Led display
Abstract
Abstract LED displays with integrated logic are typically formed by bonding the LED devices and often the logic chips to large alumina or other ceramic substrates, lead frame substrates or other substrates. Typically the arrangement has a large area of uncovered substrate due to the large display area compared with the smaller chip size. Reflection of bright light from the substrate detracts from the contrast of the display. It has been found that photoresist materials conventionally in use turn black when heated to temperatures in excess of those recommended for post-baking (e.g., > 200* C). It is convenient to cover the inactive portion of the substrate with a patterned layer of photoresist (leaving windows for chip and circuit bonding) and then, through a heat treatment, which may already exist in the IC process, to blacken the photoresist layer. The photoresist layer forms a part of the finished device. Adhesion of the photoresist is surprisingly tenacious.
Inventors
- 👤 Bertrand Harold Johnson
Bibliographic Details
Claims Analysis
Total Claims: 11References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-01-13 | 1978-07-15 | 1979-01-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-01-13 | 1982-07-15 | 1983-01-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-01-13 | 1986-07-15 | 1987-01-14 | $7700.00 | Window Closed / Lapsed |