US3859182A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Coating printed circuit boards with tin or tin-lead alloy and tin-lead fluoborate plating baths
Assignee: Henley Group Inc
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Filing: 1973-01-04
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Granted: 1975-01-07
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Expires: 1993-01-04
Abstract
Abstract The plating bath of the invention is an aqueous plating bath comprising, per liter of bath, from about 150 to about 700 grams of bath of fluoboric acid; from about 2 to about 15 grams of a plate modifying additive, preferably an amino acid chain compound; from about 15 to about 82 grams of metal selected from stannous tin or a mixture of stannous tin and lead, which mixture contains at least 5 weight percent tin, and from about 0.01 to about 1 gram of beta-naphtol. An electrically conductive substrate is plated with tin or a tin-lead alloy by immersing the substrate in the above plating bath at a temperature between about 50* and 100* F. and applying sufficient negative voltage to the substrate relative to an anode within the bath to cause a current density at the substrate of between about 7 and about 35 amperes per square foot.
Inventors
- 👤 Mey John E Vander
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 12:12
CPC Classifications
C; C25; C25D; C25D3/00; C25D3/02; C25D3/30; C25D3/32; C25D3/56; C25D3/60; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3473; Y; Y10; Y10S; Y10S205/00; Y10S205/92
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
81 words
An acidic aqueous plating bath comprising the following component concentrations per liter of bath: from about 350 to about 450 grams of free fluoboric acid; from about 2 to about 15 grams of an amino acid chain compound; from about 0.01 to about 1 gram of beta-naphthol; and from about 15 to about 82 grams of metal, said metal being selected from stannous tin or a mixture of stannous tin and lead, said mixture containing at least 5 weight percent tin.
Claim 2
Dependent Claim
81 words
An acidic aqueous plating bath comprising the following component concentrations per liter of bath: from about 350 to about 450 grams of free fluoboric acid; from about 2 to about 15 grams of an amino acid chain compound; from about 0.01 to about 1 gram of beta-naphthol; and from about 15 to about 82 grams of metal, said metal being selected from stannous tin or a mixture of stannous tin and lead, said mixture containing at least 5 weight percent tin.
Claim 3
Dependent Claim
15 words
The plating bath according to claim 1 wherein said amino acid chain compound is peptone.
Claim 4
Dependent Claim
22 words
The plating bath according to claim 2 wherein said peptone is present in an amount between about 2 to about 7 grams.
Claim 5
Dependent Claim
22 words
The plating bath according to claim 2 wherein the beta-naphthol is present in an amount between about 0.05 and about 0.5 gram.
Claim 6
Dependent Claim
22 words
The plating bath according to claim 1 wherein said metal is present in an amount between about 30 and about 45 grams.
Claim 7
Dependent Claim
24 words
The plating bath according to claim 1 wherein there is additionally included boric acid in an amount from about 10 to about 36 grams.
Claim 8
Independent Claim
165 words
A METHOD FOR PLATING AN ELECTRICALLY CONDUCTIVE SUBSTRATE WITH TIN OR A TIN AND A LEAD ALLOY A PORTION OF WHICH SUBSTRATE DOES NOT FORM A PART OF THE PATH OF LEAST RESISTANCE TO CURRENT FLOW, COMPRISING: IMMERISING SAID SUBSTRATE IN AN ACIDIC AQUEOUS PLATING BATH AT A TEMPERATURE BETWEEN ABOUT 50* AND ABOUT 150*F; SAID PLATING BATH COMPRISING PER LITER OF BATH FROM ABOUT 350 TO ABOUT 450 GRAMS PER LITER OF FREE FLUOBORIC ACID; FROM ABOUT 2 TO ABOUT 15 GRAMS PER LITER OF AN AMINO ACID CHAIN COMPOUND; FROM ABOUT 15 TO ABOUT 82 GRAMS PER LITER OF METAL, SAID METAL BEING SELETED FROM TIN AND A MIXTURE OF STANNOUS TIN AND LEAD, SAID MIXTURE CONTAINING AT LEAST 5 WEIGHT PERCENT TIN; AND FROM ABOUT 0.01 TO ABOUT 1 APPLYING SUFFICIENT NEGATIVE VOLTAGE TO SAID SUBSTRATE RELATIVE TO AN ANODE WITHIN SAID BATH TO CAUSE A CURRENT DENSITY AT SAID SUBSTRATE OF BETWEEN ABOUT 7 AND ABOUT 35 AMPERES PER SQUARE FOOT.
Claim 9
Independent Claim
165 words
A METHOD FOR PLATING AN ELECTRICALLY CONDUCTIVE SUBSTRATE WITH TIN OR A TIN AND A LEAD ALLOY A PORTION OF WHICH SUBSTRATE DOES NOT FORM A PART OF THE PATH OF LEAST RESISTANCE TO CURRENT FLOW, COMPRISING: IMMERISING SAID SUBSTRATE IN AN ACIDIC AQUEOUS PLATING BATH AT A TEMPERATURE BETWEEN ABOUT 50* AND ABOUT 150*F; SAID PLATING BATH COMPRISING PER LITER OF BATH FROM ABOUT 350 TO ABOUT 450 GRAMS PER LITER OF FREE FLUOBORIC ACID; FROM ABOUT 2 TO ABOUT 15 GRAMS PER LITER OF AN AMINO ACID CHAIN COMPOUND; FROM ABOUT 15 TO ABOUT 82 GRAMS PER LITER OF METAL, SAID METAL BEING SELETED FROM TIN AND A MIXTURE OF STANNOUS TIN AND LEAD, SAID MIXTURE CONTAINING AT LEAST 5 WEIGHT PERCENT TIN; AND FROM ABOUT 0.01 TO ABOUT 1 APPLYING SUFFICIENT NEGATIVE VOLTAGE TO SAID SUBSTRATE RELATIVE TO AN ANODE WITHIN SAID BATH TO CAUSE A CURRENT DENSITY AT SAID SUBSTRATE OF BETWEEN ABOUT 7 AND ABOUT 35 AMPERES PER SQUARE FOOT.
Claim 10
Dependent Claim
14 words
The method according to claim 7 wherein said amino acid chain compound is peptone.
Claim 11
Dependent Claim
19 words
The method according to claim 8 wherein said voltage is applied for from about 1 to about 45 minutes.
Claim 12
Dependent Claim
23 words
The method according to claim 9 wherein said metal is present in an amount between about 30 grams and 45 grams per liter.
Claim 13
Dependent Claim
21 words
The method according to claim 10 wherein the beta-naphthol is present in amount of from about 0.05 to about 0.5 gram.
Claim 14
Dependent Claim
23 words
The method according to claim 11 wherein from about 2 to about 7 grams of peptone per liter of plating bath are present.
Claim 15
Dependent Claim
21 words
The method according to claim 12 wherein the current density is from about 15 to about 35 amperes per square foot.
Claim 16
Dependent Claim
19 words
The method according to claim 13 wherein said voltage is applied for from about 1 to about 30 minutes.
Claim 17
Dependent Claim
28 words
THE METHOD ACCORDING TO CLAIM 7 WHEREIN SAID ELECTRICALLY CONDUCTIVE SUBSTRATE COMPRISES AT LEAST ONE ELECTRICALLY CONDUCTIVE SURFACE WHICH DEFINES A HOLE THROUGH AN ELECTRICAL PRINTED CIRCUIT BOARD.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-01-06 | 1978-07-08 | 1979-01-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-01-06 | 1982-07-08 | 1983-01-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-01-06 | 1986-07-08 | 1987-01-07 | $7700.00 | Window Closed / Lapsed |