US3878065A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for forming solderable coating on alloys
Assignee: Buckbee Mears Co
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Filing: 1974-01-30
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Granted: 1975-04-15
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Expires: 1994-01-30
Abstract
Abstract A process for applying a tenaciously adhering coating on alloy articles or base metal articles by utilizing successive electroplating of copper and silver strikes to produce a tenaciously adhering electroplated base for receiving a coppersilver alloy coating that is still solderable after having been subjected to extreme temperature conditions.
Inventors
- 👤 John M Carr
- 👤 Pat F Mentone
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 21:00
CPC Classifications
C; C25; C25D; C25D5/00; C25D5/10; Y; Y10; Y10S; Y10S428/00; Y10S428/922; Y10S428/9335; Y10S428/934; Y10S428/935; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12771; Y10T428/12861; Y10T428/12896; Y10T428/12903; Y10T428/12986
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
90 words
THE PROCESS OF APPLYING AN ELECTROPLATING BASE TO AN ALLOY ARTICLE COMPRISING THE STEPS OF: CLEANING THE ARTICLE TO REMOVE ORGANIC AND INORGANIC MATERIALS; ELECTROPLATING A COPPER STRIKE TO THE ALLOY ARTICLE; REMOVING THE ARTICLE WITH THE COPPER STRIKE THEREON WHILE MAINTAINING THE ALLOY ARTICLE IN A WETTED CONDITION FOLLOWED BY ELECTROPLATING A SILVER STRIKE TO THE ALLOY ARTICLE BY APPLYING AN ELECTROPLATING VOLTAGE TO THE ALLOY ARTICLE AND THEN INSERTING THE ALLOY ARTICLE INTO A COPPER-SILVER ELECTROPLATING SOLUTION TO THEREBY PRODUCE AN ELECTROPLATING BASE FOR APPLYING A SOLDERABLE COATING.
Claim 2
Dependent Claim
90 words
THE PROCESS OF APPLYING AN ELECTROPLATING BASE TO AN ALLOY ARTICLE COMPRISING THE STEPS OF: CLEANING THE ARTICLE TO REMOVE ORGANIC AND INORGANIC MATERIALS; ELECTROPLATING A COPPER STRIKE TO THE ALLOY ARTICLE; REMOVING THE ARTICLE WITH THE COPPER STRIKE THEREON WHILE MAINTAINING THE ALLOY ARTICLE IN A WETTED CONDITION FOLLOWED BY ELECTROPLATING A SILVER STRIKE TO THE ALLOY ARTICLE BY APPLYING AN ELECTROPLATING VOLTAGE TO THE ALLOY ARTICLE AND THEN INSERTING THE ALLOY ARTICLE INTO A COPPER-SILVER ELECTROPLATING SOLUTION TO THEREBY PRODUCE AN ELECTROPLATING BASE FOR APPLYING A SOLDERABLE COATING.
Claim 3
Dependent Claim
30 words
The process of claim 1 wherein the concentration of the silver during the electroplating of silver in the silver strike solution is less than one ounce per gallon of electrolyte.
Claim 4
Dependent Claim
29 words
The process of claim 1 wherein the alloy article is anodically cleaned prior to copper striking in order to remove any materials on the surface of the alloy article.
Claim 5
Dependent Claim
24 words
The process of claim 3 wherein the alloy article is further acid pickled to remove any oxide on the surface of the alloy article.
Claim 6
Dependent Claim
21 words
The process of claim 4 wherein the alloy article is further cleaned by subjecting the article to a second anodic cleaning.
Claim 7
Dependent Claim
23 words
The process of claim 1 wherein a ''''dummy'''' article and an alloy article are simultaneously plated with copper in the same electroplating bath.
Claim 8
Dependent Claim
34 words
The process of producing substantially a 100% yield of articles comprising the invention of claim 6 including the step of monitoring and maintaining the ratio of free potassium cyanide to copper at about 1.
References Cited (Backward Citations)
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US2729601A
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US2891309A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-04-14 | 1978-10-14 | 1979-04-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-04-14 | 1982-10-14 | 1983-04-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-04-14 | 1986-10-14 | 1987-04-15 | $7700.00 | Window Closed / Lapsed |