyanide-free process for the electrodeposition of monovalent, divalent and polyvalent metal ions which comprises the steps of electrolyzing an aqueous solution comprising a. a monovalent, divalent or polyvalent metal ion, and b. a cyanidine compound having the general formula

Claim 3

A CYANIDE-FREE PROCESS FOR THE ELECTRODEPOSITION OF MONOVALENT, DIVALENT AND POLYVALENT METAL IONS WHICH COMPRISES THE STEPS OF ELECTROLYZING AN AQUEOUS SOLUTION COMPRISING A. A MONOVALENT, DIVALENT OR POLYVALENT METAL ION, AND B. A CYANIDINE COMPOUND HAVING THE GENERAL FORMULA

Claim 4

A CYANIDE-FREE PROCESS FOR THE ELECTRODEPOSITION OF MONOVALENT, DIVALENT AND POLYVALENT METAL IONS WHICH COMPRISES THE STEPS OF ELECTROLYZING AN AQUEOUS SOLUTION COMPRISING A. A MONOVALENT, DIVALENT OR POLYVALENT METAL ION, AND B. A CYANIDINE COMPOUND HAVING THE GENERAL FORMULA

Claim 5

A process of claim 1 wherein said aqueous solution comprises, in addition to (a) and (b), a compound (c) having the structure M2O3P - R - PO3M2 wherein M is hydrogen, alkali metal or ammonium ion, and R is selected from the group consisting of alkylene or alkylidene radical having from 1 to about 11 carbon atoms and hydroxy and halogen substituted derivatives thereof, in a concentration sufficient to provide a mole ratio of at least about 0.5:1 of (c) to (a).

Claim 6

A process of claim 2 wherein said compound (c) is 1,1-ethylene diphosphonic acid.

Claim 7

A process of claim 3 wherein (b) is cyanuric acid or an alkali metal salt thereof.

Claim 8

A process of claim 4 wherein said metal ion (a) is monovalent Cu(I), the concentration of said metal ion is from about 0.01 to about 0.5 percent by weight, and the pH of said aqueous solution is from about 11 to 12.

Claim 9

A process of claim 1 wherein said metal ion (a) is monovalent Cu(I), the concentration of said metal ion is from about 0.01 to about 0.5 percent by weight and the pH of said aqueous solution is from about 11 to 12.

Claim 10

A process of claim 6 wherein (b) is cyanuric acid or alkali metal salts thereof.

Claim 11

A process of claim 1 wherein said metal ion (a) is selected from the group consisting of copper, iron, nickel, zinc, cadmium, tin, silver, chromium and gold.

Claim 12

A cyanide-free electroplating bath composition comprising an aqueous solution of a. from about 0.01 to about 5 percent by weight of a monovalent, divalent or polyvalent metal ion, and b. from about 0.01 percent to the solubility limit of a cyanidine compound having the general formula

Claim 13

A cyanide-free electroplating bath composition comprising an aqueous solution of a. from about 0.01 to about 5 percent by weight of a monovalent, divalent or polyvalent metal ion, and b. from about 0.01 percent to the solubility limit of a cyanidine compound having the general formula

Claim 14

A composition of claim 9 comprising in addition to (a) and (b), a compound (c) having the structure M2O3P - R - PO3M2 wherein M is hydrogen, alkali metal or ammonium ion, and R is selected from the group consisting of alkylene or alkylidene radical having from 1 to about 11 carbon atoms, and hydroxy and halogen substituted derivatives thereof, in a concentration sufficient to provide a mole ratio of at least about 0.5:1 of (c) to (a).

Claim 15

A composition of claim 10 wherein (b) is cyanuric acid or an alkali metal salt thereof.

Claim 16

A composition of claim 11 wherein said metal ion (a) is monovalent Cu(I) and the concentration of said metal ion is from about 0.01 to about 0.5 percent by weight.

Claim 17

A composition of claim 10 wherein said compound (c) is 1,1-ethylene diphosphonic acid.

Claim 18

A composition of claim 9 wherein (b) is cyanuric acid or alkali metal salts thereof.

Claim 19

A composition of claim 14 wherein said metal ion is monovalent Cu(I) and the concentration of said metal ion is from about 0.01 to about 0.5 percent by weight.