Process and composite leadless chip carriers with external connections

Claim 1

A process for the production of ceramic sets of devices such as chip carriers comprising pluralities, of at least about four, of conjunct small multilayer ceramic devices having exterior and interior electrical contacts comprising the steps of: 1. preparing a green ceramic base sheet and at least two green ceramic structural sheets, said base sheet being provided with at least one terminal for each of said ceramic devices and an electrically connecting network between at least all said terminals for each of said ceramic sets, and each structural sheet being provided with a. at least one hole having edge metallizing for each of said ceramic devices, and, b. at least one metallized pad area for each of said ceramic devices near said hole and further holes laterally adjacent to said pad area, each said pad area being connected to said edge metallizing, 2. erecting a multiplicity of connected multilayer green devices by successive lamination of said green ceramic structural sheets on said green ceramic base sheet in registry to one another so that edge metallizing of successive structural sheets is commonly connected, at least in the same set, to the electrically connecting network of said base sheet, 3. removing green ceramic material connecting said multilayer green devices and superfluous theretO while substantially retaining said edge metallizing and interconnections of green ceramic of said base sheet and at least the electrically connecting network for each said set whereby green sets comprising a plurality of electrically connected multilayer green ceramic devices connected by green ceramic are formed and, 4. firing said green sets to maturity whereby sets of ceramically and electrically connected conjunct small multilayer ceramic devices are obtained in which there is interconnection of all exposed metallic surfaces.