Patent US3317363A successfully refreshed from Google Patents.
US3851758A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor chip fixture
Assignee: International Business Machines Corp
•
Filing: 1972-04-26
•
Granted: 1974-12-03
•
Expires: 1992-04-26
Abstract
Abstract Disclosed is a method and apparatus for separating discrete chips of a diced semiconductor wafer without disturbing the orientation of the chips, the chips being bonded to a support or substrate from which they must be separated prior to use. The substrate is first positioned in a fixture so that the diced wafer assumes a predetermined orientation, and then a resilient foraminous pad is pressed against the chips, and a bond releasing fluid is urged, by a novel pump, through the pad until the chips are released from their support, the thickness of the removed bond being compensated for by expansion of the pad. Also disclosed is a fixture which acts as a convenient storage tray for the chips in their original orientation.
Inventors
- 👤 M Makhijani
- 👤 F Scacciaferro
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 08:50
CPC Classifications
H; H10; H10P; H10P52/00; Y; Y10; Y10S; Y10S156/00; Y10S156/934; Y10S156/941; Y10S156/942; Y10T; Y10T156/00; Y10T156/19; Y10T156/1978; Y10T29/00; Y10T29/49; Y10T29/49789; Y10T29/49792; Y10T29/53; Y10T29/5313; Y10T29/53265
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
111 words
A fixture for storing a plurality of semiconductor chips in adjacent, side by side relationship, each of said chips including a kerf at least intermediate adjacent chips; said fixture comprising a first cover member, a second cover member, a resilient pad in said second cover member, and a first group of apertures in said pad and second cover and dimensioned for alignment with individual ones of said chips to permit subjecting said chips to a vacuum through said pad and cover, and a second group of apertures dimensioned for alignment with the kerfs of said chips, and means to hold said covers together while compressing said resilient pad against said chips.
Claim 2
Dependent Claim
111 words
A fixture for storing a plurality of semiconductor chips in adjacent, side by side relationship, each of said chips including a kerf at least intermediate adjacent chips; said fixture comprising a first cover member, a second cover member, a resilient pad in said second cover member, and a first group of apertures in said pad and second cover and dimensioned for alignment with individual ones of said chips to permit subjecting said chips to a vacuum through said pad and cover, and a second group of apertures dimensioned for alignment with the kerfs of said chips, and means to hold said covers together while compressing said resilient pad against said chips.
Claim 3
Dependent Claim
32 words
A fixture in accordance with claim 1 including a second group of apertures in said pad and said second cover member intermediate said projections for alignment with the kerfs of said chips.
Claim 4
Dependent Claim
104 words
A fixture for storing a plurality of semiconductor chips in adjacent, side by side relationship, each of said chips including a kerf at least intermediate adjacent chips; said fixture comprising a first cover member, a second cover member, a resilient pad in said second cover member, said pad including a plurality of tubular projections having terminal ends adapted for engaging individual ones of said chips, and a first group of apertures extending through said second cover member and said projections to permit subjecting said chips to a vacuum therethrough; and means to hold said covers together while compressing said resilient pad against said chips.
Claim 5
Dependent Claim
104 words
A fixture for storing a plurality of semiconductor chips in adjacent, side by side relationship, each of said chips including a kerf at least intermediate adjacent chips; said fixture comprising a first cover member, a second cover member, a resilient pad in said second cover member, said pad including a plurality of tubular projections having terminal ends adapted for engaging individual ones of said chips, and a first group of apertures extending through said second cover member and said projections to permit subjecting said chips to a vacuum therethrough; and means to hold said covers together while compressing said resilient pad against said chips.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-12-02 | 1978-06-03 | 1978-12-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-12-02 | 1982-06-03 | 1982-12-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-12-02 | 1986-06-03 | 1986-12-03 | $7700.00 | Window Closed / Lapsed |