US3857290A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Solderability testing
Assignee: Honeywell Information Systems Ltd
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Filing: 1973-11-30
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Granted: 1974-12-31
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Expires: 1993-11-30
Abstract
Abstract The solderability of plated through holes in a printed circuit board is treated by applying solder to one end of the hole and measuring the time it takes to travel through the hole. This time is a measure of solderability - the shorter the time, the better the solderability. Apparatus for carrying out the method comprises a work platform 11 for holding the board 20; a probe 22 for centering a hole in the board and then forming a contact at the end of the hole, level with the upper surface of the board; a solder supply system 15 for applying solder to the bottom end of the hole; and a timer 40 for electrically measuring the time taken for solder to pass through the hole.
Inventors
- 👤 J Aitken
- 👤 B Green
- 👤 W Cormie
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 07:53
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; H05K1/00; H05K1/02; H05K1/0266; H05K1/0268; G; G01; G01N; G01N13/00; G01N13/02; G01N2013/0225; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09781; H05K2203/00; H05K2203/04; H05K2203/046; H05K2203/16; H05K2203/162; H05K3/40; H05K3/42; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49004
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
42 words
A method of testing the solderability of a through plated hole in a printed circuit board comprising applying solder to one end of the hole and measuring the time taken for the solder to travel through the hole to the other end.
Claim 2
Independent Claim
42 words
A method of testing the solderability of a through plated hole in a printed circuit board comprising applying solder to one end of the hole and measuring the time taken for the solder to travel through the hole to the other end.
Claim 3
Dependent Claim
28 words
A method according to claim 1, wherein the solder is forced out of the hole after the time for it to travel through the hole has been measured.
Claim 4
Dependent Claim
93 words
Apparatus for carrying out the method according to claim 1 comprising: a work platform for holding the printed circuit board, a probe for placement with its tip in the axis of the hole and level with the upper surface of the board, a solder supply system mounted below the platform having a solder tip at its top and raisable to bring the solder tip into contact with the board, and an electric timer with connections to the solder supply system, a contact adjacent to the lower end of the hole, and the probe.
Claim 5
Dependent Claim
28 words
Apparatus according to claim 3 wherein the timer signals an unsolderable hole if the time taken for the solder to rise through the hole exceeds a predetermined period.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-12-30 | 1978-07-01 | 1978-12-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-12-30 | 1982-07-01 | 1982-12-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-12-30 | 1986-07-01 | 1986-12-31 | $7700.00 | Window Closed / Lapsed |