Abstract A semiconductor package is provided with a metallized fugitive shorting bar across the conductor pads or leads to prevent electrical damage to a semiconductor chip, inserted therein, from static electricity discharges. The process also comprises removing the shorting bar by solder leaching. The shorting bar is screen printed as a thick-film metallized strip or bar across the conductor package. After a semiconductor chip is inserted in the package by the semiconductor manufacturer and the chip attached and sealed, the shorting bar may be removed at the same time the leads are soldered to the package by the solder leaching properties of a tin-lead-silver or tin-lead solder. Silver is the preferred material of the shorting bar since it is readily compatible with tin-lead-silver or tin-lead solder. However, gold, tin, lead or any thick film material readily dissolved or leached by the solder may be used.
In a process for packaging a semiconductor chip in a package comprising a substrate having conductor patterns thereon and conductor pads connected to said conductor pattern, the improvement comprising the steps of applying a fugitive shorting bar or strip to said substrate and overlaying said conductor pads, inserting said semiconductor chip in said package and connecting said chip to said conductor pattern, and removing said shorting bar by solder leaching while soldering leads to said pads.
Claim 2
Dependent Claim
76 words
In a process for packaging a semiconductor chip in a package comprising a substrate having conductor patterns thereon and conductor pads connected to said conductor pattern, the improvement comprising the steps of applying a fugitive shorting bar or strip to said substrate and overlaying said conductor pads, inserting said semiconductor chip in said package and connecting said chip to said conductor pattern, and removing said shorting bar by solder leaching while soldering leads to said pads.
Claim 3
Dependent Claim
17 words
A process according to claim 1, wherein said shorting bar or strip is applied by screen printing.
Claim 4
Dependent Claim
21 words
A process according to claim 2, wherein said shorting bar is a silver metallization and said solder is tin-lead-silver or tin-lead.