Adhesive composition containing phenoxy and epoxy resins and a cross-linking agent therefor

Abstract

Abstract A structural adhesive composition which is particularly suited for bonding or laminating a metal foil to an epoxy resin impregnated glass fiber plate, for example, as in the production of copper clad painted circuit boards, comprises a phenoxy resin having the formula WHEREIN M is a metal atom having a valence of at least one, n is an integer including zero, m is an integer, R1 is a member selected from the group consisting of hydrogen atom, alkyl, unsaturated aliphatic, cyclic alkyl and aryl, and R2 is a member selected from the group consisting of alkyl and aryl which has at least one electron donor atom to form a chelate with said metal atom. The epoxy resin is preferably present in the composition in an amount between 20 and 400 wt.% based on the amount of the phenoxy resin, and the cross-linking agent is preferably present in the composition in an amount between 2 and 30 wt.% based on the amount of the phenoxy resin. WHEREIN N IS 50 TO 100, A LOW MOLECULAR EPOXY RESIN HAVING MORE THAN TWO EPOXY GROUPS AND AN EPOXY VALUE LESS THAN 4,000, AND A CROSS-LINKING AGENT WHICH EITHER HAS AT LEAST TWO AZIRIDINE RINGS AT THE ENDS OF THE MOLECULAES THEREOF TO REACT WITH THE HYDROXYL GROUP (OH) of said phenoxy resin and with said low molecular epoxy resin for providing a high cross-linking density, or which is a chelate of an organic metal compound having the formula

Inventors

• 👤 Yoshio Fujiwara
• 👤 Keiichi Naito
• 👤 Toru Odajima

Bibliographic Details