Arrangement for mounting a microwave component with a solderless ground connection

Claim 1

In an arrangement for mounting a microwave component including a housing, a substrate on which the microwave component is positioned, the substrate being positioned within the housing, and contact means for providing a solderless ground connection for the microwave component, the improvement wherein: said housing has a step-shaped portion and at least a part of one wall of said housing is conductive; said substrate has two opposed longitudinal surfaces, one of which is positioned against said step-shaped portion; said substrate includes a metallization layer disposed on the other said surface; said contact means includes a conductive member made of an elastically deformable conductive material, said conductive member contacting said metallization layer of said substrate and said conductive part of said housing, and pressure means for pressing said conductive member against said metallization layer so as to provide the ground connection between said metallization layer and said conductive part of said housing; said substrate has an edge section which abuts against said housing so as to define a corner and said pressure means presses said conductive member substantially into said corner; and said pressure means is a housing-shaped member, said housing-shaped member including an end wall which extends at an oblique angle toward said conductive part of said housing and which has an outer edge pressing against said conductive member.