Platinum plating process

Claim 1

A METHOD OF PLATINUM FINISHING THE INSULATION-SEPARATED COMMUTATOR SEGMENTS OF AN ASSEMBLED ARMATURE WHICH METHOD MAY BE CONDUCTED AT ROOM TEMPERATURE, AND UTILIZES A PLATING SOLUTION FORMED AT ROOM TEMPERATURE BY DISSOLVING DECOMPOSABLE ALKALI METAL ACID SALT AND CHLOROPLATINIC ACID IN WATER, SAID METHOD COMPRISING THE STEPS OF SUCCESSIVELY SHORTING GROUPS OF THE COMMUTATOR SEGMENTS OF THE ARMATURE TO THE NEGATIVE SIDE OF A LOW VOLTAGE SUPPLY, WETTING AN ANODE CONNECTED TO THE POSITIVE SIDE OF SAID VOLTAGE SUPPLY WITH THE PLATING SOLUTION AND WIPING THE SHORTED COMMUTATOR SEGMENTS WITH THE WET ANODE UNTIL A FILM OF PLATINUM BUILDS UP OVER THE SURFACE OF THE SHORTED COMMUTATOR SEGMENTS, THE CHLOROPLATINIC ACID BEING SUFFICIENTLY DILUTED IN THE AQUEOUS PLATING SOLUTION THAT PLATINUM BUILD UP ON THE SHORTED SEGMENTS PROCEEDS ONLY SLOWLY AND PLATINUM ON THE INSULATION BETWEEN THE COMMUTATOR SEGMENTS REMAINS SPARSE, THE PROPORTION OF DECOMPOSABLE ALKALI METAL ACID SALT IN THE PLATING SOLUTION BEING SUFFICIENTLY LARGER THAN THE PROPORTION OF CHLOROPLATINIC ACID THEREIN TO MAINTAIN AN ALKALINITY LEVEL IN THE SOLUTION TO HOLD THE CHLOROPLATINIC ACID IN SUSPENSION WITH MINIMAL REPRODUCTION OF PLATINOUS OXIDE, AND THE DECOMPOSED ACID SALT OF THE DRIED RESIDUE OF THE PLATING SOLUTION WHICH REMAINS ON THE INSULATION BETWEEN THE PLATINUM PLATED SEGMENTS UPON EVAPORATION OF THE WATER INTERMIXING WITH AND ISOLATING THE PLATINUM CONTENT OF SAID RESIDUE SO AS TO AVOID SHORTING OF THE PLATINUM PLATED COMMUTATOR SEGMENTS ACROSS THE INSULATION THEREBETWEEN.

Claim 2

A METHOD OF PLATINUM FINISHING THE INSULATION-SEPARATED COMMUTATOR SEGMENTS OF AN ASSEMBLED ARMATURE WHICH METHOD MAY BE CONDUCTED AT ROOM TEMPERATURE, AND UTILIZES A PLATING SOLUTION FORMED AT ROOM TEMPERATURE BY DISSOLVING DECOMPOSABLE ALKALI METAL ACID SALT AND CHLOROPLATINIC ACID IN WATER, SAID METHOD COMPRISING THE STEPS OF SUCCESSIVELY SHORTING GROUPS OF THE COMMUTATOR SEGMENTS OF THE ARMATURE TO THE NEGATIVE SIDE OF A LOW VOLTAGE SUPPLY, WETTING AN ANODE CONNECTED TO THE POSITIVE SIDE OF SAID VOLTAGE SUPPLY WITH THE PLATING SOLUTION AND WIPING THE SHORTED COMMUTATOR SEGMENTS WITH THE WET ANODE UNTIL A FILM OF PLATINUM BUILDS UP OVER THE SURFACE OF THE SHORTED COMMUTATOR SEGMENTS, THE CHLOROPLATINIC ACID BEING SUFFICIENTLY DILUTED IN THE AQUEOUS PLATING SOLUTION THAT PLATINUM BUILD UP ON THE SHORTED SEGMENTS PROCEEDS ONLY SLOWLY AND PLATINUM ON THE INSULATION BETWEEN THE COMMUTATOR SEGMENTS REMAINS SPARSE, THE PROPORTION OF DECOMPOSABLE ALKALI METAL ACID SALT IN THE PLATING SOLUTION BEING SUFFICIENTLY LARGER THAN THE PROPORTION OF CHLOROPLATINIC ACID THEREIN TO MAINTAIN AN ALKALINITY LEVEL IN THE SOLUTION TO HOLD THE CHLOROPLATINIC ACID IN SUSPENSION WITH MINIMAL REPRODUCTION OF PLATINOUS OXIDE, AND THE DECOMPOSED ACID SALT OF THE DRIED RESIDUE OF THE PLATING SOLUTION WHICH REMAINS ON THE INSULATION BETWEEN THE PLATINUM PLATED SEGMENTS UPON EVAPORATION OF THE WATER INTERMIXING WITH AND ISOLATING THE PLATINUM CONTENT OF SAID RESIDUE SO AS TO AVOID SHORTING OF THE PLATINUM PLATED COMMUTATOR SEGMENTS ACROSS THE INSULATION THEREBETWEEN.